Abstract: Improved actuator apparatus and methodologies for manufacturing and using the same. In one exemplary embodiment, the actuator apparatus includes an SMA filament that: (1) minimizes size and increases stroke length via a serpentine-like routing of the SMA filament within the device itself; (2) reduces power consumption as a result of a relatively flat stroke force as a function of stroke displacement operating profile; (3) enables the actuator assembly to remain in a fully actuated state, at a consistent stroke force, for longer periods of time; and (4) is also fully reversible so as to be capable of use in both push-based and pull-based actuator applications. Methods of operation and manufacturing associated with the aforementioned actuator apparatus are also disclosed.

Abstract: Improved actuator apparatus and methodologies for manufacturing and using the same. In one exemplary embodiment, the actuator apparatus includes an SMA filament that: (1) minimizes size and increases stroke length via a serpentine-like routing of the SMA filament within the device itself; (2) reduces power consumption as a result of a relatively flat stroke force as a function of stroke displacement operating profile; (3) enables the actuator assembly to remain in a fully actuated state, at a consistent stroke force, for longer periods of time; and (4) is also fully reversible so as to be capable of use in both push-based and pull-based actuator applications. Methods of operation and manufacturing associated with the aforementioned actuator apparatus are also disclosed.

Abstract: Improved actuator apparatus and methodologies for manufacturing and using the same. In one exemplary embodiment, the actuator apparatus includes an SMA filament that: (1) minimizes size and increases stroke length via a serpentine-like routing of the SMA filament within the device itself; (2) reduces power consumption as a result of a relatively flat stroke force as a function of stroke displacement operating profile; (3) enables the actuator assembly to remain in a fully actuated state, at a consistent stroke force, for longer periods of time; and (4) is also fully reversible so as to be capable of use in both push-based and pull-based actuator applications. Methods of operation and manufacturing associated with the aforementioned actuator apparatus are also disclosed.

Abstract: Power-efficient actuator apparatus and methods. In one exemplary embodiment, the actuator assembly utilizes a shape memory alloy (SMA) filament driven by an electronic power source to induce movement in the underlying assembly to actuate a load (e.g., water valve). In addition, a circuit board is included which allows the actuator assembly to be readily incorporated or retrofit into a wide range of systems such that the signal characteristics of the supply line can, among other applications, be conditioned in order to protect the SMA filament. Furthermore, the circuit board can also readily be adapted for use with “green” power sources such as photovoltaic systems and the like. Methods for manufacturing and utilizing the aforementioned actuator assembly are also disclosed.

Abstract: Apparatus and methods for filament crimping. In one embodiment, the apparatus comprises a body and a filament crimp element. The filament crimp element comprises a first set of cavities disposed at a spacing which creates a first set of features and a second set of cavities disposed at a spacing which creates a second set of features. The first and second set cavities are substantially opposite one another. The first set of features are adapted to be placed at least partially within the second set of cavities and the second set of features are adapted to be placed at least partially within the first set of cavities. Methods and apparatus for the manufacture of the device are also disclosed. In addition, methods for automated placement and manufacture of assemblies using the crimp elements are also disclosed.

Abstract: Actuator apparatus having a multi-stable element actuated by memory alloy actuating elements. In one embodiment, the multi-stable actuator comprises a bistable (two-state) diaphragm element adapted to alternate between two stable configurations via forces exerted on the diaphragm by more than one memory alloy filaments in response to thermal activation. In another embodiment, the bistable diaphragm of the multi-stable actuator transitions from a first to a second stable configuration via forces exerted by a single filament in response to direct or indirect thermal activation. A portion of the assembly is displaced when the assembly is in the second configuration. The bistable diaphragm transitions back to the first stable configuration via application of mechanical force on a portion of the assembly which was displaced. Methods for making and using the bistable actuator apparatus are also disclosed.

Abstract: Apparatus and methods for filament crimping. In one embodiment, the apparatus comprises a body and a filament crimp element. The filament crimp element comprises a first set of cavities disposed at a spacing which creates a first set of features and a second set of cavities disposed at a spacing which creates a second set of features. The first and second set cavities are substantially opposite one another. The first set of features are adapted to be placed at least partially within the second set of cavities and the second set of features are adapted to be placed at least partially within the first set of cavities. Methods and apparatus for the manufacture of the device are also disclosed. In addition, methods for automated placement and manufacture of assemblies using the crimp elements are also disclosed.

Abstract: Power-efficient actuator apparatus and methods. In one exemplary embodiment, the actuator assembly utilizes a shape memory alloy (SMA) filament driven by an electronic power source to induce movement in the underlying assembly to actuate a load (e.g., water valve). In addition, a circuit board is included which allows the actuator assembly to be readily incorporated or retrofit into a wide range of systems such that the signal characteristics of the supply line can, among other applications, be conditioned in order to protect the SMA filament. Furthermore, the circuit board can also readily be adapted for use with “green” power sources such as photovoltaic systems and the like. Methods for manufacturing and utilizing the aforementioned actuator assembly are also disclosed.

Abstract: Apparatus and methods for filament crimping. In one embodiment, the apparatus comprises a body and a filament crimp element. The filament crimp element comprises a first set of cavities disposed at a spacing which creates a first set of features and a second set of cavities disposed at a spacing which creates a second set of features. The first and second set cavities are substantially opposite one another. The first set of features are adapted to be placed at least partially within the second set of cavities and the second set of features are adapted to be placed at least partially within the first set of cavities. Methods and apparatus for the manufacture of the device are also disclosed. In addition, methods for automated placement and manufacture of assemblies using the crimp elements are also disclosed.

Abstract: A shielding apparatus useful in the attenuation of electronic noise or spurious electric signals is disclosed. In one embodiment, the shielding apparatus is encapsulated with an electronic component such as an integrated circuit. At least parts of the apparatus are formed using a selective metal deposition process (e.g., electroforming) that increases manufacturing efficiency and provides enhanced mechanical and structural features, as well as reduced cost. In another embodiment, the shielding apparatus comprises an array. Methods of manufacturing and utilizing the shielding apparatus are also disclosed.

Abstract: Apparatus and methods for filament crimping. In one embodiment, the apparatus comprises a body and a filament crimp element. The filament crimp element comprises a first set of cavities disposed at a spacing which creates a first set of features and a second set of cavities disposed at a spacing which creates a second set of features. The first and second set cavities are substantially opposite one another. The first set of features are adapted to be placed at least partially within the second set of cavities and the second set of features are adapted to be placed at least partially within the first set of cavities. Methods and apparatus for the manufacture of the device are also disclosed. In addition, methods for automated placement and manufacture of assemblies using the crimp elements are also disclosed.

Abstract: Apparatus and methods for filament crimping. In one embodiment, the apparatus comprises a body and a filament crimp element. The filament crimp element comprises a first set of cavities disposed at a spacing which creates a first set of features and a second set of cavities disposed at a spacing which creates a second set of features. The first and second set cavities are substantially opposite one another. The first set of features are adapted to be placed at least partially within the second set of cavities and the second set of features are adapted to be placed at least partially within the first set of cavities. Methods and apparatus for the manufacture of the device are also disclosed. In addition, methods for automated placement and manufacture of assemblies using the crimp elements are also disclosed.

Abstract: A shield assembly useful in the attenuation of electronic noise or spurious electric signals. In one embodiment, the shielding assembly comprises a metallic component that is encapsulated with an electronic component to be shielded, such as an integrated circuit. A conductive coating is applied to an exterior surface of the encapsulated metallic and electronic components so that it is in contact with the metallic component. The metallic component is formed using a selective metal deposition process (e.g., electroforming) and a laser-cutting process that increase manufacturing efficiency and provide enhanced mechanical and structural features, including especially the ability to make the shield very thin, have a high degree of co planarity, and maintain a low profile for the shielded electronic component as a whole (i.e., add very little height to that of the electronic component). Methods of manufacturing and utilizing the shielding assembly in designs are also disclosed.

Abstract: Apparatus and methods for filament crimping. In one embodiment, the apparatus comprises a body and a filament crimp element. The filament crimp element comprises a first set of cavities disposed at a spacing which creates a first set of features and a second set of cavities disposed at a spacing which creates a second set of features. The first and second set cavities are substantially opposite one another. The first set of features are adapted to be placed at least partially within the second set of cavities and the second set of features are adapted to be placed at least partially within the first set of cavities. Methods and apparatus for the manufacture of the device are also disclosed. In addition, methods for automated placement and manufacture of assemblies using the crimp elements are also disclosed.

Abstract: Apparatus and methods for filament crimping. In one embodiment, the apparatus comprises a body and a filament crimp element. The filament crimp element comprises a first set of cavities disposed at a spacing which creates a first set of features and a second set of cavities disposed at a spacing which creates a second set of features. The first and second set cavities are substantially opposite one another. The first set of features are adapted to be placed at least partially within the second set of cavities and the second set of features are adapted to be placed at least partially within the first set of cavities. Methods and apparatus for the manufacture of the device are also disclosed. In addition, methods for automated placement and manufacture of assemblies using the crimp elements are also disclosed.

Abstract: A shielding apparatus useful in the attenuation of electronic noise or spurious electric signals is disclosed. In one embodiment, the shielding apparatus is encapsulated with an electronic component such as an integrated circuit. At least parts of the apparatus are formed using a selective metal deposition process (e.g., electroforming) that increases manufacturing efficiency and provides enhanced mechanical and structural features, as well as reduced cost. In another embodiment, the shielding apparatus comprises an array. Methods of manufacturing and utilizing the shielding apparatus are also disclosed.

Abstract: A socket or clip adapted to provide an interconnect between an electronic component, such as an automotive blade fuse, and a printed circuit board or other device. The clip comprises a substantially unitary structure for attaching the electronic component to the printed circuit board substrate. In one embodiment, the clip also comprises a closed-entry structure receiving element to receive the electronic component; a terminating element for interfacing the clip to the printed circuit board; a spring clip element for receiving terminations from said electronic component; and an overstress feature for preventing the spring clip element from becoming overstressed.

Abstract: Apparatus and methods for filament crimping. In one embodiment, the apparatus comprises a body and a filament crimp element. The filament crimp element comprises a first set of cavities disposed at a spacing which creates a first set of features and a second set of cavities disposed at a spacing which creates a second set of features. The first and second set cavities are substantially opposite one another. The first set of features are adapted to be placed at least partially within the second set of cavities and the second set of features are adapted to be placed at least partially within the first set of cavities. Methods and apparatus for the manufacture of the device are also disclosed. In addition, methods for automated placement and manufacture of assemblies using the crimp elements are also disclosed.

Abstract: In order to allow header-less connector pins to be directly surface mounted to a PCB, using a standard pick and place machine, a novel pin holder is used to hold the pin while in pockets or holes of a reeled tape and during its pick and placement by the suction head of the pick and place machine supplied with the reel. The holder is configured to permit standard pin spacings of a row of pins to match standard female connectors, and to allow observation of the pin during the placement process. Novel pin designs for use with the holder are also described.

Abstract: An electrical conductor contact having opposed cantilever fingers configured to mate with a mating contact at a low mating force is provided. Each finger has a contact portion at its free end. The contact portions are offset axially from each other in the longitudinal direction of insertion of a mating contact thereby permitting the surface of the contact portion of the upper finger to be located below the surface of the contact portion of the lower finger. The contact portions are also preferably offset axially from each other along the other spatial axes. The contact configuration reduces the maximum mating force and permits plating of the contacts with a minimum amount of precious metals. The invention further provides a receptacle connector for low force mating with a pin header in printed circuit board applications which is comprised of a plurality of electrical contacts so configured, and a specially configured housing for housing and preloading the plurality of electrical conductor contacts.