Patents by Inventor Robert J. Pichia

Robert J. Pichia has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 4477970
    Abstract: A method for preparing a printed circuit board for mounting of surface mounted RF components such that the lead inductance of the components is minimized. The process consists of producing plated through apertures in the printed circuit board to create a component body hole with lead contacts extending to the edge of the component body hole. The resulting aperture is then blanked to remove portions of the metal lining to provide electrical isolation between the lead contacts while maintaining lead contacts that extend to the edge of the component body hole. A component is then soldered into position such that solder is wicked through the plated through apertures to create solder contact of the leads at the edge of the component body hole. This results in substantial reduction in lead inductance improving RF amplifier gain and stability and improving bandwidth characteristics.
    Type: Grant
    Filed: April 1, 1982
    Date of Patent: October 23, 1984
    Assignee: Motorola, Inc.
    Inventors: Robert P. Alexander, Robert J. Pichia, Stephen F. Dauksch