Patents by Inventor Richard L. Brendel

Richard L. Brendel has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11648409
    Abstract: An EMI/energy dissipating filter for an active implantable medical device (AIMD) comprises a first gold braze sealing an insulator to the ferrule of a glass-to-metal seal (GTMS) and a lead wire that is sealed in a passageway through the insulator by a second gold braze. A circuit board is disposed adjacent to the insulator. A two-terminal chip capacitor disposed adjacent to the circuit board has an active end metallization connected to its active electrode plates and a ground end metallization connected to its ground electrode plates. A ground electrical path extends from the ground end metallization of the chip capacitor, through a circuit board ground plate disposed on or within the circuit board, and to the ferrule. An active electrical path extends from the active end metallization of the chip capacitor to the lead wire of the GTMS.
    Type: Grant
    Filed: October 19, 2021
    Date of Patent: May 16, 2023
    Assignee: Greatbatch Ltd.
    Inventors: Robert A. Stevenson, Christine A. Frysz, Richard L. Brendel
  • Patent number: 11241581
    Abstract: A feedthrough terminal assembly for active implantable medical devices includes an electrically conductive pad for a convenient attachment of wires from either the circuitry inside the implantable medical device or wires external to the device. The electrically conductive pad enables direct thermal or ultrasonic bonding of a circuit board or lead wire to the terminal pin.
    Type: Grant
    Filed: June 10, 2019
    Date of Patent: February 8, 2022
    Assignee: Greatbatch Ltd.
    Inventors: Robert A. Stevenson, Christine A. Frysz, Richard L. Brendel
  • Publication number: 20220032072
    Abstract: An EMI/energy dissipating filter for an active implantable medical device (AIMD) is described. The filter comprises a first gold braze hermetically sealing the insulator to a ferrule that is configured to be mounted in an opening in a housing for the AIMD. A lead wire is hermetically sealed in a passageway through the insulator by a second gold braze. A circuit board substrate is disposed adjacent the insulator. A two-terminal chip capacitor disposed adjacent to the circuit board has an active end metallization that is electrically connected to the active electrode plates and a ground end metallization that is electrically connected to the at least one ground electrode plates of the chip capacitor. There is a ground path electrically extending between the ground end metallization of the chip capacitor and the ferrule.
    Type: Application
    Filed: October 19, 2021
    Publication date: February 3, 2022
    Inventors: Robert A. Stevenson, Christine A. Frysz, Richard L. Brendel
  • Patent number: 11202916
    Abstract: A hermetically sealed filtered feedthrough for an active implantable medical device includes a first conductive leadwire extending from a first end to a second end, the first leadwire second end extending outwardly beyond the device side of an insulator hermetically sealed to a ferrule for the feedthrough. A circuit board supporting a chip capacitor is disposed adjacent to a device side of the insulator and has a circuit board passageway. The first leadwire first end resides in the circuit board passageway. A second conductive leadwire on the device side has a second leadwire first end disposed in the circuit board passageway with a second leadwire second end extending outwardly beyond the circuit board to be connectable to AIMD internal electronics. The second leadwire first end is connected to the first leadwire first end and a capacitor internal metallization in the circuit board passageway.
    Type: Grant
    Filed: October 18, 2019
    Date of Patent: December 21, 2021
    Assignee: Greatbatch Ltd.
    Inventors: Dominick J. Frustaci, Keith W. Seitz, Thomas Marzano, Robert A. Stevenson, Christine A. Frysz, Richard L. Brendel, Jason Woods
  • Patent number: 11147977
    Abstract: An EMI/energy dissipating filter for an active implantable medical device (AIMD) is described. The filter comprises a first gold braze hermetically sealing the insulator to a ferrule that is configured to be mounted in an opening in a housing for the AIMD. A lead wire is hermetically sealed in a passageway through the insulator by a second gold braze. A circuit board substrate is disposed adjacent the insulator. A two-terminal chip capacitor disposed adjacent to the circuit board has an active metallization that is electrically connected to the active electrode plates and a ground metallization that is electrically connected to the ground electrode plates of the capacitor. A ground electrical path extends from the ground metallization of the chip capacitor to the ferrule. A conductive ground pin is electrically and mechanically connected to the ferrule. The ground path comprises an internal ground plate disposed within the circuit board substrate.
    Type: Grant
    Filed: June 26, 2019
    Date of Patent: October 19, 2021
    Assignee: Greatbatch Ltd.
    Inventors: Robert A. Stevenson, Christine A. Frysz, Richard L. Brendel
  • Patent number: 11013928
    Abstract: An EMI/energy dissipating filter for an active implantable medical device (AIMD) is described. The filter comprises a first gold braze hermetically sealing the insulator to a ferrule that is configured to be mounted in an opening in a housing for the AIMD. A lead wire is hermetically sealed in a passageway through the insulator by a second gold braze. A circuit board substrate is disposed adjacent the insulator. A two-terminal chip capacitor disposed adjacent to the circuit board has an active end metallization that is electrically connected to the active electrode plates and a ground end metallization that is electrically connected to the at least one ground electrode plates of the chip capacitor. There is a ground path electrically extending between the ground end metallization of the chip capacitor and the ferrule.
    Type: Grant
    Filed: July 25, 2018
    Date of Patent: May 25, 2021
    Assignee: Greatbatch Ltd.
    Inventors: Robert A. Stevenson, Christine A. Frysz, Richard L. Brendel
  • Patent number: 10881867
    Abstract: A method for making a dielectric substrate configured for incorporation into a hermetically sealed feedthrough is described. The method includes forming a via hole through a green-state dielectric substrate. A platinum-containing paste is filled into at least 90% of the volume of the via hole. The green-state dielectric substrate is then subjected to a heating protocol including: a binder bake-out heating portion performed at a temperature ranging from about 400° C. to about 700° C. for a minimum of 4 hours; a sintering heating portion performed at a temperature ranging from about 1,400° C. to about 1,900° C. for up to 6 hours; and a cool down portion at a rate of up to 5°/minute from a maximum sintering temperature down to about 1,000° C., then naturally to room temperature. The thusly manufacture dielectric substrate is then positioned in an opening in a ferrule that is configured to be attached to a metal housing of an active implantable medical device.
    Type: Grant
    Filed: December 10, 2019
    Date of Patent: January 5, 2021
    Assignee: Greatbatch Ltd.
    Inventors: Robert A. Stevenson, Xiaohong Tang, William C. Thiebolt, Christine A. Frysz, Keith W. Seitz, Richard L. Brendel, Thomas Marzano, Jason Woods, Dominick J. Frustaci, Steven W. Winn
  • Patent number: 10874866
    Abstract: A three-terminal flat-through EMI/energy dissipating filter comprises an active electrode plate through which a circuit current passes between a first terminal and a second terminal, a first shield plate on a first side of the active electrode plate, and second shield plate on a second side of the active electrode plate opposite the first shield plate. The first and second shield plates are conductively coupled to a grounded third terminal. Both the effective capacitance area or overlapping surface area of the active electrode plate and the surrounding ground shield plates and the dielectric constant of the insulating layers between the active electrode plate and the ground shield plates is raised to achieve a higher capacitance value for the three-terminal flat-through capacitor.
    Type: Grant
    Filed: April 16, 2019
    Date of Patent: December 29, 2020
    Assignee: Greatbatch Ltd.
    Inventors: Robert A. Stevenson, Christine A. Frysz, Richard L. Brendel
  • Patent number: 10857369
    Abstract: An EMI/energy dissipating filter for an active implantable medical device (AIMD) is described. The filter comprises a first gold braze hermetically sealing the insulator to a ferrule that is configured to be mounted in an opening in a housing for the AIMD. A lead wire is hermetically sealed in a passageway through the insulator by a second gold braze. A circuit board substrate is disposed adjacent the insulator. A two-terminal chip capacitor disposed adjacent to the circuit board has an active end metallization that is electrically connected to the active electrode plates and a ground end metallization that is electrically connected to the at least one ground electrode plates of the chip capacitor. There is a ground path electrically extending between the ground end metallization of the chip capacitor and the ferrule.
    Type: Grant
    Filed: March 26, 2019
    Date of Patent: December 8, 2020
    Assignee: Greatbatch Ltd.
    Inventors: Robert A. Stevenson, Christine A. Frysz, Richard L. Brendel
  • Patent number: 10722706
    Abstract: An EMI/energy dissipating filter for an active implantable medical device (AIMD) is described. The filter comprises a first gold braze hermetically sealing the insulator to a ferrule that is configured to be mounted in an opening in a housing for the AIMD. A lead wire is hermetically sealed in a passageway through the insulator by a second gold braze. A circuit board substrate is disposed adjacent the insulator. A two-terminal chip capacitor disposed adjacent to the circuit board has an active end metallization that is electrically connected to the active electrode plates and a ground end metallization that is electrically connected to the at least one ground electrode plates of the chip capacitor. There is a ground path electrically extending between the ground end metallization of the chip capacitor and the ferrule.
    Type: Grant
    Filed: August 21, 2018
    Date of Patent: July 28, 2020
    Assignee: Greatbatch Ltd.
    Inventors: Robert A. Stevenson, Christine A. Frysz, Richard L. Brendel
  • Publication number: 20200121935
    Abstract: A method for making a dielectric substrate configured for incorporation into a hermetically sealed feedthrough is described. The method includes forming a via hole through a green-state dielectric substrate. A platinum-containing paste is filled into at least 90% of the volume of the via hole. The green-state dielectric substrate is then subjected to a heating protocol including: a binder bake-out heating portion performed at a temperature ranging from about 400° C. to about 700° C. for a minimum of 4 hours; a sintering heating portion performed at a temperature ranging from about 1,400° C. to about 1,900° C. for up to 6 hours; and a cool down portion at a rate of up to 5°/minute from a maximum sintering temperature down to about 1,000° C., then naturally to room temperature. The thusly manufacture dielectric substrate is then positioned in an opening in a ferrule that is configured to be attached to a metal housing of an active implantable medical device.
    Type: Application
    Filed: December 10, 2019
    Publication date: April 23, 2020
    Inventors: Robert A. Stevenson, Xiaohong Tang, William C. Thiebolt, Christine A. Frysz, Keith W. Seitz, Richard L. Brendel, Thomas Marzano, Jason Woods, Dominick J. Frustaci, Steven W. Winn
  • Patent number: 10589107
    Abstract: A feedthrough separates a body fluid side from a device side. A passageway is disposed through the feedthrough. A body fluid side leadwire extends from a first end disposed inside the passageway to a second end on the body fluid side. A device side leadwire extends from a first end disposed inside the passageway to a second end on the device side. The body fluid side leadwire is hermetically sealed to the feedthrough body and is not of the same material as the device side leadwire. A circuit board has an active via hole with a second end of the second leadwire residing therein. The circuit board has an active circuit trace that is electrically connectable to electronic circuits housed in an AIMD, and a circuit board ground metallization.
    Type: Grant
    Filed: March 4, 2019
    Date of Patent: March 17, 2020
    Assignee: Greatbatch Ltd.
    Inventors: Keith W. Seitz, Thomas Marzano, Robert A. Stevenson, Christine A. Frysz, Jason Woods, Richard L. Brendel, Marc Gregory Martino
  • Publication number: 20200054881
    Abstract: A hermetically sealed filtered feedthrough for an active implantable medical device includes a first conductive leadwire extending from a first end to a second end, the first leadwire second end extending outwardly beyond the device side of an insulator hermetically sealed to a ferrule for the feedthrough. A circuit board supporting a chip capacitor is disposed adjacent to a device side of the insulator and has a circuit board passageway. The first leadwire first end resides in the circuit board passageway. A second conductive leadwire on the device side has a second leadwire first end disposed in the circuit board passageway with a second leadwire second end extending outwardly beyond the circuit board to be connectable to AIMD internal electronics. The second leadwire first end is connected to the first leadwire first end and a capacitor internal metallization in the circuit board passageway.
    Type: Application
    Filed: October 18, 2019
    Publication date: February 20, 2020
    Inventors: Dominick J. Frustaci, Keith W. Seitz, Thomas Marzano, Robert A. Stevenson, Christine A. Frysz, Richard L. Brendel, Jason Woods
  • Patent number: 10559409
    Abstract: A method for manufacturing a feedthrough dielectric body for an active implantable medical device includes the steps of first forming a ceramic reinforced metal composite (CRMC) paste by mixing platinum with a ceramic material to form a CRMC material, subjecting the CRMC material to a first sintering step to thereby form a sintered CRMC material, ball-milling or grinding the sintered CRMC material to form a powdered CRMC material; and then mixing the powdered CRMC material with a solvent to form the CRMC paste.
    Type: Grant
    Filed: March 25, 2019
    Date of Patent: February 11, 2020
    Assignee: Greatbatch Ltd.
    Inventors: Keith W. Seitz, Dallas J. Rensel, Brian P. Hohl, Jonathan Calamel, Xiaohong Tang, Robert A. Stevenson, Christine A. Frysz, Thomas Marzano, Jason Woods, Richard L. Brendel
  • Patent number: 10500402
    Abstract: A hermetically sealed feedthrough for attachment to an active implantable medical device includes a dielectric substrate configured to be hermetically sealed to a ferrule or an AIMD housing. A via hole is disposed through the dielectric substrate from a body fluid side to a device side. A conductive fill is disposed within the via hole forming a filled via electrically conductive between the body fluid side and the device side. A conductive insert is at least partially disposed within the conductive fill. Then, the conductive fill and the conductive insert are co-fired with the dielectric substrate to form a hermetically sealed and electrically conductive pathway through the dielectric substrate between the body fluid side and the device side.
    Type: Grant
    Filed: February 12, 2018
    Date of Patent: December 10, 2019
    Assignee: Greatbatch Ltd.
    Inventors: Robert A. Stevenson, Xiaohong Tang, William C. Thiebolt, Christine A. Frysz, Keith W. Seitz, Richard L. Brendel, Thomas Marzano, Jason Woods, Dominick J. Frustaci, Steven W. Winn
  • Publication number: 20190321628
    Abstract: An EMI/energy dissipating filter for an active implantable medical device (AIMD) is described. The filter comprises a first gold braze hermetically sealing the insulator to a ferrule that is configured to be mounted in an opening in a housing for the AIMD. A lead wire is hermetically sealed in a passageway through the insulator by a second gold braze. A circuit board substrate is disposed adjacent the insulator. A two-terminal chip capacitor disposed adjacent to the circuit board has an active metallization that is electrically connected to the active electrode plates and a ground metallization that is electrically connected to the ground electrode plates of the capacitor. A ground electrical path extends from the ground metallization of the chip capacitor to the ferrule. A conductive ground pin is electrically and mechanically connected to the ferrule. The ground path comprises an internal ground plate disposed within the circuit board substrate.
    Type: Application
    Filed: June 26, 2019
    Publication date: October 24, 2019
    Inventors: Robert A. Stevenson, Christine A. Frysz, Richard L. Brendel
  • Patent number: 10449375
    Abstract: A hermetically sealed feedthrough subassembly attachable to an active implantable medical device includes a first conductive leadwire extending from a first end to a second end, the first conductive leadwire first end disposed past a device side of an insulator body. A feedthrough filter capacitor is disposed on the device side. A second conductive leadwire is disposed on the device side having a second conductive leadwire first end at least partially disposed within a first passageway of the feedthrough filter capacitor and having a second conductive leadwire second end disposed past the feedthrough filter capacitor configured to be connectable to AIMD internal electronics. The second conductive leadwire first end is at, near or adjacent to the first conductive leadwire first end. A first electrically conductive material forms a three-way electrical connection electrically connecting the second conductive leadwire first end, the first conductive leadwire first end and a capacitor internal metallization.
    Type: Grant
    Filed: December 18, 2017
    Date of Patent: October 22, 2019
    Assignee: Greatbatch Ltd.
    Inventors: Dominick J. Frustaci, Keith W. Seitz, Thomas Marzano, Robert A. Stevenson, Christine A. Frysz, Richard L. Brendel, Jason Woods
  • Publication number: 20190308013
    Abstract: A feedthrough terminal assembly for active implantable medical devices includes an electrically conductive pad for a convenient attachment of wires from either the circuitry inside the implantable medical device or wires external to the device. The electrically conductive pad enables direct thermal or ultrasonic bonding of a circuit board or lead wire to the terminal pin.
    Type: Application
    Filed: June 10, 2019
    Publication date: October 10, 2019
    Inventors: Robert A. Stevenson, Christine A. Frysz, Richard L. Brendel
  • Publication number: 20190240482
    Abstract: A three-terminal flat-through EMI/energy dissipating filter comprises an active electrode plate through which a circuit current passes between a first terminal and a second terminal, a first shield plate on a first side of the active electrode plate, and second shield plate on a second side of the active electrode plate opposite the first shield plate. The first and second shield plates are conductively coupled to a grounded third terminal. Both the effective capacitance area or overlapping surface area of the active electrode plate and the surrounding ground shield plates and the dielectric constant of the insulating layers between the active electrode plate and the ground shield plates is raised to achieve a higher capacitance value for the three-terminal flat-through capacitor.
    Type: Application
    Filed: April 16, 2019
    Publication date: August 8, 2019
    Inventors: Robert A. Stevenson, Christine A. Frysz, Richard L. Brendel
  • Patent number: RE47624
    Abstract: A co-fired hermetically sealed feedthrough is attachable to an active implantable medical device. The feedthrough comprises an alumina dielectric substrate comprising at least 96 or 99% alumina. A via hole is disposed through the alumina dielectric substrate from a body fluid side to a device side. A substantially closed pore, fritless and substantially pure platinum fill is disposed within the via hole forming a platinum filled via electrically conductive between the body fluid side and the device side. A hermetic seal is between the platinum fill and the alumina dielectric substrate, wherein the hermetic seal comprises a tortuous and mutually conformal interface between the alumina dielectric substrate and the platinum fill.
    Type: Grant
    Filed: February 5, 2016
    Date of Patent: October 1, 2019
    Assignee: Greatbatch Ltd.
    Inventors: Xiaohong Tang, William C. Thiebolt, Christine A. Frysz, Keith W. Seitz, Robert A. Stevenson, Richard L. Brendel, Thomas Marzano, Jason Woods, Dominck J. Frustaci, Steven W. Winn