Patents by Inventor Richard Vreeland

Richard Vreeland has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20210098359
    Abstract: Composite integrated circuit (IC) device structures that include two components coupled through hybrid bonded interconnect structure. The two components may be two different monolithic IC structures (e.g., chips) that are bonded over a substantially planar dielectric and metallization layer. A surface of a metallization feature may be augmented with supplemental metal, for example to at least partially backfill a recess in a surface of the metallization feature as left by a planarization process. In some exemplary embodiments, supplemental metal is deposited selectively onto a metallization feature through an autocatalytic (electroless) metal deposition process. A surface of a dielectric material surrounding a metallization feature may also be recessed, for example to at least partially neutralize a recess in an adjacent metallization feature, for example resulting from a planarization process.
    Type: Application
    Filed: September 26, 2019
    Publication date: April 1, 2021
    Applicant: Intel Corporation
    Inventors: Richard Vreeland, Colin Carver, William Brezinski, Michael Christenson, Nafees Kabir
  • Publication number: 20210098360
    Abstract: An integrated circuit interconnect structure includes a first interconnect in a first metallization level and a first dielectric adjacent to at least a portion of the first interconnect, where the first dielectric having a first carbon content. The integrated circuit interconnect structure further includes a second interconnect in a second metallization level above the first metallization level. The second interconnect includes a lowermost surface in contact with at least a portion of an uppermost surface of the first interconnect. A second dielectric having a second carbon content is adjacent to at least a portion of the second interconnect and the first dielectric. The first carbon concentration increases with distance away from the lowermost surface of the second interconnect and the second carbon concentration increases with distance away from the uppermost surface of the first interconnect.
    Type: Application
    Filed: September 27, 2019
    Publication date: April 1, 2021
    Applicant: Intel Corporation
    Inventors: Manish Chandhok, Ramanan Chebiam, Brennen Mueller, Colin Carver, Jeffery Bielefeld, Nafees Kabir, Richard Vreeland, William Brezinski
  • Publication number: 20210098387
    Abstract: Composite integrated circuit (IC) device structures that include two components coupled through a hybrid bonded composite interconnect structure. The two components may be two different monolithic IC structures (e.g., chips) that are bonded over substantially planar dielectric and metallization interfaces. Composite interconnect metallization features formed at a bond interface may be doped with a metal or chalcogenide dopant. The dopant may migrate to a periphery of the composite interconnect structure and form a barrier material that will then limit outdiffusion of a metal, such as copper, into adjacent dielectric material.
    Type: Application
    Filed: September 27, 2019
    Publication date: April 1, 2021
    Applicant: Intel Corporation
    Inventors: Carl Naylor, Mauro Kobrinsky, Richard Vreeland, Ramanan Chebiam, William Brezinski, Brennen Mueller, Jeffery Bielefeld
  • Publication number: 20210091194
    Abstract: Contact over active gate structures with metal oxide cap structures are described. In an example, an integrated circuit structure includes a plurality of gate structures above substrate, each of the gate structures including a gate insulating layer thereon. A plurality of conductive trench contact structures is alternating with the plurality of gate structures, each of the conductive trench contact structures including a metal oxide cap structure thereon. An interlayer dielectric material is over the plurality of gate structures and over the plurality of conductive trench contact structures. An opening is in the interlayer dielectric material and in a gate insulating layer of a corresponding one of the plurality of gate structures. A conductive via is in the opening, the conductive via in direct contact with the corresponding one of the plurality of gate structures, and the conductive via on a portion of one or more of the metal oxide cap structures.
    Type: Application
    Filed: September 23, 2019
    Publication date: March 25, 2021
    Inventors: Rami HOURANI, Richard VREELAND, Giselle ELBAZ, Manish CHANDHOK, Richard E. SCHENKER, Gurpreet SINGH, Florian GSTREIN, Nafees KABIR, Tristan A. TRONIC, Eungnak HAN
  • Patent number: 10747708
    Abstract: A system for communicating between electronic devices on a communication bus includes a communication bus and one or more communication circuits each having an output driver coupled to the communication bus and each having an input terminal. Each communication circuit produces, in response to a request message, a data communication on the communication bus in a predetermined order with respect to data communications from other communication circuits so that the data communications from each communication circuit form a sequential data stream in response to the request message.
    Type: Grant
    Filed: March 8, 2018
    Date of Patent: August 18, 2020
    Assignee: Allegro MicroSystems, LLC
    Inventors: Nevenka Kozomora, Richard Vreeland
  • Publication number: 20190355665
    Abstract: Embodiments include an interconnect structure and methods of forming an interconnect structure. In an embodiment, the interconnect structure comprises a semiconductor substrate and an interlayer dielectric (ILD) over the semiconductor substrate. In an embodiment, an interconnect layer is formed over the ILD. In an embodiment, the interconnect layer comprises a first interconnect and a second interconnect. In an embodiment the interconnect structure comprises an electrically insulating plug that separates the first interconnect and the second interconnect. In an embodiment an uppermost surface of the electrically insulating plug is above an uppermost surface of the interconnect layer.
    Type: Application
    Filed: May 21, 2018
    Publication date: November 21, 2019
    Inventors: Ehren MANNEBACH, Kevin LIN, Richard VREELAND
  • Publication number: 20190278737
    Abstract: A system for communicating between electronic devices on a communication bus includes a communication bus and one or more communication circuits each having an output driver coupled to the communication bus and each having an input terminal. Each communication circuit produces, in response to a request message, a data communication on the communication bus in a predetermined order with respect to data communications from other communication circuits so that the data communications from each communication circuit form a sequential data stream in response to the request message.
    Type: Application
    Filed: March 8, 2018
    Publication date: September 12, 2019
    Applicant: Allegro MicroSystems, LLC
    Inventors: Nevenka Kozomora, Richard Vreeland
  • Patent number: 9787495
    Abstract: A network slave device includes a transceiver for communicating over a communication bus in accordance with a point-to-point network protocol. The network slave device may include an address to identify the network slave device on the network. It may also include a communication circuit configured to process a command received by the transceiver and generate a reply for transmission over the communication bus if an address included in the command matches the address of the slave device. A master device communicating on the network may send commands including the address of the slave device in accordance with the point-to-point network protocol. In an embodiment, the point-to-point protocol is the SENT protocol.
    Type: Grant
    Filed: March 12, 2015
    Date of Patent: October 10, 2017
    Assignee: Allegro Microsystems, LLC
    Inventors: Richard Vreeland, Nevenka Kozomora, Michael C. Doogue, Ricardo Scheinkerman
  • Patent number: 9634715
    Abstract: A network slave device includes a transceiver for communicating over a communication bus in accordance with a point-to-point network protocol. The network slave device may have an address to identify the network slave device on the network. It may also have a communication circuit configured to process a series of commands received by the transceiver and respond to a command if a position of the command in the series of commands corresponds to the address of the network slave device. A master device communicating on the network may send the series of command in accordance with the point-to-point network protocol. In an embodiment, the point-to-point protocol is the SENT protocol.
    Type: Grant
    Filed: March 12, 2015
    Date of Patent: April 25, 2017
    Assignee: Allegro Microsystems, LLC
    Inventors: Ricardo Scheinkerman, Nevenka Kozomora, Michael C. Doogue, Richard Vreeland
  • Patent number: 9400164
    Abstract: A magnetic field sensor provides an angle error value to correct errors of the magnetic field sensor. The angle error value is a function of temperature and magnetic field strength and is used to correct a measured magnetic field angle. Associated methods are also described.
    Type: Grant
    Filed: July 22, 2013
    Date of Patent: July 26, 2016
    Assignee: Allegro Microsystems, LLC
    Inventors: Steven Daubert, Richard Vreeland
  • Publication number: 20150236869
    Abstract: A network slave device includes a transceiver for communicating over a communication bus in accordance with a point-to-point network protocol. The network slave device may include an address to identify the network slave device on the network. It may also include a communication circuit configured to process a command received by the transceiver and generate a reply for transmission over the communication bus if an address included in the command matches the address of the slave device. A master device communicating on the network may send commands including the address of the slave device in accordance with the point-to-point network protocol. In an embodiment, the point-to-point protocol is the SENT protocol.
    Type: Application
    Filed: March 12, 2015
    Publication date: August 20, 2015
    Applicant: Allegro MicroSystems, LLC
    Inventors: Richard Vreeland, Nevenka Kozomora, Michael C. Doogue, Ricardo Scheinkerman
  • Publication number: 20150236746
    Abstract: A network slave device includes a transceiver for communicating over a communication bus in accordance with a point-to-point network protocol. The network slave device may have an address to identify the network slave device on the network. It may also have a communication circuit configured to process a series of commands received by the transceiver and respond to a command if a position of the command in the series of commands corresponds to the address of the network slave device. A master device communicating on the network may send the series of command in accordance with the point-to-point network protocol. In an embodiment, the point-to-point protocol is the SENT protocol.
    Type: Application
    Filed: March 12, 2015
    Publication date: August 20, 2015
    Applicant: ALLEGRO MICROSYSTEMS, LLC
    Inventors: Ricardo Scheinkerman, Nevenka Kozomora, Michael C. Doogue, Richard Vreeland
  • Publication number: 20150022188
    Abstract: A magnetic field sensor provides an angle error value to correct errors of the magnetic field sensor. The angle error value is a function of temperature and magnetic field strength and is used to correct a measured magnetic field angle. Associated methods are also described.
    Type: Application
    Filed: July 22, 2013
    Publication date: January 22, 2015
    Applicant: Allegro Microsystems, LLC
    Inventors: Steven Daubert, Richard Vreeland