Abstract: Described herein are methods for forming e-textiles, wherein the methods include printing a particle-free conductive ink on a textile substrate, and curing the textile substrate to produce a conductive pattern thereon. The printing may include inkjet printing and may produce a printed pattern which exhibits an ink bleed of less than 0.5 mm, such as less than 0.2 mm. During printing, the textile substrate may be heated to a temperature of 30° C. to 90° C. before and during the printing process. The fabric substrate may be cured using heat and/or light to produce a conductive pattern having a sheet resistance of less than 10 ?/?, or even less than 1 ?/?.

Abstract: Dielectric coating compositions are provided. The dielectric coating compositions generally include an aqueous binder, an inorganic nanoparticle, and a solvent, and can be formulated for specific printing methods, such as inkjet printing. The dielectric coating compositions are curable to provide scratch resistant coatings useful as insulating layers.

Abstract: Described herein are methods for forming e-textiles, wherein the methods include printing a particle-free conductive ink on a textile substrate, and curing the textile substrate to produce a conductive pattern thereon. The printing may include inkjet printing and may produce a printed pattern which exhibits an ink bleed of less than 0.5 mm, such as less than 0.2 mm. During printing, the textile substrate may be heated to a temperature of 30° C. to 90° C. before and during the printing process. The fabric substrate may be cured using heat and/or light to produce a conductive pattern having a sheet resistance of less than 10?/?, or even less than 1?/?.

Abstract: Described herein are triboelectric energy generators that generally include a first flexible layer having a first electron donating material coated on at least a first surface and an electron accepting material coated over the first electron donating material, and a second flexible layer having a second electron donating material coated on at least a first surface. The first and second layers are positioned adjacent each other with their first surfaces facing inward toward each other and separated by a gap distance. An electric potential is generated upon movement between the first and second flexible layers, such as at least alternating contact and no-contact between the first and second flexible layers. The electron donating material may be provided by a particle-free conductive ink.

Abstract: Dielectric coating compositions are provided. The dielectric coating compositions generally include an aqueous binder, an inorganic nanoparticle, and a solvent, and can be formulated for specific printing methods, such as inkjet printing. The dielectric coating compositions are curable to provide scratch resistant coatings useful as insulating layers.

Abstract: Described herein are methods for forming e-textiles, wherein the methods include printing a particle-free conductive ink on a textile substrate, and curing the textile substrate to produce a conductive pattern thereon. The printing may include inkjet printing and may produce a printed pattern which exhibits an ink bleed of less than 0.5 mm, such as less than 0.2 mm. During printing, the textile substrate may be heated to a temperature of 30° C. to 90° C. before and during the printing process. The fabric substrate may be cured using heat and/or light to produce a conductive pattern having a sheet resistance of less than 10?/?, or even less than 1?/?.

Abstract: A method of forming a chemical mechanical polishing pad includes providing a first reactant including an isocyanate functional polyurethane prepolymer at a temperature above about 60° C., providing a second reactant including a diamine at a temperature above about 100° C., impingement mixing the first reactant and the second reactant within an impingement mixer to begin formation of a polyurea polyurethane elastomer, wherein the mixing is at a ratio of the first reactant to the second reactant of about 3:1 to about 6:1, casting the polyurea polyurethane elastomer that is formed from the mixed first and second reactants; and forming the polyurea polyurethane elastomer into chemical mechanical polishing pad dimensions. The polyurea polyurethane elastomer may further be provided with surface grooves and can be used as a single layer pad or formed into various stacked pad arrangements.

Abstract: A polishing pad is attachable to a platen to minimize trapped air and polishing fluid intrusion. The pad comprises a polishing layer having a polishing surface on a first end of the pad and a polishing layer peripheral edge extending away from the polishing surface; a gas impermeable attaching layer defines an attachment surface for securing the pad to the platen at an opposed second end of the pad, the attaching layer having an attaching layer peripheral edge extending away from the attachment surface, wherein a peripheral edge of the pad extends from the polishing surface to the attaching surface formed of the peripheral edges of each pad layer; and a plurality of openings extending through the attaching layer. During pad attachment, trapped air flows through the attaching layer openings and out of the peripheral edge of the pad at a position spaced from the attaching layer peripheral edge.

Abstract: Provided is a process for preparing a polyurethane urea pad adapted to polish a microelectronic substrate. The pad includes at least partially gas-filled cells substantially uniformly distributed throughout. The process is s follows: forming a reaction mixture by adding to a mixing unit the following mixture components: (a) a polyisocyanate, (b) an amine-containing material, (c) a blowing agent, and (d) optionally, a hydroxyl-containing material; mechanically mixing the reaction mixture at a pressure of less than 20 bar; dispensing the reaction mixture into an open mold; and curing the reaction mixture to form a polyurethane urea, wherein the at least partially gas-filled cells comprise carbon dioxide produced by the reaction of the mixture components.

Abstract: The present invention relates to an article for altering a surface of a workpiece, or a polishing pad having a window. In particular, the polishing pad includes a polyurethane urea material wherein the polyurethane urea material contains cells which are at least partially filled with gas. The polyurethane urea material can be prepared by combining polyisocyanate and/or polyurethane prepolymer, hydroxyl-containing material, amine-containing material and blowing agent. The polishing pad according to the present invention is useful for polishing articles, and is especially useful for chemical mechanical polishing or planarization of microelectronic and optical electronic devices such as but not limited to semiconductor wafers. The window of the polishing pad is at least partially transparent and thus, can be particularly useful with polishing or planarizing tools that are equipped with through-the-platen wafer metrology.

Abstract: A polishing pad is described as comprising, (a) particulate polymer which can be chosen from particulate thermoplastic polymer (e.g., particulate thermoplastic polyurethane), particulate crosslinked polymer (e.g., particulate crosslinked polyurethane and/or particulate crosslinked polyepoxide) and mixtures thereof; and (b) organic polymer binder (e.g., polyurethane binder and/or polyepoxide binder), which can bind the particulate polymer together, wherein said organic polymer binder can be prepared in-situ. The particulate polymer and organic polymer binder can be distributed substantially across the work surface the polishing pad, and the pad can have a percent pore volume of from 2 percent by volume to 50 percent by volume, based on the total volume of said polishing pad.

Abstract: The present invention relates to a polishing pad. In particular, the polishing pad of the present invention comprises a sublayer, a middle layer, and a top layer which can function as a polishing layer. The polishing pad of the present invention is useful for polishing articles and particularly useful for chemical mechanical polishing or planarization of a microelectronic device, such as a semiconductor wafer.

Abstract: The present invention relates to a polishing pad. In particular, the polishing pad of the present invention can include a window area. The window area can be formed in the pad using a cast-in-place process. The polishing pad of the present invention can be useful for polishing articles and can be especially useful for chemical mechanical polishing or planarization of a microelectronic device, such as a semiconductor wafer. The window area of the polishing pad of the present invention can be particularly useful for polishing or planarizing tools that are equipped with through-the-platen wafer metrology.

Abstract: The present invention relates to a polishing pad. In particular, the polishing pad of the present invention can include a window. The polishing pad of the present invention can be useful for polishing articles and can be especially useful for chemical mechanical polishing or planarization of a microelectronic device, such as a semiconductor wafer. The window of the polishing pad is at least partially transparent and thus, can be particularly useful with polishing or planarizing tools that are equipped with through-the-platen wafer metrology.

Abstract: The present invention relates to a polishing pad. In particular, the polishing pad of the present invention comprises a sublayer, a middle layer, and a top layer which can function as a polishing layer. The polishing pad of the present invention is useful for polishing articles and particularly useful for chemical mechanical polishing or planarization of a microelectronic device, such as a semiconductor wafer.

Abstract: A polishing pad is described as comprising, (a) particulate polymer which can be chosen from particulate thermoplastic polymer (e.g., particulate thermoplastic polyurethane), particulate crosslinked polymer (e.g., particulate crosslinked polyurethane and/or particulate crosslinked polyepoxide) and mixtures thereof; and (b) organic polymer binder (e.g., polyurethane binder and/or polyepoxide binder), which can bind the particulate polymer together, wherein said organic polymer binder can be prepared in-situ. The particulate polymer and organic polymer binder can be distributed substantially across the work surface the polishing pad, and the pad can have a percent pore volume of from 2 percent by volume to 50 percent by volume, based on the total volume of said polishing pad.

Abstract: A polishing pad is described as comprising, (a) particulate polymer selected from particulate thermoplastic polymer (e.g., particulate thermoplastic polyurethane), particulate crosslinked polymer (e.g., particulate crosslinked polyurethane and/or particulate crosslinked polyepoxide) and mixtures thereof; and (b) crosslinked organic polymer binder (e.g., crosslinked polyurethane binder and/or crosslinked polyepoxide binder), which binds the particulate polymer together. The particulate polymer and crosslinked organic polymer binder are distributed substantially uniformly throughout the polishing pad, and the pad has a percent pore volume of from 2 percent by volume to 50 percent by volume, based on the total volume of said polishing pad. Polishing pad assemblies are also described.

Abstract: The presence of substantially water-insoluble plasticizer in the binder of a coating of an inkjet printing medium serves to reduce curl. The preferred substantially water-insoluble plasticizer is butyl benzyl phthalate.

Abstract: Organo-metal oxide chelates stable in aqueous compositions are provided by the reaction of metal alkoxide--where the metal is titanium, zinc, tungsten, or tin--and a polyalkylene glycol. Specific compounds are the reaction product of tetra alkyl titanates with diethylene glycol. Aqueous coating compositions containing the chelates may be applied to fiber glass at the filament stage or after forming into mats. When heat treated, the coated fiber glass serves as photocatalytic media.

Abstract: Aqueous peroxide-free size compositions for application to glass fibers contain, as essential components, a reaction product of a polymeric amine and an amine-reactable organosilane, a film-forming polymer and an emulsified polyolefin. The reaction product can be preformed or made in situ, and is preferably the product of a polyalkylene polyamine and an epoxy-functional alkoxysilane. An optional added component is a water-soluble, non-volatile carboxylic acid. Glass fibers treated with the size composition can be made into mats, especially continuous strand, needled mats, useful for reinforcing thermoplastic polymers such as polypropylene in laminates which then can be used in molding processes to make articles of good physical properties.