Abstract: An electronic component has a semiconductor chip with chip contacts. The chip contacts are mechanically fixed on a wiring structure and electrically connected to the wiring structure. The wiring structure is formed as a region of a structured metal plate or as a region of a structured metal layer of a metal-clad base plate. Ideally, a panel having a number of component positions is provided for receiving a number of such an electronic component.

Abstract: An electronic component has at least a first semiconductor chip module, a second semiconductor chip module, and a substrate to accommodate the semiconductor chip modules. In this case, active chip surfaces of the two semiconductor chip modules each have a central contact area, which are disposed to face each other. The individual solder contact areas formed on the central contact areas and corresponding with one another are opposite and aligned with one another and are electrically conductively connected.

Abstract: The invention relates to an electronic component (2) with at least one semiconductor chip (4) and a flat chip carrier (6) assigned to the at least one semiconductor chip, electrical connections between contact areas (43) on an active chip surface (41) of the semiconductor chip and contact terminal areas (63) on an upper side (61) of the chip carrier being formed by means of strips (81) of material which can undergo microstructuring and are provided with an electrically conductive coating. The invention also relates to a method for producing the electronic component (2).

Abstract: An electronic component is formed with at least two semiconductor chips that are disposed on a carrier substrate. Active chip surfaces of the semiconductor chips include central contact surfaces on which opposing solder contact surfaces are formed. These are conductively connected to an intermediate carrier which is disposed between the semiconductor chips and which produces rewirings from them to the carrier substrate. A method for fabricating the component is also described.

Abstract: An electronic component has at least a first semiconductor chip module, a second semiconductor chip module, and a substrate to accommodate the semiconductor chip modules. In this case, active chip surfaces of the two semiconductor chip modules each have a central contact area, which are disposed to face each other. The individual solder contact areas formed on the central contact areas and corresponding with one another are opposite and aligned with one another and are electrically conductively connected.

Abstract: An electronic component is formed with at least two semiconductor chips disposed on a carrier substrate. Active chip surfaces of the semiconductor chips comprise central contact surfaces, respectively, on which opposing solder contact surfaces are formed. These are conductively connected to an intermediate carrier which is disposed between the semiconductor chips and which produces rewirings from the chips to the carrier substrate.

Abstract: An electronic component has a carrier substrate to accommodate two semiconductor chips that are connected to each other. The second semiconductor chip rests with two opposite marginal supporting regions on an upper side of the carrier substrate. The first semiconductor chip is disposed at a distance from a frame of the carrier substrate, in a central recess in the latter. A process for the production of the electronic component is further described.

Abstract: An electronic component with shielding is described. The component has a semiconductor chip with a semiconductor substrate. Disposed in a region of a rear side of the semiconductor substrate is an electrically conductive buried layer. The buried layer is connected via a ground lead, disposed within the semiconductor substrate, to a contact area and an external ground potential. Furthermore, the invention relates to a method for producing an electronic component of this type.