Patents by Inventor Robert D. Tolles
Robert D. Tolles has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11772234Abstract: In one embodiment, a fluid delivery apparatus includes a vessel body having a first chamber and a second chamber disposed therein, a plurality of first delivery lines fluidly coupled to the first chamber, a dispense nozzle fluidly coupled to the second chamber, a second delivery line fluidly coupled to the second chamber, and a valve disposed between the first and second chambers. Here, fluid communication between the first chamber and the second chamber is controlled by the valve disposed therebetween. Polishing fluid components are flowed into the first chamber through the plurality of first delivery lines fluidly coupled thereto to form a batch of polishing fluid. Once formed, the batch of polishing fluid is transferred to the second chamber by opening the valve.Type: GrantFiled: February 27, 2020Date of Patent: October 3, 2023Assignee: Applied Materials, Inc.Inventors: Robert D. Tolles, Kirk Liebscher
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Patent number: 11715193Abstract: A metrology technique for analyzing a substrate includes storing data indicating a boundary of an area in a 2-dimensional color space having a pair of color channels including a first color channel and a second color channel as axes of the color space, receiving color data of a substrate from a camera, generating a color image of the substrate from the color data, performing a comparison of a pair of color values for the pair of color channels for the pixel to the boundary of the area in the 2-dimensional color space for each pixel of a plurality of pixels of the color image to determine whether the pair of color values meet thresholds provided by the boundary, and generating a signal to an operator based on results of the comparison for the plurality of pixels.Type: GrantFiled: January 15, 2020Date of Patent: August 1, 2023Assignee: Applied Materials, Inc.Inventors: Dominic J. Benvegnu, Robert D. Tolles, Boguslaw A. Swedek, Abraham Ravid
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Publication number: 20210122008Abstract: In one embodiment, a fluid delivery apparatus includes a vessel body having a first chamber and a second chamber disposed therein, a plurality of first delivery lines fluidly coupled to the first chamber, a dispense nozzle fluidly coupled to the second chamber, a second delivery line fluidly coupled to the second chamber, and a valve disposed between the first and second chambers. Here, fluid communication between the first chamber and the second chamber is controlled by the valve disposed therebetween. Polishing fluid components are flowed into the first chamber through the plurality of first delivery lines fluidly coupled thereto to form a batch of polishing fluid. Once formed, the batch of polishing fluid is transferred to the second chamber by opening the valve.Type: ApplicationFiled: February 27, 2020Publication date: April 29, 2021Inventors: Robert D. TOLLES, Kirk LIEBSCHER
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Patent number: 10800000Abstract: The present disclosure relates generally to a polishing article, and apparatus and methods of chemical mechanical polishing substrates using the polishing article. In some embodiments, the polishing article, such as a polishing pad, includes multiple layers in which one or more layers (i.e., at least the top layer) includes a plurality of nano-fibers that a positioned to contact a substrate during a polishing process. In one embodiment, a polishing article comprises a layer having a thickness less than about 0.032 inches, and the layer comprising fibers having a diameter of about 10 nanometers to about 200 micro meters.Type: GrantFiled: January 29, 2016Date of Patent: October 13, 2020Assignee: APPLIED MATERIALS, INC.Inventors: Robert D. Tolles, Mahendra C. Orilall, Fred C. Redeker, Rajeev Bajaj
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Patent number: 10786885Abstract: A method and apparatus for polishing a substrate that includes a polishing article comprising a polymeric sheet having a raised surface texture, which is formed on the surface of the polymeric sheet is provided. According to one or more implementations of the present disclosure, an advanced polishing article has been developed, which does not require abrasive pad conditioning. In some implementations of the present disclosure, the advanced polishing article comprises a polymeric sheet having a polishing surface with a raised surface texture or “micro-features” and/or a plurality of grooves or “macro-features” formed in the polishing surface. In some implementations, the raised surface texture is embossed, etched, machined or otherwise formed in the polishing surface prior to installing and using the advanced polishing article in a polishing system. In one implementation, the raised features have a height within one order of magnitude of the features removed from the substrate during polishing.Type: GrantFiled: January 19, 2018Date of Patent: September 29, 2020Assignee: APPLIED MATERIALS, INC.Inventors: Robert D. Tolles, Gregory E. Menk, Eric Davey, You Wang, Huyen Karen Tran, Fred C. Redeker, Veera Raghava Reddy Kakireddy, Ekaterina Mikhaylichenko, Jay Gurusamy
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Publication number: 20200151868Abstract: A metrology technique for analyzing a substrate includes storing data indicating a boundary of an area in a 2-dimensional color space having a pair of color channels including a first color channel and a second color channel as axes of the color space, receiving color data of a substrate from a camera, generating a color image of the substrate from the color data, performing a comparison of a pair of color values for the pair of color channels for the pixel to the boundary of the area in the 2-dimensional color space for each pixel of a plurality of pixels of the color image to determine whether the pair of color values meet thresholds provided by the boundary, and generating a signal to an operator based on results of the comparison for the plurality of pixels.Type: ApplicationFiled: January 15, 2020Publication date: May 14, 2020Inventors: Dominic J. Benvegnu, Robert D. Tolles, Boguslaw A. Swedek, Abraham Ravid
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Patent number: 10565701Abstract: A polishing system includes a polishing station including a platen to support a polishing pad, a support to hold a substrate, an in-line metrology station to measure the substrate before or after polishing of a surface of the substrate in the polishing station, and a controller. The in-line metrology station includes a color line-scan camera, a white light source, a frame supporting the light source and the camera, and a motor to cause relative motion between the camera and the support along a second axis perpendicular to the first axis to cause the light source and the camera to scan across the substrate. The controller is configured to receive a color data from the camera, to generate a 2-dimensional color image from the color data, and to control polishing at the polishing station based on the color image.Type: GrantFiled: November 16, 2015Date of Patent: February 18, 2020Assignee: Applied Materials, Inc.Inventors: Dominic J. Benvegnu, Robert D. Tolles, Boguslaw A. Swedek, Abraham Ravid
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Publication number: 20190030677Abstract: Implementations described herein generally relate to methods and apparatus for polishing substrates, more particularly, to methods and apparatus for identifying and/or tracking polishing material in a roll-to-roll polishing system. In one implementation, a method of polishing a substrate is provided. The method comprises advancing a polishing material across a surface of a platen. The polishing material has a polishing surface and an opposing backside surface and the backside surface has a pattern of identifying features formed thereon. The method further comprises sensing the movement of the pattern of identifying features past a detector assembly. The method further comprises controlling a position of the polishing material relative to the platen based on data received from the sensed movement of the pattern of identifying features.Type: ApplicationFiled: July 17, 2018Publication date: January 31, 2019Inventors: Jeonghoon OH, David J. LISCHKA, Erik RONDUM, Jay GURUSAMY, Robert D. TOLLES, Steven M. ZUNIGA, Steven M. REEDY, Wai- Ming KAN
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Publication number: 20180207770Abstract: A method and apparatus for polishing a substrate that includes a polishing article comprising a polymeric sheet having a raised surface texture, which is formed on the surface of the polymeric sheet is provided. According to one or more implementations of the present disclosure, an advanced polishing article has been developed, which does not require abrasive pad conditioning. In some implementations of the present disclosure, the advanced polishing article comprises a polymeric sheet having a polishing surface with a raised surface texture or “micro-features” and/or a plurality of grooves or “macro-features” formed in the polishing surface. In some implementations, the raised surface texture is embossed, etched, machined or otherwise formed in the polishing surface prior to installing and using the advanced polishing article in a polishing system. In one implementation, the raised features have a height within one order of magnitude of the features removed from the substrate during polishing.Type: ApplicationFiled: January 19, 2018Publication date: July 26, 2018Inventors: Robert D. TOLLES, Gregory E. MENK, Eric DAVEY, You WANG, Huyen Karen TRAN, Fred C. REDEKER, Veera Raghava Reddy KAKIREDDY, Ekaterina MIKHAYLICHENKO, Jay GURUSAMY
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Publication number: 20180009079Abstract: The present disclosure relates generally to a polishing article, and apparatus and methods of chemical mechanical polishing substrates using the polishing article. In some embodiments, the polishing article, such as a polishing pad, includes multiple layers in which one or more layers (i.e., at least the top layer) includes a plurality of nano-fibers that a positioned to contact a substrate during a polishing process. In one embodiment, a polishing article comprises a layer having a thickness less than about 0.032 inches, and the layer comprising fibers having a diameter of about 10 nanometers to about 200 micro meters.Type: ApplicationFiled: January 29, 2016Publication date: January 11, 2018Inventors: Robert D. TOLLES, Mahendra C. ORILALL, Fred C. REDEKER, Rajeev BAJAJ
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Publication number: 20170140525Abstract: A polishing system includes a polishing station including a platen to support a polishing pad, a support to hold a substrate, an in-line metrology station to measure the substrate before or after polishing of a surface of the substrate in the polishing station, and a controller. The in-line metrology station includes a color line-scan camera, a white light source, a frame supporting the light source and the camera, and a motor to cause relative motion between the camera and the support along a second axis perpendicular to the first axis to cause the light source and the camera to scan across the substrate. The controller is configured to receive a color data from the camera, to generate a 2-dimensional color image from the color data, and to control polishing at the polishing station based on the color image.Type: ApplicationFiled: November 16, 2015Publication date: May 18, 2017Inventors: Dominic J. Benvegnu, Robert D. Tolles, Boguslaw A. Swedek, Abraham Ravid
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Patent number: 8545660Abstract: A bonding apparatus and method holds first and second bodies peripherally, one above the other, on respective shelves. A lower heat-transfer body is configured to lift the first body from below and press the first and second bodies against an upper heat-transfer body to enable bonding between the first and second bodies.Type: GrantFiled: March 20, 2012Date of Patent: October 1, 2013Assignee: GTAT CorporationInventors: Steven M. Zuniga, Robert D. Tolles, Derek G. Aqui, Andrew J. Nagengast, Anthony J. Senn, Keenan Leon Guerrero
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Patent number: 8151852Abstract: A bonding apparatus and method holds first and second bodies peripherally, one above the other, on respective shelves. A lower heat-transfer body is configured to lift the first body from below and press the first and second bodies against an upper heat-transfer body to enable bonding between the first and second bodies.Type: GrantFiled: June 30, 2009Date of Patent: April 10, 2012Assignee: Twin Creeks Technologies, Inc.Inventors: Steven M. Zuniga, Robert D. Tolles, Derek G. Aqui, Andrew J. Nagengast, Anthony J. Senn, Keenan Leon Guerrero
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Patent number: 8079894Abstract: A chemical-mechanical polishing apparatus including a table top, a transfer station mounted on the table top, a plurality of polishing stations mounted on the table top, a plurality of washing stations, and a plurality of carrier heads supported by a support member rotatable about an axis. Each washing station is located between a first polishing station and either a second polishing station or the transfer station, and the transfer station and the plurality of polishing stations are arranged at approximately equal angular intervals about the axis.Type: GrantFiled: October 16, 2009Date of Patent: December 20, 2011Assignee: Applied Materials, Inc.Inventors: Robert D. Tolles, Norman Shendon, Sasson Somekh, Ilya Perlov, Eugene Gantvarg, Harry Q. Lee
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Publication number: 20100330776Abstract: A bonding apparatus and method holds first and second bodies peripherally, one above the other, on respective shelves. A lower heat-transfer body is configured to lift the first body from below and press the first and second bodies against an upper heat-transfer body to enable bonding between the first and second bodies.Type: ApplicationFiled: June 30, 2009Publication date: December 30, 2010Inventors: Steven M. Zuniga, Robert D. Tolles, Derek G. Aqui, Andrew J. Nagengast, Anthony J. Senn, Keenan Leon Guerrero
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Patent number: 7754519Abstract: In some embodiments, a method of forming a photovoltaic cell includes (1) forming a cleave plane in a donor body so as to define a lamina to be bonded to a receiver element and exfoliated from the donor body; (2) prior to bonding, pre-heating the donor body without the receiver element to a temperature of greater than about 200° C. for a first time period that is less than a time period required for exfoliation of the lamina from the donor body; (3) cooling the donor body after pre-heating the donor body; (4) bonding the donor body to the receiver element; and (5) heating the bonded donor body and receiver element for a second time period so as to complete the exfoliation of the lamina from the donor body. Numerous other aspects are provided.Type: GrantFiled: May 13, 2009Date of Patent: July 13, 2010Assignee: Twin Creeks Technologies, Inc.Inventors: Robert D. Tolles, Aditya Agarwal, Orion Leland
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Patent number: 7677959Abstract: A polishing pad has a polishing layer with a polishing surface and a first registration mark, and a backing layer connected to the polishing layer and having a second registration mark aligned with the first registration mark. The polishing pad may have a window that includes an aperture in the backing layer aligned with a solid transparent portion in the polishing layer.Type: GrantFiled: March 13, 2006Date of Patent: March 16, 2010Assignee: Applied Materials, Inc.Inventor: Robert D. Tolles
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Publication number: 20100035526Abstract: A chemical-mechanical polishing apparatus including a table top, a transfer station mounted on the table top, a plurality of polishing stations mounted on the table top, a plurality of washing stations, and a plurality of carrier heads supported by a support member rotatable about an axis. Each washing station is located between a first polishing station and either a second polishing station or the transfer station, and the transfer station and the plurality of polishing stations are arranged at approximately equal angular intervals about the axis.Type: ApplicationFiled: October 16, 2009Publication date: February 11, 2010Applicant: APPLIED MATERIALS, INC.Inventors: Robert D. Tolles, Norman Shendon, Sasson Somekh, Ilya Perlov, Eugene Gantvarg, Harry Q. Lee
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Patent number: 7614939Abstract: A chemical-mechanical polishing apparatus including a table top, a transfer station mounted on the table top, a plurality of polishing stations mounted on the table top, a plurality of washing stations, and a plurality of carrier heads supported by a support member rotatable about an axis. Each washing station is located between a first polishing station and either a second polishing station or the transfer station, and the transfer station and the plurality of polishing stations are arranged at approximately equal angular intervals about the axis.Type: GrantFiled: June 7, 2007Date of Patent: November 10, 2009Assignee: Applied Materials, Inc.Inventors: Robert D. Tolles, Norman Shendon, Sasson Somekh, Ilya Perlov, Eugene Gantvarg, Harry Q. Lee
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Publication number: 20090044838Abstract: In a first aspect, an apparatus adapted to clean a semiconductor device manufacturing component is provided. The apparatus includes an ozone module adapted to (1) obtain Ozone; (2) combine the Ozone with a fluid to generate ozonated fluid; and (3) deliver the ozonated fluid to the semiconductor device manufacturing component so as to clean the semiconductor device manufacturing component. Numerous other aspects are provided.Type: ApplicationFiled: October 12, 2008Publication date: February 19, 2009Inventors: Bruce Willing, Daniel P. Forster, David Datong Huo, Robert D. Tolles, Christopher L. Haynes, Steven T. Mear, David Paul, William M. Evans