Patents by Inventor Robert L. Schelhorn

Robert L. Schelhorn has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 5001829
    Abstract: A Leadless Chip Carrier (LCC) is mounted on a circuit board on elongated solder posts to provide clearance between the LCC and the board. The process for producing solder posts involves the deposition of a temporary stencil surrounding the conductive pads on the board. The removable stencil around the pads provides support for molten solder during reflow and prevents the chip carrier from compressing the molten solder thereby insuring desirable spacing between the chip carrier and the board.
    Type: Grant
    Filed: January 2, 1990
    Date of Patent: March 26, 1991
    Assignee: General Electric Company
    Inventor: Robert L. Schelhorn
  • Patent number: 4967315
    Abstract: The individual components of a shielded ceramic, RF mounting package are metallized on three of their outer surfaces. The package includes circuit supporting ceramic substrate metallized along its edges as well as on the horizontal surfaces to permit continuous metal contact between the substrate and a metallized ceramic seal ring and the metal lid and base of the package.
    Type: Grant
    Filed: January 2, 1990
    Date of Patent: October 30, 1990
    Assignee: General Electric Company
    Inventor: Robert L. Schelhorn
  • Patent number: 4647900
    Abstract: A high power thick film resistor having improved power handling capability is obtained with a resistor having two overlying thick film layers wherein the first thick film layer has a relatively low resistivity and the second thick film layer has a relatively high resistivity.
    Type: Grant
    Filed: August 16, 1985
    Date of Patent: March 3, 1987
    Assignee: RCA Corporation
    Inventors: Robert L. Schelhorn, Colleen A. Matier
  • Patent number: 4417296
    Abstract: A method (and the resulting article) comprises the step of providing a surface mounted package connector including a thermal buffer pad. Preferably the surface mounted package is mounted on a circuit board having preselected circuitry thereon. The present method provides a mounting capable of withstanding severe temperature cycling and thermal shocks.
    Type: Grant
    Filed: October 26, 1980
    Date of Patent: November 22, 1983
    Inventor: Robert L. Schelhorn
  • Patent number: 4393438
    Abstract: In accordance with this invention a porcelain coated metal board is provided which has flat surfaces and further has electrical connections between the face and reverse surfaces of the board. In accordance with a further aspect of this invention the boards of this invention are obtained by a method in which the connecting pins are sealed in a spaced relationship in apertures in the metal core of the board and insulated from the core prior to the application of the porcelain to the surfaces of the core.
    Type: Grant
    Filed: December 7, 1981
    Date of Patent: July 12, 1983
    Assignee: RCA Corporation
    Inventor: Robert L. Schelhorn
  • Patent number: 4383270
    Abstract: A porcelain coated steel substrate for receiving thick film printed circuit thereon includes thermally and electrically conductive pedestals which are in thermal and electrical contact with the steel core. The pedestal surface is coplanar with the porcelain coating so that a substantially continuous plane surface is present. This permits semiconductor chips readily to be mounted on the substrate, the pedestals serving as heat and electrical conductors to the substrate, and serves also to facilitate the deposition of thick film elements.
    Type: Grant
    Filed: July 10, 1980
    Date of Patent: May 10, 1983
    Assignee: RCA Corporation
    Inventor: Robert L. Schelhorn
  • Patent number: 4331700
    Abstract: An improved composite substrate comprises a patterned surface conductive layer of a refractory metal and a patterned compensation electrically conductive layer. The patterned compensation layer entirely overlies and extends beyond the shrunken patterned conductive layer. Additionally, thick film elements such as resistors are fabricated and contact selected areas of the patterned compensation conductive layer.
    Type: Grant
    Filed: April 28, 1981
    Date of Patent: May 25, 1982
    Assignee: RCA Corporation
    Inventor: Robert L. Schelhorn
  • Patent number: 4328614
    Abstract: In accordance with this invention a procelain coated metal board is provided which has flat surfaces and further has electrical connections between the face and reverse surfaces of the board. In accordance with a further aspect of this invention the boards of this invention are obtained by a method in which the connecting pins are sealed in a spaced relationship in apertures in the metal core of the board and insulated from the core prior to the application of the procelain to the surfaces of the core.
    Type: Grant
    Filed: March 24, 1980
    Date of Patent: May 11, 1982
    Assignee: RCA Corporation
    Inventor: Robert L. Schelhorn
  • Patent number: 4296272
    Abstract: An improved composite substrate comprises a patterned surface conductive layer of a refractory metal and a patterned compensation electrically conductive layer. The patterned compensation layer entirely overlies and extends beyond the shrunken patterned conductive layer. Additionally, thick film elements such as resistors are fabricated and contact selected areas of the patterned compensation conductive layer.
    Type: Grant
    Filed: November 30, 1979
    Date of Patent: October 20, 1981
    Assignee: RCA Corporation
    Inventor: Robert L. Schelhorn
  • Patent number: 4245210
    Abstract: A thick film resistor element capable of dissipating relatively large amounts of microwave energy comprises several distinct layers of resistive material overlying an electrically insulating thermally conducting substrate. The final dimensions of the element can be made comparatively small with respect to a conventional element having comparable dissipation capability. The element has a coating of a crossover dielectric material which provides a moisture barrier between the element and the ambient.
    Type: Grant
    Filed: March 19, 1979
    Date of Patent: January 13, 1981
    Assignee: RCA Corporation
    Inventors: Norman R. Landry, Samuel L. Williams, Robert L. Schelhorn