Patents by Inventor Richard P. Schneider

Richard P. Schneider has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 8300994
    Abstract: A photonic integrated circuit (PIC) chip comprising an array of modulated sources, each providing a modulated signal output at a channel wavelength different from the channel wavelength of other modulated sources and a wavelength selective combiner having an input optically coupled to received all the signal outputs from the modulated sources and provide a combined output signal on an output waveguide from the chip. The modulated sources, combiner and output waveguide are all integrated on the same chip.
    Type: Grant
    Filed: February 7, 2011
    Date of Patent: October 30, 2012
    Assignee: Infinera Corporation
    Inventors: David F. Welch, Vincent G. Dominic, Fred A. Kish, Jr., Mark J. Missey, Radhakrishnan L. Nagarajan, Atul Mathur, Frank H. Peters, Robert B. Taylor, Matthew L. Mitchell, Alan C. Nilsson, Stephen G. Grubb, Richard P. Schneider, Charles H. Joyner, Ting-Kuang Chiang, Marco E. Sosa
  • Publication number: 20110249936
    Abstract: A photonic integrated circuit (PIC) chip comprising an array of modulated sources, each providing a modulated signal output at a channel wavelength different from the channel wavelength of other modulated sources and a wavelength selective combiner having an input optically coupled to received all the signal outputs from the modulated sources and provide a combined output signal on an output waveguide from the chip. The modulated sources, combiner and output waveguide are all integrated on the same chip.
    Type: Application
    Filed: February 7, 2011
    Publication date: October 13, 2011
    Inventors: David F. Welch, Vincent G. Dominic, Fred A. Kish, JR., Mark J. Missey, Radhakrishnan L. Nagarajan, Atul Mathur, Frank H. Peters, Robert B. Taylor, Matthew L. Mitchell, Alan C. Nilsson, Stephen G. Grubb, Richard P. Schneider, Charles H. Joyner, Ting-Kuang Chiang, Marco E. Sosa
  • Patent number: 7885492
    Abstract: A photonic integrated circuit (PIC) chip comprising an array of modulated sources, each providing a modulated signal output at a channel wavelength different from the channel wavelength of other modulated sources and a wavelength selective combiner having an input optically coupled to received all the signal outputs from the modulated sources and provide a combined output signal on an output waveguide from the chip. The modulated sources, combiner and output waveguide are all integrated on the same chip.
    Type: Grant
    Filed: December 11, 2002
    Date of Patent: February 8, 2011
    Assignee: Infinera Corporation
    Inventors: David F. Welch, Vincent G. Dominic, Fred A. Kish, Jr., Mark J. Missey, Radhakrishnan L. Nagarajan, Atul Mathur, Frank H. Peters, Robert B. Taylor, Matthew L. Mitchell, Alan C. Nilsson, Stephen G. Grubb, Richard P. Schneider, Charles H. Joyner, Ting-Kuang Chiang, Marco E. Sosa
  • Patent number: 7792396
    Abstract: Method and apparatus for utilizing a probe card for testing in-wafer photonic integrated circuits (PICs) comprising a plurality of in-wafer photonic integrated circuit (PIC) die formed in the surface of a semiconductor wafer where each PIC comprises one or more electro-optic components with formed wafer-surface electrical contacts. The probe card has a probe card body with at least one row of downwardly dependent, electrically conductive contact probes. The probe body is transversely translated over the surface of the wafer to a selected in-wafer photonic integrated circuit (PIC) die. Then, the contact probes of the probe card are brought into engagement with surface electrical contacts of the selected photonic integrated circuit (PIC) die for testing the operation of electro-optic components in the selected in-wafer photonic integrated circuit (PIC) die.
    Type: Grant
    Filed: November 16, 2004
    Date of Patent: September 7, 2010
    Assignee: Infinera Corporation
    Inventors: Fred A. Kish, Jr., Frank H. Peters, Radhakrishnan L. Nagarajan, Richard P. Schneider
  • Patent number: 7773837
    Abstract: A photonic integrated circuit (PIC) chip comprising an array of modulated sources, each providing a modulated signal output at a channel wavelength different from the channel wavelength of other modulated sources and a wavelength selective combiner having an input optically coupled to received all the signal outputs from the modulated sources and provide a combined output signal on an output waveguide from the chip. The modulated sources, combiner and output waveguide are all integrated on the same chip.
    Type: Grant
    Filed: September 29, 2008
    Date of Patent: August 10, 2010
    Assignee: Infinera Corporation
    Inventors: David F. Welch, Vincent G. Dominic, Fred A. Kish, Jr., Mark J. Missey, Radhakrishnan L. Nagarajan, Atul Mathur, Frank H. Peters, Robert B. Taylor, Matthew L. Mitchell, Alan C. Nilsson, Stephen G. Grubb, Richard P. Schneider, Charles H. Joyner, Jonas Webjorn, Drew D. Perkins
  • Patent number: 7680368
    Abstract: A photonic integrated circuit (PIC) chip comprising an array of modulated sources, each providing a modulated signal output at a channel wavelength different from the channel wavelength of other modulated sources and a wavelength selective combiner having an input optically coupled to received all the signal outputs from the modulated sources and provide a combined output signal on an output waveguide from the chip. The modulated sources, combiner and output waveguide are all integrated on the same chip.
    Type: Grant
    Filed: July 6, 2007
    Date of Patent: March 16, 2010
    Assignee: Infinera Corporation
    Inventors: David F. Welch, Vincent G. Dominic, Fred A. Kish, Jr., Mark J. Missey, Radhakrishnan L. Nagarajan, Atul Mathur, Frank H. Peters, Robert B. Taylor, Matthew L. Mitchell, Alan C. Nilsson, Stephen G. Grubb, Richard P. Schneider, Charles H. Joyner, Jonas Webjorn, Drew D. Perkins
  • Patent number: 7672546
    Abstract: A photonic integrated circuit (PIC) chip comprising an array of modulated sources, each providing a modulated signal output at a channel wavelength different from the channel wavelength of other modulated sources and a wavelength selective combiner having an input optically coupled to received all the signal outputs from the modulated sources and provide a combined output signal on an output waveguide from the chip. The modulated sources, combiner and output waveguide are all integrated on the same chip.
    Type: Grant
    Filed: June 22, 2007
    Date of Patent: March 2, 2010
    Assignee: Infinera Corporation
    Inventors: David F. Welch, Vincent G. Dominic, Fred A. Kish, Jr., Mark J. Missey, Radhakrishnan L. Nagarajan, Atul Mathur, Frank H. Peters, Richard P. Schneider, Charles H. Joyner, Jonas Webjorn, Marco E. Sosa
  • Patent number: 7519246
    Abstract: A photonic integrated circuit (PIC) chip comprising an array of modulated sources, each providing a modulated signal output at a channel wavelength different from the channel wavelength of other modulated sources and a wavelength selective combiner having an input optically coupled to received all the signal outputs from the modulated sources and provide a combined output signal on an output waveguide from the chip. The modulated sources, combiner and output waveguide are all integrated on the same chip.
    Type: Grant
    Filed: October 9, 2007
    Date of Patent: April 14, 2009
    Assignee: Infinera Corporation
    Inventors: David F. Welch, Vincent G. Dominic, Fred A. Kish, Jr., Mark J. Missey, Radhakrishnan L. Nagarajan, Atul Mathur, Frank H. Peters, Robert B. Taylor, Matthew L. Mitchell, Alan C. Nilsson, Stephen G. Grubb, Richard P. Schneider, Charles H. Joyner, Jonas Webjorn, Ting-Kuang Chiang, Robert Grencavich, Vinh D. Nguyen, Donald J. Pavinski, Jr., Marco E. Sosa
  • Patent number: 7512295
    Abstract: A photonic integrated circuit (PIC) chip comprising an array of modulated sources, each providing a modulated signal output at a channel wavelength different from the channel wavelength of other modulated sources and a wavelength selective combiner having an input optically coupled to received all the signal outputs from the modulated sources and provide a combined output signal on an output waveguide from the chip. The modulated sources, combiner and output waveguide are all integrated on the same chip.
    Type: Grant
    Filed: June 20, 2007
    Date of Patent: March 31, 2009
    Assignee: Infinera Corporation
    Inventors: David F. Welch, Vincent G. Dominic, Fred A. Kish, Jr., Mark J. Missey, Radhakrishnan L. Nagarajan, Atul Mathur, Frank H. Peters, Robert B. Taylor, Matthew L. Mitchell, Alan C. Nilsson, Stephen G. Grubb, Richard P. Schneider, Charles H. Joyner, Jonas Webjorn, Drew D. Perkins
  • Patent number: 7483599
    Abstract: A method of calibrating a monolithic transmitter photonic integrated circuit (TxPIC) chip is disclosed where the chip contains integrated arrays of laser sources and electro-optic modulators forming a plurality of different wavelength signal channels where each laser source on the chip is sequentially selected and tested for the output power and operational wavelength. Calibration data is initially determined by checking an amount of output power of each laser output and any offset of each laser operational wavelength from a desired predetermined value. Then, adjustment of the operational wavelength of each laser source is accomplished to substantially match the desired predetermined value. The laser source output power and operational wavelength may then be rechecked to determine if there is any remaining offset of each laser operational wavelength from the desired predetermined value.
    Type: Grant
    Filed: November 16, 2004
    Date of Patent: January 27, 2009
    Assignee: Infinera Corporation
    Inventors: Fred A. Kish, Jr., Charles H. Joyner, Radhakrishnan L. Nagarajan, Richard P. Schneider, Vincent D. Dominic
  • Publication number: 20090022452
    Abstract: A photonic integrated circuit (PIC) chip comprising an array of modulated sources, each providing a modulated signal output at a channel wavelength different from the channel wavelength of other modulated sources and a wavelength selective combiner having an input optically coupled to received all the signal outputs from the modulated sources and provide a combined output signal on an output waveguide from the chip. The modulated sources, combiner and output waveguide are all integrated on the same chip.
    Type: Application
    Filed: September 29, 2008
    Publication date: January 22, 2009
    Inventors: David F. Welch, Vincent G. Dominic, Fred A. Kish, JR., Mark J. Missey, Radhakrishnan L. Nagarajan, Atul Mathur, Frank H. Peters, Robert B. Taylor, Matthew L. Mitchell, Alan C. Nilsson, Stephen G. Grubb, Richard P. Schneider, Charles H. Joyner, Jonas Webjorn, Drew D. Perkins
  • Patent number: 7477807
    Abstract: A photonic integrated circuit (PIC) chip comprising an array of modulated sources, each providing a modulated signal output at a channel wavelength different from the channel wavelength of other modulated sources and a wavelength selective combiner having an input optically coupled to received all the signal outputs from the modulated sources and provide a combined output signal on an output waveguide from the chip. The modulated sources, combiner and output waveguide are all integrated on the same chip.
    Type: Grant
    Filed: June 21, 2007
    Date of Patent: January 13, 2009
    Assignee: Infinera Corporation
    Inventors: David F. Welch, Vincent G. Dominic, Fred A. Kish, Jr., Mark J. Missey, Radhakrishnan L. Nagarajan, Atul Mathur, Frank H. Peters, Robert B. Taylor, Matthew L. Mitchell, Alan C. Nilsson, Stephen G. Grubb, Richard P. Schneider, Charles H. Joyner, Jonas Webjorn, Drew D. Perkins
  • Patent number: 7437029
    Abstract: A monolithic photonic integrated circuit (PIC) chip where the active waveguide cores of the modulated sources of the PIC are multiple quantum wells (MQWs) and the passive waveguide cores of an optical combiner are a bulk layer or material. The cores of the waveguide cores may be a quaternary such as InGaAsP or InAlGaAs.
    Type: Grant
    Filed: April 7, 2006
    Date of Patent: October 14, 2008
    Assignee: Infinera Corporation
    Inventors: Charles H. Joyner, Fred A. Kish, Jr., Frank H. Peters, Atul Mathur, David F. Welch, Andrew G. Dentai, Damien Lambert, Richard P. Schneider, Mark J. Missey
  • Publication number: 20080138088
    Abstract: A photonic integrated circuit (PIC) chip comprising an array of modulated sources, each providing a modulated signal output at a channel wavelength different from the channel wavelength of other modulated sources and a wavelength selective combiner having an input optically coupled to received all the signal outputs from the modulated sources and provide a combined output signal on an output waveguide from the chip. The modulated sources, combiner and output waveguide are all integrated on the same chip.
    Type: Application
    Filed: July 5, 2007
    Publication date: June 12, 2008
    Applicant: INFINERA CORPORATION
    Inventors: David F. Welch, Vincent G. Dominic, Fred A. Kish, Mark J. Missey, Radhakrishnan L. Nagarajan, Atul Mathur, Frank H. Peters, Robert B. Taylor, Matthew L. Mitchell, Alan C. Nilsson, Stephen G. Grubb, Richard P. Schneider, Charles H. Joyner, Jonas Webjorn, Drew D. Perkins
  • Patent number: 7340122
    Abstract: A photonic integrated circuit (PIC) chip comprising an array of modulated sources, each providing a modulated signal output at a channel wavelength different from the channel wavelength of other modulated sources and a wavelength selective combiner having an input optically coupled to received all the signal outputs from the modulated sources and provide a combined output signal on an output waveguide from the chip. The modulated sources, combiner and output waveguide are all integrated on the same chip.
    Type: Grant
    Filed: June 22, 2007
    Date of Patent: March 4, 2008
    Assignee: Infinera Corporation
    Inventors: David F. Welch, Vincent G. Dominic, Fred A. Kish, Jr., Mark J. Missey, Radhakrishnan L. Nagarajan, Atul Mathur, Frank H. Peters, Robert B. Taylor, Matthew L. Mitchell, Alan C. Nilsson, Stephen G. Grubb, Richard P. Schneider, Charles H. Joyner, Jonas Webjorn, Drew D. Perkins
  • Patent number: 7283694
    Abstract: A photonic integrated circuit (PIC) chip comprising an array of modulated sources, each providing a modulated signal output at a channel wavelength different from the channel wavelength of other modulated sources and a wavelength selective combiner having an input optically coupled to received all the signal outputs from the modulated sources and provide a combined output signal on an output waveguide from the chip. The modulated sources, combiner and output waveguide are all integrated on the same chip.
    Type: Grant
    Filed: October 8, 2002
    Date of Patent: October 16, 2007
    Assignee: Infinera Corporation
    Inventors: David F. Welch, Vincent G. Dominic, Fred A. Kish, Jr., Mark J. Missey, Radhakrishnan L. Nagarajan, Atul Mathur, Frank H. Peters, Robert B. Taylor, Matthew L. Mitchell, Alan C. Nilsson, Stephen G. Grubb, Richard P. Schneider, Charles H. Joyner, Jonas Webjorn, Drew D. Perkins
  • Patent number: 7236656
    Abstract: An optical transport network comprises a monolithic transmitter photonic integrated circuit (TxPIC) InP-based chip and a monolithic receiver photonic integrated circuit (RxPIC) InP-based chip.
    Type: Grant
    Filed: November 15, 2005
    Date of Patent: June 26, 2007
    Assignee: Infinera Corporation
    Inventors: David F. Welch, Radhakrishnan L. Nagarajan, Fred A. Kish, Jr., Mark J. Missey, Vincent G. Dominic, Atul Mathur, Frank H. Peters, Charles H. Joyner, Richard P. Schneider, Ting-Kuang Chiang
  • Patent number: 7208770
    Abstract: In photonic integrated circuits (PICs) having at least one active semiconductor device, such as, a buried heterostructure semiconductor laser, LED, modulator, photodiode, heterojunction bipolar transistor, field effect transistor or other active device, a plurality of semiconductor layers are formed on a substrate with one of the layers being an active region. A current channel is formed through this active region defined by current blocking layers formed on adjacent sides of a designated active region channel where the blocking layers substantially confine the current through the channel. The blocking layers are characterized by being an aluminum-containing Group III-V compound, i.e., an Al-III-V layer, intentionally doped with oxygen from an oxide source. Also, wet oxide process or a deposited oxide source may be used to laterally form a native oxide of the Al-III-V layer.
    Type: Grant
    Filed: February 16, 2005
    Date of Patent: April 24, 2007
    Assignee: Infinera Corporation
    Inventors: Fred A. Kish, Jr., Sheila Hurtt, Charles H. Joyner, Richard P. Schneider
  • Patent number: 7122846
    Abstract: In photonic integrated circuits (PICs) having at least one active semiconductor device, such as, a buried heterostructure semiconductor laser, LED, modulator, photodiode, heterojunction bipolar transistor, field effect transistor or other active device, a plurality of semiconductor layers are formed on a substrate with one of the layers being an active region. A current channel is formed through this active region defined by current blocking layers formed on adjacent sides of a designated active region channel where the blocking layers substantially confine the current through the channel. The blocking layers are characterized by being an aluminum-containing Group III-V compound, i.e., an Al-III-V layer, intentionally doped with oxygen from an oxide source. Also, wet oxide process or a deposited oxide source may be used to laterally form a native oxide of the Al-III-V layer.
    Type: Grant
    Filed: February 16, 2005
    Date of Patent: October 17, 2006
    Assignee: Infinera Corporation
    Inventors: Fred A. Kish, Jr., Sheila Hurtt, Charles H. Joyner, Richard P. Schneider
  • Patent number: 7123786
    Abstract: An optical-to-electrical-to-optical converter comprises a monolithic receiver photonic integrated circuit (RxPIC) InP-based chip comprising an optical waveguide formed in the chip from a chip input to receive a first multiplexed channel signal from an optical link and provide them to an arrayed waveguide grating (AWG) which demultiplexes the multiplexed channel signals and provides a plurality of electrical channel signals to an electronic regenerator. The regenerator regenerates the electrical channel signals to an original signal waveform and provides the reformed electrical signals to a monolithic transmitter photonic integrated circuit (TxPIC) InP-based chip having an array of modulated sources formed in the chip that are coupled as inputs to an arrayed waveguide grating (AWG). The TxPIC modulates the reformed electrical signals to form a plurality of optical channel sign which are combined to form a second first multiplexed channel signal for transmission on an optical link.
    Type: Grant
    Filed: May 5, 2005
    Date of Patent: October 17, 2006
    Assignee: Infinera Corporation
    Inventors: David F. Welch, Radhakrishnan L. Nagarajan, Fred A. Kish, Jr., Mark J. Missey, Vincent G. Dominic, Atul Mathur, Frank H. Peters, Charles H. Joyner, Richard P. Schneider, Ting-Kuang Chiang