Abstract: A method for utilizing recycled asphalt is provided. In exemplary embodiments, the method may comprise: mixing input feed with at least one of an asphalt rejuvenator and virgin liquid asphalt in a pre-coater/mixer; allowing the at least one of the asphalt rejuvenator and the virgin liquid to soften residual asphalt in the input feed and encapsulate any fine particles; discharging the mixture into a spiral section; feeding the mixture into a rotary dryer comprising a counterflow zone and a temperature elevation zone; activating the drying process and directing a heated air stream into the rotary dryer through a rotating chamber; allowing a portion of the heated air to escape through the counterflow zone and into the temperature elevation zone; liberating surface moisture from the mixture along with a portion of the heated air via an outlet; processing the exhaust from the system; and discharging a finished mixture.

Abstract: A method for utilizing recycled asphalt is provided. In exemplary embodiments, the method may comprise: mixing input feed with at least one of an asphalt rejuvenator and virgin liquid asphalt in a pre-coater/mixer; allowing the at least one of the asphalt rejuvenator and the virgin liquid to soften residual asphalt in the input feed and encapsulate any fine particles; discharging the mixture into a spiral section; feeding the mixture into a rotary dryer comprising a counterflow zone and a temperature elevation zone; activating the drying process and directing a heated air stream into the rotary dryer through a rotating chamber; allowing a portion of the heated air to escape through the counterflow zone and into the temperature elevation zone; liberating surface moisture from the mixture along with a portion of the heated air via an outlet; processing the exhaust from the system; and discharging a finished mixture.

Abstract: An apparatus and method are disclosed for precisely positioning an object such as a circuit module (12, 108) by moving it a fixed distance from an unknown initial position, for the purpose, for example, of moving connector pins a fixed distance into associated socket connector springs (136). A resilient spring (40, 42, 100) is compressed between a fixed stop (18, 20, 90) and a member (48, 106) which engages the object; so that the object is moved an unknown distance (A, B, C) to an initial position determined by its encountering resistance which exceeds the force applied by the spring, such as the resistance provided by connector springs when connector pins are inserted. The compression existing in the bias spring is maintained when the initial position is reached while concurrently the engaging member (48, 106) is moved a fixed distance from the initial position, such as the desired insertion distance of connector pins into connector springs.

Abstract: In a continuous drum mix asphalt plant, dust is exhausted from an intermediate zone of the drum mixer between its drying and mixing zones. The dust is exhausted radially through openings into a collection housing, which communicates with a dust collector and exhaust blower. An end housing at the discharge end of the drum communicates with the same dust collector and blower. Dampers are provided to control the relative proportion of air exhausted from the drum through the respective housings. Aggregate deflectors on the interior wall of the drum at the intermediate zone allow air and dust to flow while inhibiting the flow of aggregate. The collection housing surrounding the intermediate zone is of a size such as to produce a reduction in the velocity of the air as it passes out of the drum. Consequently, it serves as a knock-out box for the collection of larger particles which are carried out of the drum, but which settle out of the air stream as a result of the velocity decrease.

Abstract: A gas encapsulated cooling module wherein at least one semiconductor chip to be cooled is supported on a substrate portion of the module the provision of a heat sink stud having a planar surface in thermal contact with a planar surface of the chip to be cooled, said stud being supported by a resilient thermally conductive bellow-like structure, whereby the planar surface of the stud is maintained in intimate thermal contact with the planar surface of the chip.

Abstract: The invention relates to apparatus for the testing of high circuit density devices fabricated by large scale integration techniques. More specifically, the invention is directed to a test fixture used in a test system for determining the merit or electrical integrity of small semiconductor chips, diced from a semiconductor wafer having a large number of chips. Each chip being a high circuit density device, e.g., a small monolithic semiconductor structure having a large number of closely spaced circuits thereon and therein.