Patents by Inventor Richard K. Williams

Richard K. Williams has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11006488
    Abstract: A phototherapy or photobiomodulation process employing the application of electromagnetic radiation (EMR) to a living organism, typically a human being. The EMR is generated by one or more strings of LEDs and is programmed to emit one or more wavelengths, typically in the visible and infrared portions of the spectrum, the EMR in each wavelength being delivered in pulses having specified on-times, off-times, photoexcitation frequencies, duty factors, phase delays, and power amplitudes. A system for providing such EMR includes a microcontroller having a pattern library of algorithms, each of which defines a particular sequence of synthesized pulses, and an application pad, preferably flexible, containing the LED strings.
    Type: Grant
    Filed: December 28, 2017
    Date of Patent: May 11, 2021
    Assignee: Applied BioPhotonics Ltd.
    Inventor: Richard K. Williams
  • Publication number: 20210014939
    Abstract: A variety of techniques for concealing the content of a communication between a client device, such as a cell phone or laptop, and a network or cloud of media nodes are disclosed. Among the techniques are routing data packets in the communication to different gateway nodes in the cloud, sending the packets over different physical media, such as an Ethernet cable or WiFi channel, and disguising the packets by giving them different source addressees. Also disclosed are a technique for muting certain participants in a conference call and a highly secure method of storing data files.
    Type: Application
    Filed: September 10, 2020
    Publication date: January 14, 2021
    Inventors: Ievgen Verzun, Oleksandr Holub, Richard K. Williams
  • Publication number: 20200273838
    Abstract: A variety of footed and leadless semiconductor packages, with either exposed or isolated die pads, are described. Some of the packages have leads with highly coplanar feet that protrude from a plastic body, facilitating mounting the packages on printed circuit boards using wave-soldering techniques.
    Type: Application
    Filed: April 6, 2020
    Publication date: August 27, 2020
    Inventors: Richard K. Williams, Keng Hung Lin
  • Patent number: 10615146
    Abstract: A variety of footed and leadless semiconductor packages, with either exposed or isolated die pads, are described. Some of the packages have leads with highly coplanar feet that protrude from a plastic body, facilitating mounting the packages on printed circuit boards using wave-soldering techniques.
    Type: Grant
    Filed: July 21, 2018
    Date of Patent: April 7, 2020
    Assignee: Adventive IPBank
    Inventors: Richard K. Williams, Keng-Hung Lin
  • Publication number: 20190386969
    Abstract: Software installed in the nodes in a communication network allows them to perform a “name server” function, which entails the management of a dynamic list of the client devices that are connected to the cloud, a “task” function, which entails the receipt and transmission of the packets, and an “authority” function, which entails the determination of the routes of the packets through the cloud. Each node is capable of performing only one function at a time. After completing a job, a node reverts to an undifferentiated, state awaiting its next performance request.
    Type: Application
    Filed: July 10, 2019
    Publication date: December 19, 2019
    Inventors: Ievgen Verzun, Richard K. Williams
  • Publication number: 20190373687
    Abstract: The LEDs in a phototherapy LED pad are controlled so that the intensity of the light varies in accordance with a sinusoidal function, thereby eliminating the harmonics that are generated when the LEDs are pulsed digitally. This is accomplished analogically by using a sinusoidal wave to control the gate of a MOSFET connected in series with the LEDs or by using a digital-to-analog converter to control the gate of the MOSFET with a stair step function representative of the values of a sinusoidal function at predetermined intervals. Alternatively, pulse-width modulation is used to control the gate of the MOSFET in such a way that the average current through the LEDs simulates a sinusoidal function. In additional to using a simple sine wave function, the LED current may also be controlled in accordance with “chords” containing multiple sine waves of different frequencies.
    Type: Application
    Filed: June 20, 2019
    Publication date: December 5, 2019
    Applicant: Applied BioPhotonics Ltd.
    Inventors: Richard K. Williams, Keng Hung Lin, Daniel Schell, Joseph P. Leahy
  • Patent number: 10491575
    Abstract: In a secure cloud for transmitting packets of digital data, the packets may be repeatedly scrambled (i.e., their data segments reordered) and then unscrambled, split and then mixed, and/or encrypted and then decrypted as they pass through media nodes in the cloud. The methods used to scramble, split, mix and encrypt the packets may be varied in accordance with a state such as time, thereby making the task of a hacker virtually impossible inasmuch as he or she may be viewing only a fragment of a packet and the methods used to disguise the data are constantly changing.
    Type: Grant
    Filed: April 6, 2018
    Date of Patent: November 26, 2019
    Assignee: LISTAT LTD.
    Inventors: Ievgen Verzun, Oleksandr Holub, Richard K. Williams
  • Publication number: 20190335551
    Abstract: In a photobiomodulation therapy (PBT) process, defined patterns (e.g., sequences of square-wave pulses, sine waves, or combinations thereof) of electromagnetic radiation (EMR) having one or more wavelengths, or spectral bands of wavelengths, are introduced into a living organism (e.g. a human being or animal) using a distributed system comprising two or more distributed components or “nodes” communicating using a bus or transceiver to send instructions or files between or among the constituent components. The distributed PBT system prevents intentional usurpation of system control (hacking), thwarts unauthorized monitoring of data (surveillance), and reduces the likelihood and severity of accidental system malfunction arising from corrupted command and control packets or ambient EMI.
    Type: Application
    Filed: April 6, 2019
    Publication date: October 31, 2019
    Inventors: Richard K. Williams, Keng-Hung Lin, Laura E. Williams
  • Publication number: 20190246463
    Abstract: A phototherapy system includes a channel driver, a first microcontroller and a pad comprising a string of light-emitting diodes (LEDs). The pad also comprises a second microcontroller that autonomously controls the string of LEDs such that the LEDs are controlled even if communication between the first microcontroller and the pad is interrupted.
    Type: Application
    Filed: April 6, 2019
    Publication date: August 8, 2019
    Inventors: Richard K. Williams, Keng-Hung Lin, Laura E. Williams
  • Patent number: 10328276
    Abstract: The LEDs in a phototherapy LED pad are controlled so that the intensity of the light varies in accordance with a sinusoidal function, thereby eliminating the harmonics that are generated when the LEDs are pulsed digitally, in accordance with a square-wave function. This is accomplished analogically by using a sinusoidal wave to control the gate of a MOSFET connected in series with the LEDs or by using a digital-to-analog converter to control the gate of the MOSFET with a stair step function representative of the values of a sinusoidal function at predetermined intervals. Alternatively, pulse-width modulation is used to control the gate of the MOSFET in such a way that the average current through the LEDs simulates a sinusoidal function. In additional to using a simple sine wave function, the LED current may also be controlled in accordance with “chords” containing multiple sine waves of different frequencies.
    Type: Grant
    Filed: August 15, 2014
    Date of Patent: June 25, 2019
    Assignee: Applied BioPhotonics Ltd.
    Inventors: Richard K. Williams, Keng Hung Lin, Daniel Schell, Joseph P. Leahy
  • Patent number: 10312111
    Abstract: A method is disclosed of fabricating a power package which includes a heat tab extending from a die pad exposed on the underside of the package, which facilitates the removal of heat from the die to the PCB or other surface on which the package is mounted. The heat tab has a bottom surface coplanar with the flat bottom surface of the die pad and bottom surface of a lead. The lead includes a horizontal foot segment, a vertical columnar segment, and a horizontal cantilever segment facing the die pad. The heat tab may also have a foot. A die containing a power device is mounted on a top surface of the die pad and may be electrically connected to the lead using a bonding wire or clip. The die may be mounted on the die pad with an electrically conductive material, and the package may also include a lead that extends from the die pad and is thus electrically tied to the bottom of the die.
    Type: Grant
    Filed: July 20, 2018
    Date of Patent: June 4, 2019
    Assignee: Adventive IPBank
    Inventors: Richard K. Williams, Keng Hung Lin
  • Publication number: 20180359811
    Abstract: A variety of techniques for concealing the content of a communication between a client device, such as a cell phone or laptop, and a network or cloud of media nodes are disclosed. Among the techniques are routing data packets in the communication to different gateway nodes in the cloud, sending the packets over different physical media, such as an Ethernet cable or WiFi channel, and disguising the packets by giving them different source addressees. Also disclosed are a technique for muting certain participants in a conference call and a highly secure method of storing data files.
    Type: Application
    Filed: April 2, 2018
    Publication date: December 13, 2018
    Inventors: Ievgen Verzun, Oleksandr Holub, Richard K. Williams
  • Publication number: 20180343741
    Abstract: A rigid-flex PCB includes an array of rigid PCB “islands” interconnected by a flexible PCB formed into flexible connectors. The conductive and insulating layers of the flexible PCB extend into the rigid PCBs, giving the electrical connections to the rigid PCBs added resistance to breakage as the rigid-flex PCB is repeatedly stressed by bending and twisting forces. In addition, the durability of the rigid-flex PCB is enhanced by making the power and signal lines driving the rigid PCBs redundant so that a breakage of a line will not necessarily affect the operation of the rigid PCB to which it is attached. The rigid-flex PCB is particularly applicable to light pads used in phototherapy, wherein LEDs mounted on the rigid-PCBs are powered and controlled through the redundant lines in the flexible PCB.
    Type: Application
    Filed: August 5, 2018
    Publication date: November 29, 2018
    Applicant: Adventive IPBank
    Inventors: Richard K. Williams, Keng Hung Lin
  • Publication number: 20180330968
    Abstract: A method is disclosed of fabricating a power package which includes a heat tab extending from a die pad exposed on the underside of the package, which facilitates the removal of heat from the die to the PCB or other surface on which the package is mounted. The heat tab has a bottom surface coplanar with the flat bottom surface of the die pad and bottom surface of a lead. The lead includes a horizontal foot segment, a vertical columnar segment, and a horizontal cantilever segment facing the die pad. The heat tab may also have a foot. A die containing a power device is mounted on a top surface of the die pad and may be electrically connected to the lead using a bonding wire or clip. The die may be mounted on the die pad with an electrically conductive material, and the package may also include a lead that extends from the die pad and is thus electrically tied to the bottom of the die.
    Type: Application
    Filed: July 20, 2018
    Publication date: November 15, 2018
    Applicant: Adventive IPBank
    Inventors: Richard K. Williams, Keng Hung Lin
  • Publication number: 20180331067
    Abstract: A variety of footed and leadless semiconductor packages, with either exposed or isolated die pads, are described. Some of the packages have leads with highly coplanar feet that protrude from a plastic body, facilitating mounting the packages on printed circuit boards using wave-soldering techniques.
    Type: Application
    Filed: July 21, 2018
    Publication date: November 15, 2018
    Applicant: Adventive IPBank
    Inventors: Richard K. Williams, Keng-Hung Lin
  • Patent number: 10074716
    Abstract: An isolation structure formed in a semiconductor substrate of a first conductivity type includes a region of a second conductivity type opposite to the first conductivity type. The region of the second conductivity type is saucer-shaped and has a floor portion substantially parallel to the top surface of the substrate and a sloped sidewall portion. The sloped sidewall portion extends downward from the top surface of the substrate at an oblique angle and merges with the floor portion. The floor portion and the sloped sidewall portion together form an isolated pocket of the substrate.
    Type: Grant
    Filed: October 5, 2015
    Date of Patent: September 11, 2018
    Assignees: SKYWORKS SOLUTIONS (HONG KONG) LIMITED, ADVANCED ANALOGIC TECHNOLOGIES INCORPORATED
    Inventors: Wai Tien Chan, Donald Ray Disney, Richard K. Williams
  • Patent number: 10064276
    Abstract: A rigid-flex PCB includes an array of rigid PCB “islands” interconnected by a flexible PCB formed into flexible connectors. The conductive and insulating layers of the flexible PCB extend into the rigid PCBs, giving the electrical connections to the rigid PCBs added resistance to breakage as the rigid-flex PCB is repeatedly stressed by bending and twisting forces. In addition, the durability of the rigid-flex PCB is enhanced by making the power and signal lines driving the rigid PCBs redundant so that a breakage of a line will not necessarily affect the operation of the rigid PCB to which it is attached. The rigid-flex PCB is particularly applicable to light pads used in phototherapy, wherein LEDs mounted on the rigid-PCBs are powered and controlled through the redundant lines in the flexible PCB.
    Type: Grant
    Filed: October 21, 2015
    Date of Patent: August 28, 2018
    Assignee: Adventive IPBank
    Inventors: Richard K Williams, Keng Hung Lin
  • Publication number: 20180241727
    Abstract: In a secure cloud for transmitting packets of digital data, the packets may be repeatedly scrambled (i.e., their data segments reordered) and then unscrambled, split and then mixed, and/or encrypted and then decrypted as they pass through media nodes in the cloud. The methods used to scramble, split, mix and encrypt the packets may be varied in accordance with a state such as time, thereby making the task of a hacker virtually impossible inasmuch as he or she may be viewing only a fragment of a packet and the methods used to disguise the data are constantly changing.
    Type: Application
    Filed: April 6, 2018
    Publication date: August 23, 2018
    Applicant: Listat Ltd.
    Inventors: Ievgen Verzun, Oleksandr Holub, Richard K. Williams
  • Patent number: 10032744
    Abstract: A variety of footed and leadless semiconductor packages, with either exposed or isolated die pads, are described. Some of the packages have leads with highly coplanar feet that protrude from a plastic body, facilitating mounting the packages on printed circuit boards using wave-soldering techniques.
    Type: Grant
    Filed: January 25, 2017
    Date of Patent: July 24, 2018
    Assignee: Adventive IPBank
    Inventors: Richard K. Williams, Keng-Hung Lin
  • Patent number: 10032649
    Abstract: A method is disclosed of fabricating a power package which includes a heat tab extending from a die pad exposed on the underside of the package, which facilitates the removal of heat from the die to the PCB or other surface on which the package is mounted. The heat tab has a bottom surface coplanar with the flat bottom surface of the die pad and bottom surface of a lead. The lead includes a horizontal foot segment, a vertical columnar segment, and a horizontal cantilever segment facing the die pad. The heat tab may also have a foot. A die containing a power device is mounted on a top surface of the die pad and may be electrically connected to the lead using a bonding wire or clip. The die may be mounted on the die pad with as electrically conductive material, and the package may also include a lead that extends from the die pad and is thus electrically tied to the bottom of the die.
    Type: Grant
    Filed: March 8, 2017
    Date of Patent: July 24, 2018
    Assignee: Adventive IPBank
    Inventors: Richard K. Williams, Keng Hung Lin