Abstract: A light emitting diode (LED) lighting device that includes a housing and a heat sink assembly received within the housing. The heat sink assembly includes at least a first heat sink member and at least a second heat sink member. A printed circuit board having at least one LED provided thereon is mounted to both the first heat sink member and the second heat sink member. At least one biasing member biases an outer side of the first heat sink member and an outer side of the second heat sink member into contact with an inner side of the housing. Heat from the at least one LED is transferred through the heat sink assembly to the housing, where it is dissipated into the air.

Abstract: A light emitting diode (LED) lighting device that includes a housing and a heat sink assembly received within the housing. The heat sink assembly includes at least a first heat sink member and at least a second heat sink member. A printed circuit board having at least one LED provided thereon is mounted to both the first heat sink member and the second heat sink member. At least one biasing member biases an outer side of the first heat sink member and an outer side of the second heat sink member into contact with an inner side of the housing. Heat from the at least one LED is transferred through the heat sink assembly to the housing, where it is dissipated into the air.

Abstract: The present invention provides a new electronic circuit board and a method of using such board to test electronic devices at elevated temperatures. The board comprises a steel base having a dielectric coating layer and a circuit formed on the layer. The circuit includes a connector region for attachment to an external electrical source and a mounting region for mounting sockets for supporting, powering and monitoring the electronic devices during elevated temperature testing. The board displays a leakage current of less than 10 ?Amps at 350° C.

Abstract: The present invention provides a new electronic circuit board and a method of using such board to test electronic devices at elevated temperatures. The board comprises a steel base having a dielectric coating layer and a circuit formed on the layer. The circuit includes a connector region for attachment to an external electrical source and a mounting region for mounting sockets for supporting, powering and monitoring the electronic devices during elevated temperature testing. The board displays a leakage current of less than 10 &mgr;Amps at 350° C.

Abstract: An electric circuit board to test electronic devices at elevated temperatures. The board comprises a steel base having a dielectric coating layer and a circuit formed on the layer. The circuit includes a connector region for attachment to an external electrical source and a mounting region for mounting sockets for supporting, powering and monitoring the electronic devices during elevated temperature testing. The board displays a leakage current of less than 10&mgr; Amps at 350° C.

Abstract: A lighting device having a light emitting diode (LED). The device includes a metal substrate having a surface. A dielectric coating layer is superimposed on the surface of the metal substrate. A light emitting diode (LED) is supported on the dielectric coating layer. The metal substrate serves as a heat sink for the heat emitted by LED during operation.

Abstract: A circuit device and a method for providing an interface between a circuit device comprised of a porcelain enameled metal substrate and an external electrical conductor such as a wire or a lead. An aperture is formed in the substrate at the location where the connection is desired. An eyelet is then placed in the aperture. Crimping or other means are used to form a mechanical connection to the substrate and causes the eyelet to be retained in the aperture. The wire or lead of an electronic component is then inserted into the eyelet. The wire or lead is then soldered to the eyelet providing a joint of high mechanical strength.

Abstract: The present invention provides a new electronic circuit board and a method of using such board to test electronic devices at elevated temperatures. The board comprises a steel base having a dielectric coating layer and a circuit formed on the layer. The circuit includes a connector region for attachment to an external electrical source and a mounting region for mounting sockets for supporting, powering and monitoring the electronic devices during elevated temperature testing. The board displays a leakage current of less than 10&mgr; Amps at 350° C.

Abstract: The present invention provides a metal substrate parts gang having a frame, multiple substrates and multiple connective portions. The connective portions include a notched portion or break-out zone. A coating of resist or mask material is applied in the immediate proximity of the notched portion and then a layer of dielectric coating material is applied to the carrier gang. The resist serves to prevent the deposition of the dielectric coating material in the proximity of the notched portion. After coating, the carrier gang is fired in order to cure the dielectric material. The piece of base metal may be further processed, for example, screen printed with thick or think film inks. When required, the piece of base metal can be easily removed or separated from the frame by bending and/or twisting.

Abstract: The present invention provides a method of fabricating coated multiple metal substrates comprising the steps of fabricating from a section of metal a gang matrix comprising a frame, at least one piece of base metal which later forms a substrate, and a connective portion connecting or linking the piece to the frame. The connective portion includes a notched portion or break-out zone. A coating of resist or mask material is applied in the immediate proximity of the notched portion and then a layer of dielectric coating material is applied to the carrier gang. The resist serves to prevent the deposition of the dielectric coating material in the proximity of the notched portion. After coating, the carrier gang is fired in order to cure the dielectric material. The piece of base metal may be further processed, for example, screen printed with thick or think film inks. When required, the piece of base metal can be easily removed or separated from the frame by bending and/or twisting.

Abstract: A touch control panel for use in controlling an electrical device such as a washer, dryer, stove, microwave or related piece of electrical equipment. In a preferred embodiment, the touch control panel comprises an outer panel formed of flexible aluminum. The outer panel includes an outer and an inner surface. The inner surface of the aluminum panel includes a first circuit formed along at least a portion of the surface. The control panel also includes an inner support panel comprising a porcelain enamel metal substrate. The porcelain enamel metal substrate affords a highly durable and rigid degree of support to the control panel. The support panel has an inner surface which is spaced from and disposed substantially parallel to the inner surface of the outer panel. The inner surface of the metal substrate has formed along at least a portion thereof a second circuit. Upon application of tactile pressure upon the outer surface of the outer panel, the first circuit contacts the second circuit.

Abstract: The invention provides a method for making an electrical circuit device as well as a resulting device itself. The method includes the steps of forming a base or substrate of conductive metal and then securing an electrically conductive masking element to the substrate. The resulting product is coated with a layer of fusible particles of a dielectric or resistive material that is repelled by the surface of the masking element. The coated product is then heated to fuse the particles and provide a hard dielectric or resistive layer over surface portions of the base. The masking element provides an exposed conductive path to the base metal or substrate. A section of conductive metal foil may be bonded to the masking element to provide a continuous conductive bus on the substrate.