Abstract: Photonic structures and photonic devices are provided. A photonic structure includes a three-dimensional photonic crystal and an actuator. The three-dimensional photonic crystal comprises an elastomeric, auxetic material and configured to provide a predetermined optical bandgap. The actuator is coupled to the three-dimensional photonic crystal and is configured to compress the three-dimensional photonic crystal. When the actuator compresses the three-dimensional photonic crystal, the three-dimensional photonic crystal shifts from reflecting light in a first wavelength range to light in a second wavelength range.

Abstract: A method of fabricating a multi-axis sensor is provided. The method includes forming patterns of sacrificial material overlaying a substrate and overlaying a flexible material on the sacrificial material and an anchor-surface of the substrate. The flexible material includes sensor-regions, an anchor-region, and at least one hinge-region. The method further includes forming sensor elements from orientable sensor material overlaying respective sensor-regions of the flexible material; forming at least one respective anchor-hinge in the flexible material along the boundary between the anchor-region and an adjacent sensor region; forming the sensor-regions, the anchor-region, and the at least one hinge-region in the flexible material; training the sensor elements to form respective oriented-sensor elements that are oriented in the same direction; etching the sacrificial material; and etching the substrate at an angle from the anchor-surface.

Abstract: An improved MEMS device and method of making. Channels are formed in a first substrate around a plurality of MEMS device areas previously formed on the first substrate. Then, a plurality of seal rings are applied around the plurality of MEMS device areas and over at least a portion of the formed channels. A second substrate is attached to the first substrate, then the seal ring surrounded MEMS device areas are separated from each other. The channels include first and second cross-sectional areas. The first cross-sectional area is sized to keep saw debris particles from entering the MEMS device area.

Abstract: A ground contact switch system comprises a first object configured to contact a ground surface during a stride, and one or more switches coupled to the first object. An inertial measurement unit can be coupled to the first object. The one or more switches are configured to detect when the first object is at a stationary portion of the stride. The one or more switches can also be configured to send a signal to activate an error correction scheme for the inertial measurement unit.

Abstract: A hermetically sealed MEMS device package comprises a MEMS device platform, a hermetic interface chip, and an outer seal ring. The MEMS device platform includes a MEMS device surrounded by a continuous outer boundary wall with a top surface. The hermetic interface chip includes a glass substrate and at least one silicon mesa. The glass substrate includes at least one hole and has a lower surface with an inner portion surrounded by an outer portion. The at least one silicon mesa is bonded to the inner portion of the lower surface of the glass substrate, such that the at least one silicon mesa is aligned with the at least one hole in the glass substrate. The outer seal ring bonds the outer portion of the lower surface of the glass substrate to the top surface of the continuous outer boundary wall of the MEMS device platform.

Abstract: An eye tracking system includes a transparent lens, at least one light source, and a plurality of light detectors. The transparent lens is adapted for disposal adjacent an eye. The at least one light source is disposed within the transparent lens and is configured to emit light toward the eye. The at least one light source is transparent to visible light. The plurality of light detectors is disposed within the transparent lens and is configured to receive light that is emitted from the at least one light source and is reflected off of the eye. Each of the light detectors is transparent to visible light and is configured, upon receipt of light that is reflected off of the eye, to supply an output signal.

Abstract: A lateration system comprising at least one transmitter attached to a first object and configured to emit pulses, three or more receivers attached to at least one second object and configured to receive the pulses emitted by the transmitter, and a processor configured to process information received from the three or more receivers, and to generate a vector based on lateration. Lateration is one of multilateration and trilateration. The vector is used by the processor to constrain error growth in a navigation solution.

Abstract: Systems and methods for enabling hermetic sealing at the wafer level during fabrication of a microelectromechanical sensor (MEMS) device. The MEMS device has a specialized hermetic interface chip (HIC) that facilitates a stable hermetic sealing process. The HIC includes a plurality of vias in a substrate layer, a plurality of mesas having etched portions, a seal ring, a plurality of conductive leads on a first side of the HIC, and a plurality of conductive leads on a second side of the HIC. The plurality of conductive leads on the first side of the HIC feeds from the etched portions of the plurality of mesas through the plurality of vias in the substrate layer to the plurality of conductive leads on the second side of the HIC. The conductive leads are capable of connecting an external circuit to the MEMS device.

Abstract: An approach where items of different temperatures are bonded to each other such that upon cooling down they contract in size resulting in zero residual stress between the bonded items at an ambient temperature. If materials of the bonded items have different thermal expansion coefficients and the items are put together at different bonding temperatures, then they may have insignificant residual stress upon cooling down to the ambient temperature (e.g., room temperature) because the different ranges of the temperature drops compensate for the different contractions.

Abstract: An improved MEMS device and method of making. Channels are formed in a first substrate around a plurality of MEMS device areas previously formed on the first substrate. Then, a plurality of seal rings are applied around the plurality of MEMS device areas and over at least a portion of the formed channels. A second substrate is attached to the first substrate, then the seal ring surrounded MEMS device areas are separated from each other. The channels include first and second cross-sectional areas. The first cross-sectional area is sized to keep saw debris particles from entering the MEMS device area.

Abstract: A method of error compensation for an inertial measurement unit is provided. The method comprises providing a first object including an inertial measurement unit, providing a second object proximal to the first object, and determining an initial position and orientation of the first object. A motion update is triggered for the inertial measurement unit when the second object is stationary with respect to a ground surface. At least one position vector is measured between the first object and the second object when the first object is in motion and the second object is stationary. A distance, direction, and orientation of the second object with respect to the first object are calculated using the at least one position vector. An error correction is then determined for the inertial measurement unit from the calculated distance, direction, and orientation of the second object with respect to the first object.

Abstract: A ground contact switch system comprises a first object configured to contact a ground surface during a stride, and one or more switches coupled to the first object. An inertial measurement unit can be coupled to the first object. The one or more switches are configured to detect when the first object is at a stationary portion of the stride. The one or more switches can also be configured to send a signal to activate an error correction scheme for the inertial measurement unit.

Abstract: A lateration system comprising at least one transmitter attached to a first object and configured to emit pulses, three or more receivers attached to at least one second object and configured to receive the pulses emitted by the transmitter, and a processor configured to process information received from the three or more receivers, and to generate a vector based on lateration. Lateration is one of multilateration and trilateration. The vector is used by the processor to constrain error growth in a navigation solution.

Abstract: A method for fabricating a MEMS device having a top cap and an upper sense plate is described. The method includes producing a device wafer including an etched substrate, etched MEMS device components, and interconnect metal, a portion of the interconnect metal being bond pads and adding a metal wraparound layer to a back side, edges, and a portion of a front side of the device wafer. The method also includes producing an upper wafer including an etched substrate and interconnect metal, bonding the device wafer and the upper wafer, and dicing the bonded upper wafer and device wafer into individual MEMS devices.

Abstract: Methods of fabricating thinned comb MEMS devices are disclosed. A comb drive device in accordance with an illustrative embodiment of the present invention can include a number of interdigitated comb fingers some of which have a reduced thickness along at least a portion of their length relative to other comb fingers.

Abstract: An elongated robotic member that is simple in design and structure, relatively inexpensive and consumes little power. In one illustrative embodiment, one or more linear actuators are used in conjunction with two or more plates that are fixed at spaced locations along a spine member. Fixed between each pair of plates is one or more actuators, which when activated, pull or push corresponding portions of the plates towards or away from each other. This changes the relative orientation of the plate pairs, thus providing a bending movement. The spine preferably is flexible at least in the lateral direction, and bends in response to the relative movement of the plates. A number of plate pairs may be provided to create an arbitrarily long robotic member.

Abstract: A method for fabricating a MEMS device having a top cap and an upper sense plate is described. The method includes producing a device wafer including an etched substrate, etched MEMS device components, and interconnect metal, a portion of the interconnect metal being bond pads and adding a metal wraparound layer to a back side, edges, and a portion of a front side of the device wafer. The method also includes producing an upper wafer including an etched substrate and interconnect metal, bonding the device wafer and the upper wafer, and dicing the bonded upper wafer and device wafer into individual MEMS devices.

Abstract: Layers of boron-doped silicon having reduced out-of-plane curvature are disclosed. The layers have substantially equal concentrations of boron near the top and bottom surfaces. Since the opposing concentrations are substantially equal, the compressive stresses on the layers are substantially balanced, thereby resulting in layers with reduced out-of-plane curvature.

Abstract: Layers of boron-doped silicon having reduced out-of-plane curvature are disclosed. The layers have substantially equal concentrations of boron near the top and bottom surfaces. Since the opposing concentrations are substantially equal, the compressive stresses on the layers are substantially balanced, thereby resulting in layers with reduced out-of-plane curvature.

Abstract: A method for providing conductive paths into a hermetically sealed cavity is described. The sealed cavity is formed utilizing a silicon-glass micro-electromechanical structure (MEMS) process and the method includes forming recesses on a glass substrate everywhere that a conductive path is to pass into the cavity, and forming conductive leads in and around the recesses. A glass layer is deposited over the substrate, into the recesses, and over the conductive leads and then planarized to expose portions of the conductive leads. A sealing surface is formed on at least a portion of the glass layer. Silicon is then bonded to the sealing surface of the planarized glass layer, the wafer being configured such that a portion of each lead is within the sealed cavity and a portion of each lead is outside the sealed cavity.