Abstract: An HMDS tank for use in an integrated circuit fabrication process includes a tank configured to hold HMDS having an first inlet port configured to receive a carrier gas below an HMDS surface level, an outlet port configured to release said carrier gas saturated with HMDS above the HMDS surface level, and a second inlet port configured to receive HMDS. A sensor is positioned in the tank at a predetermined HMDS level and configured to generate a sensor signal when the HMDS surface level falls below the predetermined HMDS level. A processor is coupled to the sensor and configured to generate a fill signal in response to the sensor signal to initiate introduction of HMDS into the tank through the second inlet port. In another embodiment, the HMDS tank further includes a second sensor positioned in the tank at a low HMDS level. The processor is also coupled to the second sensor and configured to generate an alarm signal in response to the second sensor signal to warn an operator of a low HMDS level in the tank.

Abstract: Pre- and post-processing of a semiconductor wafer within a main vacuum chamber is accomplished by a wafer holder disposed within a clam shell-like device. The clam shell device includes a first member disposed above the wafer holder and a second member disposed below the wafer holder in a facing relationship to the first member. The first member and the second member each have a respective mating surface. The first member and the second member are movable between a closed position wherein the mating surface of each of the first member and second member hermetically engage each other in an open position. The clam shell device forms an interior chamber when in its closed position. Gases are evacuated from the interior chamber, exteriorally of the main chamber, when the clam shell device is in in a closed position to avoid contamination of the vacuum environment.