Patents by Inventor Richard L. Malehorn

Richard L. Malehorn has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 7651371
    Abstract: An electrical connector (100) for receiving a mating plug (200) having an insulative housing (10), a set of first contacts (21), and a set of second contacts (22). The insulative housing includes a base portion (13), a wafer (14), and a latch mechanism fastened the wafer to the base portion. The electrical contacts are attached to the insulative housing and each has a contact section (214, 222) connecting with the plug and a mounting section (213, 224) extending out of the insulative housing. The contact sections of the first contacts are staggered with the contact sections of the second contacts along a mating direction of the electrical connector, and wherein the contact sections of the first contacts are closed to a front edge of the wafer.
    Type: Grant
    Filed: November 15, 2007
    Date of Patent: January 26, 2010
    Assignee: Hon Hai Precision Ind. Co., Ltd.
    Inventors: Chong Yi, Tod M. Harlan, Richard L. Malehorn, Jia-Yong He, Terrance F. Little
  • Publication number: 20090130913
    Abstract: An electrical connector (100) for receiving a mating plug (200) having an insulative housing (10), a set of first contacts (21), and a set of second contacts (22). The insulative housing includes a base portion (13), a wafer (14), and a latch mechanism fastened the wafer to the base portion. The electrical contacts are attached to the insulative housing and each has a contact section (214, 222) connecting with the plug and a mounting section (213, 224) extending out of the insulative housing. The contact sections of the first contacts are staggered with the contact sections of the second contacts along a mating direction of the electrical connector, and wherein the contact sections of the first contacts are closed to a front edge of the wafer.
    Type: Application
    Filed: November 15, 2007
    Publication date: May 21, 2009
    Inventors: Chong Yi, Tod M. Harlan, Richard L. Malehorn, Jia-Yong He, Terrance F. Little
  • Patent number: 7037136
    Abstract: A connector module for receiving a signal converter and electrically connecting the signal converter to a printed circuit board mounted within an electronic system. The connector module includes a conductive cage having a plurality of press-fit type pins and a shielding lid. The connector module further defines a top opening and a cavity with an opening on a bottom portion of the conductive cage for receiving the connector which electrically connecting with the signal converter. The shielding lid covers on the top opening. The connector comprises a plurality of contacts each having a press-fit end, said press-fit ends extending toward the printed circuit board and mounting therein.
    Type: Grant
    Filed: February 15, 2005
    Date of Patent: May 2, 2006
    Assignee: Hon Hai Precision Ind. Co., Ltd.
    Inventors: Iosif R. Korsunsky, Chong Hun Yi, Robert W. Brown, Lewis R. Johnson, Joanne E. Shipe, Tod M. Harlan, Richard B. Emenheiser, Richard L. Malehorn, Charles (Chuck) Blichasz, Eric Juntwait
  • Patent number: RE44448
    Abstract: An electrical connector (100) for receiving a mating plug (200) having an insulative housing (10), a set of first contacts (21), and a set of second contacts (22). The insulative housing includes a base portion (13), a wafer (14), and a latch mechanism fastened the wafer to the base portion. The electrical contacts are attached to the insulative housing and each has a contact section (214, 222) connecting with the plug and a mounting section (213, 224) extending out of the insulative housing. The contact sections of the first contacts are staggered with the contact sections of the second contacts along a mating direction of the electrical connector, and wherein the contact sections of the first contacts are closed to a front edge of the wafer.
    Type: Grant
    Filed: January 26, 2012
    Date of Patent: August 20, 2013
    Assignee: Hon Hai Precision Ind. Co., Ltd.
    Inventors: Chong Yi, Tod M. Harlan, Richard L. Malehorn, Jia-Yong He, Terrance F. Little