Patents by Inventor Richard G. Murphy

Richard G. Murphy has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 6510056
    Abstract: The present invention is directed to a shelf for housing PCPs. A backplane extends across the shelf. A connector module having the OAM&P connectors is electrically connected to the backplane and has two positions. In one position it extends sideways from the shelf with the connectors in a front to rear direction. In the second position, the OAM&P connector module is substantially flush with the side of the shelf.
    Type: Grant
    Filed: September 28, 2000
    Date of Patent: January 21, 2003
    Assignee: Nortel Networks Limited
    Inventors: Richard G. Kusyk, Richard G. Murphy, Bruce Irwin Dolan, Craig Donald Suitor
  • Patent number: 6336814
    Abstract: A shelf for housing printed circuit packs in which a backplane has a connector along its top or bottom edge. Connector modules are connected to the backplane by vertical attachment to the backplane edge connector such that the connector modules are located above or below the backplane. The connector modules may be oriented either to be front facing or rear facing. The backplane connector is adapted to accept modules of varying widths and having different connectors thereon.
    Type: Grant
    Filed: June 29, 2000
    Date of Patent: January 8, 2002
    Assignee: Nortel Networks Limited
    Inventors: Richard G. Kusyk, Richard G. Murphy, Bruce Irwin Dolan, Craig Donald Suitor
  • Patent number: 5769644
    Abstract: A shelf for housing printed circuit boards in which a back plane has an extension in the form of a back plane extender printed circuit board electrically connected to the back plane and extending forwards from the back plane at one side of the shelf. In a location forwardly of the back plane, the extender printed circuit board carries a connector structure which extends outwards from the extender printed circuit board and has connectors outwards from the extender printed circuit board. These connectors are accessible either from the front or rear of the shelf dependent upon connector orientation. This structure avoids the need for connectors on the rear face of the back plane thus allowing for the back plane to be located further to the rear and permitting increase in size in circuit boards to be mounted within the shelf. The connector structure is preferably detachable so as to permit its replacement with a different design of connector structure.
    Type: Grant
    Filed: September 6, 1996
    Date of Patent: June 23, 1998
    Assignee: Northern Telecom Limited
    Inventors: Richard G. Murphy, Bruce I. Dolan
  • Patent number: 5517385
    Abstract: A capacitor structure is described as having a plurality of dielectric materials located so that each dielectric material is in parallel between capacitor plates. The capacitor value of this structure is preset, therefore, for operation electrically at different specific temperatures. The description gives a specific stacked arrangement for the various dielectric materials in which this capacitor can be formed, as one example of that to which it is adaptable.
    Type: Grant
    Filed: July 20, 1994
    Date of Patent: May 14, 1996
    Assignee: International Business Machines Corporation
    Inventors: John Galvagni, Richard G. Murphy, George J. Saxenmeyer
  • Patent number: 5420520
    Abstract: A method of testing semi-conductor chips is disclosed. The individual semiconductor chips have I/O, power, and ground contacts. In the method of the invention a chip test fixture system is provided. The chip test fixture system has contacts corresponding to the contacts on the semiconductor chip. The carrier contacts have dendritic surfaces. The chip contacts are brought into electrically conductive contact with the conductor pads on the chip test fixture system. Test signal input vectors are applied to the inputs of the semiconductor chip, and output signal vectors are recovered from the semiconductor chip. After testing the chip is removed from the substrate.
    Type: Grant
    Filed: June 11, 1993
    Date of Patent: May 30, 1995
    Assignee: International Business Machines Corporation
    Inventors: Morris Anschel, Anthony P. Ingraham, Charles R. Lamb, Michael D. Lowell, Voya R. Markovich, Wolfgang Mayr, Richard G. Murphy, Mark V. Pierson, Tamar A. Powers, Timothy S. Reny, Scott D. Reynolds, Bahgat G. Sammakia, Wayne R. Storr