Patents by Inventor Richard M. Moore, Jr.

Richard M. Moore, Jr. has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 6292716
    Abstract: Several methods and subsystems are provided for aligning a workpiece as it is being loaded into a die space of a bending apparatus, and for performing sensor-based control of a robot as it moves a workpiece from one location to another within a bending apparatus environment. A backgaging mechanism is provided with finger gaging mechanisms having force sensors for sensing forces in directions perpendicular to and parallel to a die. In addition, a robot gripper sensor is provided for sensing either or both of shear forces and normal forces created by movement of a workpiece being held by the gripper.
    Type: Grant
    Filed: September 13, 1999
    Date of Patent: September 18, 2001
    Assignees: Amada America, Inc., Amada Company, Ltd.
    Inventors: Richard M. Moore, Jr., David Alan Bourne, Kerry L. Elkins, Anne Marie Murray, Robert H. Sturges, Jr., Kensuke Hazama
  • Patent number: 6067862
    Abstract: A fingerpad force sensor system is disclosed which is useful for detecting process variations during manufacturing processes in which a plurality of force sensors are applied to the gripper of a robot in order to monitor shear forces applied to the workpiece held by the robot during, for example, sheet-metal bending manufacturing processes. Each sensor is encapsulated in rubber pads which are secured to the gripper of the robot such that they monitor the status of the workpiece during all phases of automated bending: material acquisition, material handling, machine loading and unloading.
    Type: Grant
    Filed: November 13, 1998
    Date of Patent: May 30, 2000
    Assignees: Amada Company, Ltd., Amada America, Inc.
    Inventors: Anne Marie Murray, Richard M. Moore, Jr., David Alan Bourne, Melvin W. Siegel
  • Patent number: 5987958
    Abstract: Several methods and subsystems are disclosed for aligning a workpiece as it is being loaded into a die space of a bending apparatus, and for performing sensor-based control of a robot as it moves a workpiece from one location to another within a bending apparatus environment. A backgaging mechanism is provided with finger gaging mechanisms having force sensors for sensing forces in directions perpendicular to and parallel to a die. In addition, a robot gripper sensor is provided for sensing either or both of shear forces and normal forces created by movement of a workpiece being held by the gripper.
    Type: Grant
    Filed: November 28, 1997
    Date of Patent: November 23, 1999
    Assignees: Amada Company, Ltd., Amada America, Inc.
    Inventors: Richard M. Moore, Jr., David Alan Bourne, Kerry L. Elkins, Anne Marie Murray, Robert H. Sturgas, Jr., Kensuke Hazama
  • Patent number: 5844146
    Abstract: A fingerpad force sensor system is disclosed which is useful for detecting process variations during manufacturing processes in which a plurality of force sensors are applied to the gripper of a robot in order to monitor shear forces applied to the workpiece held by the robot during, for example, sheet-metal bending manufacturing processes. Each sensor is encapsulated in rubber pads which are secured to the gripper of the robot such that they monitor the status of the workpiece during all phases of automated bending: material acquisition, material handling, machine loading and unloading.
    Type: Grant
    Filed: October 31, 1996
    Date of Patent: December 1, 1998
    Assignees: Amada America, Inc., Amada Company, Ltd.
    Inventors: Anne Marie Murray, Richard M. Moore, Jr., David Alan Bourne, Melvin W. Siegel
  • Patent number: 5761940
    Abstract: Several methods and subsystems are disclosed for aligning a workpiece as it is being loaded into a die space of a bending apparatus, and for performing sensor-based control of a robot as it moves a workpiece from one location to another within a bending apparatus environment. A backgaging mechanism is provided with finger gaging mechanisms having force sensors for sensing forces in directions perpendicular to and parallel to a die. In addition, a robot gripper sensor is provided for sensing either or both of shear forces and normal forces created by movement of a workpiece being held by the gripper.
    Type: Grant
    Filed: February 9, 1995
    Date of Patent: June 9, 1998
    Assignees: Amada Company, Ltd., Amada America, Inc.
    Inventors: Richard M. Moore, Jr., David Alan Bourne, Anne Marie Murray, Robert H. Sturges, Jr., Kensuke Hazama