Patents by Inventor Richard C. Landis

Richard C. Landis has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 5584980
    Abstract: Disclosed is an electrokinetic soil decontamination method using closely spaced like electrode assemblies, special panel electrode configurations, an electrode emplacement process which leaves the soil in-situ, and a purge fluid conditioning and circulation process that results in reduced costs for soil decontamination. Panel electrode assemblies, tubular electrode assemblies and treatment panel assemblies are also disclosed.
    Type: Grant
    Filed: December 5, 1994
    Date of Patent: December 17, 1996
    Assignee: E. I. Du Pont de Nemours and Company
    Inventors: Ronald J. Griffith, Richard C. Landis, Dale S. Schultz, Stephen H. Shoemaker
  • Patent number: 5034349
    Abstract: A direct device-to-connector interconnection includes a plurality of conductive strips affixed to a support member, each strip being cooperatively sized and aligned to establish a direct fanned out connection between a bonding pad and an external connector.
    Type: Grant
    Filed: July 26, 1989
    Date of Patent: July 23, 1991
    Assignee: ITT Corporation
    Inventor: Richard C. Landis
  • Patent number: 4866504
    Abstract: A direct device-to-connector interconnection includes a plurality of conductive strips affixed to a support member, each strip being cooperatively sized and aligned to establish a direct fanned out connection between a bonding pad and an external connector.
    Type: Grant
    Filed: May 24, 1988
    Date of Patent: September 12, 1989
    Assignee: ITT Corporation
    Inventor: Richard C. Landis
  • Patent number: 4816967
    Abstract: A method and structure are disclosed for mounting and connecting an electic device such as an integrated circuit to a circuit board. The board has a plurality of embedded shielded conductors for interconnecting the integrated circuit to other devices on the board. In order to limit the capacitance and inductance of the connection, the integrated circuit is mass bonded directly to the conductors and to their coaxial shields.
    Type: Grant
    Filed: October 28, 1987
    Date of Patent: March 28, 1989
    Assignee: ITT Gallium Arsenide Technology Center A Division of ITT Corporation
    Inventor: Richard C. Landis
  • Patent number: 4751564
    Abstract: A multiple wafer scale assembly apparatus includes first and second wafer scale assemblies connected to termination pins in such a fashion that the completed assembly is operatively self contained.
    Type: Grant
    Filed: May 5, 1986
    Date of Patent: June 14, 1988
    Assignee: ITT Corporation
    Inventor: Richard C. Landis
  • Patent number: 4739446
    Abstract: A header for a wafer scale assembly includes a plurality of pins having end portions connectable to the wafer scale assembly. The end portions lie in a single plane that it substantially parallel to the plane of the wafer scale assembly.
    Type: Grant
    Filed: May 5, 1986
    Date of Patent: April 19, 1988
    Assignee: ITT Defense Communications, a division of ITT Corporation
    Inventor: Richard C. Landis
  • Patent number: 4729510
    Abstract: A substrate is disclosed with a shielded delay line imbedded therein to obtain a delay of a preselected duration. The delay line comprises a conductor formed in the shape of a helical coil to reduce its overall dimension. The substrate is formed by superimposing a plurality of layers of conductive and/or dielectric material to form a preselected profile.
    Type: Grant
    Filed: November 14, 1984
    Date of Patent: March 8, 1988
    Assignee: ITT Corporation
    Inventor: Richard C. Landis
  • Patent number: 4717988
    Abstract: A universal wafer scale assembly substrate includes an orthogonal multilayer matrix of conductive paths that, inter alia, define a plurality of chip sites. The paths defining the chip sites are provided with termination pads at the ends thereof proximate the site.
    Type: Grant
    Filed: May 5, 1986
    Date of Patent: January 5, 1988
    Assignee: ITT Defense Communications Division of ITT Corporation
    Inventor: Richard C. Landis
  • Patent number: 4709300
    Abstract: A jumper for interconnecting a plurality of wafer scale assemblies includes pair of grooves proximate the bending points thereof to relieve stresses introduced by bending forces.
    Type: Grant
    Filed: May 5, 1986
    Date of Patent: November 24, 1987
    Assignee: ITT Gallium Arsenide Technology Center, a division of ITT Corporation
    Inventor: Richard C. Landis
  • Patent number: 4673904
    Abstract: A support board or substrate is disclosed for interconnecting various electronic components. One or more conductors are imbedded within the substrate for interconnecting the components. Each conductor is provided with shielding to permit the exchange of high frequency signals between the components without cross-coupled interference.
    Type: Grant
    Filed: November 14, 1984
    Date of Patent: June 16, 1987
    Assignee: ITT Corporation
    Inventor: Richard C. Landis
  • Patent number: 4647882
    Abstract: A miniature microwave guide is provided in a substrate made of successive superimposed layers of conductive and/or dielectric materials. Probes are provided at the extreme ends of the guide for injecting and extracting signals.
    Type: Grant
    Filed: November 14, 1984
    Date of Patent: March 3, 1987
    Assignee: ITT Corporation
    Inventor: Richard C. Landis
  • Patent number: 4647878
    Abstract: A substrate for mounting electronic devices is provided with a capacitive coupler as an interconnecting means. The coupler comprises two partially co-extensive conductors surrounded by a shield. The substrate is made from a plurality of superimposed layers, each layer consisting of a dielectric, or a conductive material, or strips of conductive material separated by the dielectric to form a preselected profile.
    Type: Grant
    Filed: November 14, 1984
    Date of Patent: March 3, 1987
    Assignee: ITT Corporation
    Inventors: Richard C. Landis, Edward L. Griffin, Inder G. Bahl