Patents by Inventor Richard B. Salmonson

Richard B. Salmonson has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 9229497
    Abstract: A high performance computing system includes one or more blade enclosures having a cooling manifold and configured to hold a plurality of computing blades, and a plurality of computing blades in each blade enclosure with at least one computing blade including two computing boards. The system further includes two or more cooling plates with each cooling plate between two corresponding computing boards within the computing blade, and a fluid connection coupled to the cooling plate(s) and in fluid communication with the fluid cooling manifold.
    Type: Grant
    Filed: June 28, 2013
    Date of Patent: January 5, 2016
    Assignee: Silicon Graphics International Corp.
    Inventors: Steven J. Dean, Richard B. Salmonson, Russell E. Stacy, Roger Ramseier, Mark Maloney
  • Publication number: 20140126141
    Abstract: A high performance computing system includes one or more blade enclosures having a cooling manifold and configured to hold a plurality of computing blades, and a plurality of computing blades in each blade enclosure with at least one computing blade including two computing boards. The system further includes two or more cooling plates with each cooling plate between two corresponding computing boards within the computing blade, and a fluid connection coupled to the cooling plate(s) and in fluid communication with the fluid cooling manifold.
    Type: Application
    Filed: June 28, 2013
    Publication date: May 8, 2014
    Applicant: Silicon Graphics International Corp.
    Inventors: Steven J. Dean, Richard B. Salmonson, Russell E. Stacy, Roger Ramseier, Mark Maloney
  • Patent number: 6831834
    Abstract: The present invention includes one embodiment of a printed circuit board assembly including a printed circuit board, a microprocessor chip, a socket and an actuator for connecting the chip to the printed circuit board, a heat sink for attachment to the top surface of the chip, and a field installable thermal interface phase change pad positioned between the heat sink and the microprocessor chip. The heat sink has an actuator access opening so that the actuator is operable with the heat sink positioned on top of the microprocessor. The connection between the chip and the heat sink is free of alignment features so that they may be separated by twisting the heat sink relative to the chip. The connection between the heat sink and the circuit board is also free of alignment features.
    Type: Grant
    Filed: July 20, 2000
    Date of Patent: December 14, 2004
    Assignee: Silicon Graphics, Inc.
    Inventor: Richard B. Salmonson
  • Patent number: 6483699
    Abstract: An air cooled computer assembly including a printed circuit board assembly or a U sized enclosure. The computer assembly also includes three 120 mm fans positioned at one end of the PCB assembly providing air flow across the PCB assembly. The printed circuit board assembly has a top side and a bottom side, including heat producing components on the top side and bottom side. A portion of the heat producing components are DIMM memory positioned perpendicular to the direction of air flow. The computer assembly also includes an air baffling system positioned proximate to the PCB assembly. The air baffling system divides and balances the air flow between the heat producing components so that each of the components are adequately cooled. The air baffling system includes a flat baffle and pair of curved baffles. The flat baffle is positioned perpendicular to the direction of the air flow and is positioned between and in front of two 40 watt memory. The curved baffles are positioned adjacent to the two memory ASICs.
    Type: Grant
    Filed: July 20, 2000
    Date of Patent: November 19, 2002
    Assignee: Silicon Graphics, Inc.
    Inventors: Richard B. Salmonson, David Paul Gruber, Stephen A. Bowen
  • Patent number: 6434007
    Abstract: A heat sink assembly for securing a heat sink to a chip on a circuit board using a clip to secure the heat sink to the chip. The assembly includes a pair of support beams, a clip attached to the pair of support beams, and a heat sink. Optionally, the assembly also includes a plurality of bias members biased between the heat sink and the circuit board and a pair of positioning pins positioned between the heat sink and the circuit board. The clip is biased between the heat sink and the pair of support beams. The clip has a plate having a first end and a second end with the first end having an aperture for fastening the first end to a first support beam and the second end having a hook for fastening the second end to a second support beam. Optionally, the clip is made of spring steel and provides a downward biasing force of between about 3 psi and about 25 psi and preferably about 10 psi.
    Type: Grant
    Filed: July 20, 2000
    Date of Patent: August 13, 2002
    Assignee: Silicon Graphics, Inc.
    Inventors: Richard B. Salmonson, David Paul Gruber
  • Patent number: 6305463
    Abstract: A cold plate that provides air or liquid cooling for a computer circuit module and has at least one mounting plate with a board mounting surface on one side for carrying a printed circuit board assembly and a cooling surface located on the other side. A cover is disposed parallel to and spaced apart from the mounting plate with a cooling chamber defined between the two. The cooling chamber is divided into a liquid cooled section and an air cooled section. The liquid cooled section has a coolant inlet and outlet and flow channels for directing coolant through the liquid cooled section from inlet to outlet. The air cooled section has an air inlet and outlet and flow channels for directing air through the air cooled section from inlet to outlet. The cold plate is adapted so that it may be installed into a circuit module and provide either liquid cooling or air cooling for the module.
    Type: Grant
    Filed: February 22, 1996
    Date of Patent: October 23, 2001
    Assignee: Silicon Graphics, Inc.
    Inventor: Richard B. Salmonson
  • Patent number: 5963428
    Abstract: The present invention discloses a method and apparatus for bridging the gap between an integrated circuit package or component mounted on a circuit board and a heat sink such that there is little stress placed on the component, but there is still a connection between the component and the heat sink for dissipation of heat. The invention provides mechanical integrity for delicate component packages, and in doing so allows for the use of a variety of heat sinks to provide cooling. A printed circuit board has integrated circuit packages or other components mounted to the circuit board. A cooling cap comprised of a thermally conductive material is mounted on the circuit board, such that the component is enveloped by the circuit board and cooling cap. A layer of thermally conductive material may be deposited between the component and the cooling cap to provide a thermally conductive path from the component to the cooling cap.
    Type: Grant
    Filed: August 20, 1998
    Date of Patent: October 5, 1999
    Assignee: Cray Research, Inc.
    Inventors: Richard B. Salmonson, Stephen Cermak, III
  • Patent number: 5805418
    Abstract: The present invention discloses a method and apparatus for bridging the gap between an integrated circuit package or component mounted on a circuit board and a heat sink such that there is little stress placed on the component, but there is still a connection between the component and the heat sink for dissipation of heat. The invention provides mechanical integrity for delicate component packages, and in doing so allows for the use of a variety of heat sinks to provide cooling. A printed circuit board has integrated circuit packages or other components mounted to the circuit board. A cooling cap comprised of a thermally conductive material is mounted on the circuit board, such that the component is enveloped by the circuit board and cooling cap. A layer of thermally conductive material may be deposited between the component and the cooling cap to provide a thermally conductive path from the component to the cooling cap.
    Type: Grant
    Filed: February 22, 1996
    Date of Patent: September 8, 1998
    Assignee: Cray Research, Inc.
    Inventors: Richard B. Salmonson, Stephen Cermak, III
  • Patent number: 5801924
    Abstract: A method and apparatus for conductively cooling daughter card assemblies mounted to either an air or liquid cooled computer circuit module wherein the module has a cold plate and at least one mother board adjacent the cold plate. The module carries a number of daughter assemblies thereon adjacent the mother board. Each daughter card assembly has at least one daughter board which carries a number of electronic components on an element side of the board. A cooling side is disposed opposite the element side on the board. A thermally conductive plate has an inner side facing the mother board and an outer side opposite the inner side. The inner side has one or more projecting members extending perpendicularly towards the mother board. The daughter board is parallel to and in conductive contact with one side of the conductive plate. The module cold plate has a number of upstanding spacers projecting toward the mother board.
    Type: Grant
    Filed: February 22, 1996
    Date of Patent: September 1, 1998
    Assignee: Cray Research, Inc.
    Inventor: Richard B. Salmonson
  • Patent number: 5768104
    Abstract: A method and apparatus for cooling high power integrated circuits mounted on a printed circuit board. The invention includes producing a cold plate adapted to receive the printed circuit board thereon. A series of thermal shims are produced in incremental varying thicknesses from a thermally conductive material. A gap between each integrated circuit and the cold plate is determined that would result when the plate and board are assembled. One of the thermal shims is selected for each gap, the thickness of each selected shim being dependent upon the gap for which it is selected. The shim is placed between the cold plate and the integrated circuit so that when the module is assembled, the gap is eliminated and a thermal conductive path between the cold plate and each circuit is created.
    Type: Grant
    Filed: February 22, 1996
    Date of Patent: June 16, 1998
    Assignee: Cray Research, Inc.
    Inventors: Richard B. Salmonson, Daniel John Dravis
  • Patent number: 5761043
    Abstract: A daughter card assembly which provides relatively high conductive heat transfer from the electronic components on the daughter board to either an air or liquid cooled cold plate of a computer circuit module. The daughter card assembly has a daughter board with a plurality of electronic elements carried on an element side of the board. The opposite side of the board is a cooling side. The daughter board has one or more sockets which are electrically connected to the electronic elements on the board. The socket is adapted to plug into a connector carried on a mother board of a circuit module. A thermally conductive plate is disposed adjacent to and in thermal conductive contact with the cooling side of the daughter board. The conductive plate has an inner side facing the circuit module and an outer side on the opposite side. The plate is adapted to be in thermal conductive contact with the module cold plate to dissipate heat generated by the memory elements.
    Type: Grant
    Filed: February 22, 1996
    Date of Patent: June 2, 1998
    Assignee: Cray Research, Inc.
    Inventor: Richard B. Salmonson
  • Patent number: 5726857
    Abstract: An apparatus and method for mounting an edge connector assembly within a circuit module. Connector mounting rails are attached to the sides of a printed circuit board and the circuit board is then joined with a cold plate in order to form a circuit module. The mounting rail is an elongate strip of a substantially rigid material for attachment to the circuit board along one of its edges. The strip has an upper planar surface and inner and outer sides. The inner side is for attaching the strip to the edge of the circuit board. The outer side extends beyond the edge of the circuit board and is adapted to carry thereon a female block of the edge connector assembly. The strip also has a plurality of primary mounting openings formed in a predetermined pattern through the outer side of the strip for attaching the circuit board to a circuit module.
    Type: Grant
    Filed: February 22, 1996
    Date of Patent: March 10, 1998
    Assignee: Cray Research, Inc.
    Inventors: Richard B. Salmonson, Stephen A. Bowen
  • Patent number: 5694028
    Abstract: A method and apparatus for adjusting power supplied to a device when the device has a first and a second power input. A first voltage level and a ground potential are provided and a second voltage level is created as a function of the first voltage level. The second voltage level is then buffered with a power transistor and, if the second voltage level is needed for a particular device, the buffered second voltage level is selectively applied to the device. The circuit is disabled when the second voltage supply is not needed.
    Type: Grant
    Filed: May 20, 1996
    Date of Patent: December 2, 1997
    Assignee: Cray Research, Inc.
    Inventors: Richard B. Salmonson, Robert J. Greener, Mark Ronald Sikkink, Robert J. Lutz, Max C. Logan, Richard G. Finstad
  • Patent number: 4897764
    Abstract: A metal heat spreading cup, hereinafter referred to as a "conductive cup module" ("CCM"), is utilized as part of the interface between at least one semiconductor being cooled and a pedestal, sometimes referred to as a "boss", coupled to a cooling medium. The semiconductor being cooled is, according to one embodiment of the invention, bonded to the underside of the cup. Furthermore, according to the invention, the pedestal is inserted into the cup and is bonded thereto by use of a deformable thermal conductive compound, (such as a thermal paste or grease) also inserted into and contained within the cup. The compound spreads upon being displaced by the inserted pedestal. The compound remains deformable during operation of the cooling system.
    Type: Grant
    Filed: October 31, 1988
    Date of Patent: January 30, 1990
    Assignee: Control Data Corporation
    Inventors: Richard A. Bruchmann, Richard B. Salmonson