Patents by Inventor Robert C. Pandorf

Robert C. Pandorf has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 5932332
    Abstract: The disclosed pressure transducer assembly includes an external enclosure, a thermal shell disposed within the external enclosure, and a pressure sensor disposed within the thermal shell. The pressure sensor senses the gas or vapor pressure present in a tube coupling the sensor to a source of pressurized gas or vapor. The assembly includes a device for heating the thermal shell, and thermal insulation is disposed between the thermal shell and the external enclosure. The thermal insulation includes a plurality of metalized high temperature films stacked one on top of another and a plurality of spacer layers, each of the spacer layers being disposed between adjacent ones of the metalized high temperature films.
    Type: Grant
    Filed: May 27, 1997
    Date of Patent: August 3, 1999
    Assignee: MKS Instruments, Inc.
    Inventors: Robert C. Pandorf, Paul W. Navarro
  • Patent number: 5808206
    Abstract: The disclosed pressure transducer assembly includes an external enclosure, a thermal shell disposed within the external enclosure, and a pressure sensor disposed within the thermal shell. The pressure sensor senses the gas or vapor pressure present in a tube coupling the sensor to a source of pressurized gas or vapor. The assembly includes a device for heating the thermal shell, and thermal insulation is disposed between the thermal shell and the external enclosure. The thermal insulation includes a plurality of metalized high temperature films stacked one on top of another and a plurality of spacer layers, each of the spacer layers being disposed between adjacent ones of the metalized high temperature films.
    Type: Grant
    Filed: July 15, 1996
    Date of Patent: September 15, 1998
    Assignee: MKS Instruments, Inc.
    Inventors: Robert C. Pandorf, Paul W. Navarro
  • Patent number: 5625152
    Abstract: The disclosed heated pressure transducer includes an external enclosure, a first thermal shell housed within the external enclosure, and a sensor housed within the first thermal shell. The transducer further includes a heater for heating the first thermal shell and a control unit for controlling the heater. A tube couples the sensor to a source of heated, pressurized gas and the transducer may further include a tube-heater that is controlled by the control unit for applying heat to the tube. The transducer may also include a second thermal shell housed within the external enclosure with at least a portion of the control unit being housed within the second thermal shell. A heater that is controlled by the control unit may be disposed proximal to the second thermal shell for heating that shell. An auxiliary heater disposed within the first thermal shell for heating the sensor may also be included. Two thermistors may also be included for measuring the temperature of the sensor and the first thermal shell.
    Type: Grant
    Filed: January 16, 1996
    Date of Patent: April 29, 1997
    Assignee: MKS Instruments, Inc.
    Inventors: Robert C. Pandorf, Archibald J. DeMone, Frank W. Thomas, Steven D. Blankenship
  • Patent number: 5271277
    Abstract: The present invention provides a capacitance pressure transducer of increased thermal and mechanical stability and thus performance over prior art designs. A cell formed by a cell housing containing a plane parallel capacitor plate and an inlet tube is connected to an outer protective cover solely by the inlet tube. The cell housing is contained within an air tight environmental enclosure (also supported solely by the inlet tube) of sufficient rigidity as to isolate the cell housing from changes in atmospheric pressure. The plane parallel capacitor plate is formed by a circular diaphragm peripherally connected to the tension ring and an electrode disk located within the tension ring.
    Type: Grant
    Filed: December 23, 1991
    Date of Patent: December 21, 1993
    Assignee: The BOC Group, Inc.
    Inventor: Robert C. Pandorf
  • Patent number: 4719938
    Abstract: The pressure relief valve is debris resistant, self-cleaning, and self-actuating in a cryopump. It includes an o-ring carried by a valve member within a valve cylinder. In opening, the valve member moves away from an end port to open vent ports in the side of the valve cylinder while withdrawing the o-ring to a debris free and protected region of the valve. As the valve member is moved into the closed position in response to an atmospherical pressure differential, a wiper ring cleans debris from the inner surface of the valve cylinder. A taper is provided on the inner surface of the cylinder to release compression on the vacuum sealing o-ring upon opening and to compress the o-ring as the valve member moves to the closed position. The wiper ring is expansible in order to provide a wiping action along the entire taper and prevent debris from reaching the o-ring. The end of the valve cylinder opposite to the end port serves as a shock absorber as the valve is opened.
    Type: Grant
    Filed: January 22, 1985
    Date of Patent: January 19, 1988
    Assignee: Helix Technology Corporation
    Inventor: Robert C. Pandorf
  • Patent number: 4718240
    Abstract: A cryopump is regenerated by means of an ejector pump which draws gas from the cryopump as the pump is warmed. The ejector is actuated by an inert gas. The same inert gas may also be used to purge the pump during evacuation.
    Type: Grant
    Filed: January 7, 1987
    Date of Patent: January 12, 1988
    Assignee: Helix Technology Corporation
    Inventors: Bruce R. Andeen, Robert C. Pandorf