Abstract: This invention is directed to a socket system for the receipt of an integrated circuit "chip", where such a chip, as known in the art, typically is a planar electronic device having plural leads extending from the periphery thereof. The system, operatively mounted to a planar electronic device, such as a motherboard, comprises a frame having a central recess defined by converging side walls and terminating in a floor, and plural slots about the periphery of the floor for receiving elastomeric connectors for electrically interconnecting the chip leads to the mother board. Overriding the frame, for mechanical engagement therewith, is a force applying member, where such member includes plural ribs extending downwardly from the member and positioned to initially contact the respective converging side walls when the force applying member is caused to mechanically engage the frame.

Abstract: The invention is directed to an electronic docking connector for edge mounting an electronic device, such as a daughter board, to a mother board. The connector comprises a pair of housing members assembled to define an elongated slot planarly aligned with the edge of the mother board. Mounted therein is a pair of opposed force applying, resilient spring members operatively mounted for receiving and applying a compressive force against the electronic device. A flexible film member, containing electrical circuitry thereon, is also mounted within said housing members for electrically interconnecting corresponding circuitry on the mother board, and the electronic device. As an alternative, a dielectric insert is disposed between each spring member and its corresponding flexible film to reduce or eliminate cross talk therein.

Abstract: This disclosure relates to testing apparatus (10), preferably an LGA burn-in test socket, for an integrated chip (28). The apparatus (10), arranged for mounting on a planar electronic device (46), such as a printed circuit board, includes a frame member (12) for mounting to the planar electronic device (46), where the frame member (12) includes a central opening (22) extending between first and second surfaces, and dimensionally sized to receive the chip (28). Recesses (35) are provided for receiving an electronic interface member (18) mounting plural flexible electrical connectors (106), such as an elastomeric connector, as known in the art, for engaging the traces or pads of the chip to the planar device during testing. Further, plural recesses (40) extend from at least the first surface, where each recess includes a compression spring (41). Positioned over and for engagement with the frame member is a floatably mounted force applying member (14) having first and second parallel surfaces.

Abstract: This invention is directed to a mechanical, robotically operated burn-in socket testing apparatus for integrated circuit "chips", where such chips, as known in the art, are typically planar electronic devices. The apparatus, operationally mounted to a planar electronic board, such as a mother board, comprises a first frame member for mounting to the mother board, where the first frame member includes electrical means for engaging chip leads and applying electrical current thereto during the burn-in testing. A second frame member is disposed in sliding engagement with the first frame member, where the second frame member is movable from a first position to a second position.

Abstract: The invention is directed to a low profile electrical connector (10) for mounting a flexible film (60) having circuitry thereon, for electrical interconnection to a planar electronic device, such as a PCB (42), upon which the connector is to be mounted. The connector comprises an elongated dielectric housing (16) defined by essentially upper and lower parallel surfaces (18,20), a central through slot (26) for extending between the upper and lower surfaces (18,20) and end portions (22,24) for receiving an electrical interface member (62), such as an elastomeric connector known as AMPLIFLEX. Further means for mounting the housing to the planar electronic device, and means along one of the surfaces (18) for receiving a spring actuator member (14), are provided.

Abstract: This invention is directed to a chip carrier system for mounting to a first planar electronic device, such as a motherboard or test fixture, where first planar electronic device is provided with a planar, electrical interconnection interface mounted thereto. The chip carrier system includes a frame comprising a peripheral body portion defined by upper and lower planar surfaces, a recess in the lower planar surface to receive the planar, electrical interconnection interface, a central recess terminating in a floor to receive a second planar electronic device, such as an integrated circuit chip, having leads extending therefrom, converging side walls extending from the upper planar surface down to the floor, and plural through slots for receiving the leads. Cooperating therewith is a force applying member adapted to provide a normal force to the second planar electronic device and be mechanically secured to the frame.

Abstract: A docking station (10) slidably receives a device (12) to provide make, break or tap functions, respectively, in a circuit interface. The circuit interface includes a pair of connector housings (17, 18) provided with flexible (or compressible) electrical connectors (19, 20), respectively. A camming member (28, 29; 31, 32; 44) separates the connector housings (17, 18) as the device (12) is slidably inserted into the docking station (10), thereby assuring a substantially zero insertion force on the circuit interface. Preferably, the circuit interface is between the flexible electrical connectors (19, 20), a printed circuit board (13), and a flexible etched circuit (15). The flexible etched circuit (15) is provided with a stiffener (24) resiliently biased by springs (27).

Abstract: This invention is directed to an electrical connector for sequentially connecting plural contacts provided along the respective mating surfaces of a pair of planar electronic devices, where the devices are joined to or mounted within a pair of pivotally arranged housing members. The connector comprises a first housing mounted to one of the planar devices, such as a mother board, where first housing includes an open end and a closed end, and a second housing mounting the other planar electronic device, such as a daughter board, second housing includes an open end and a closed end, and that the respective closed ends include cooperative means for hingely engaging each other. By this arrangement, as the planar electronic devices are pivotally moved about the cooperative means from a nonparallel position to a parallel position of electrical engagement, the respective plural contacts between the planar electronic devices enter into engagement in a sequentially predetermined order.

Abstract: A backplane connector (12) has a mother board (10) provided with a connector housing (13) receiving a daughter board (11) perpendicularly thereof. A cam bump (19) on the daughter board (11) engages an inclined camming surface (20) on the connector housing (13) on the mother board (10), thereby deflecting the daughter board (11) laterally away from a flexible electrical connector (14) in the connector housing (13) on the mother board (10). When the daughter board (11) is fully seated within the connector housing (13) on the mother board (10), the cam bump (19) is received in a cam bump recess (21) on the connector housing (13) on the mother board (10). A spring (18) on the connector housing (13) biases the daughter board (11) towards the mother board (10), thereby providing a detent action therebetween. A second embodiment applies the invention to a device (23) insertable into a computer (25).

Abstract: A unitary heat sink and connector housing (10, 10', 10", 10"') is disposed between a pair of electrical members, such as printed circuit boards (11, 12, 31) and/or flexible etched circuits (32) in an overall assembly used in a variety of high-performance miniaturized electronic products. One or more flexible electrical connectors (21, 25, 26, 29, 30) are mounted within the unitary heat sink and connector housing (10, 10', 10", 10"') and provide a circuit interface between respective circuit elements or pads (13, 14) on the printed circuit boards (11, 12, 31) and/or flexible etched circuits (32), respectively. The unitary heat sink and connector housing (10, 10', 10", 10"'), which preferably has heat-radiating fins (20), is made from a material which is thermally conductive but electrically non-conductive. Examples of such a material are anodized aluminum, silicon dioxide and beryllium oxide. Any suitable ceramic material could be used.

Abstract: An interface for connecting co-planar printed circuit ("PC") boards (10,20) using a compressible circuit (50) for bridging the PC boards (10,20), a base (80) underlying the second PC board and integrally attached thereto, and a support housing (30) which sandwiches the compressible circuit (50) against the two PC boards (10,20). The compressible circuit (50) is insertable into the underside of the support housing (30) and may be electro-optically aligned therewith. The compressible circuit (50) is then staked to the support housing (30), and the support housing is mounted on the two PC boards (10,20). In order to mount the support housing (30) on the PC boards (10,20) with the requisite precision, the support housing (30) is provided with alignment means including resilient finger (39) on the underside, and the second PC board (20) is provided with cooperating guide tabs (25).

Abstract: A flexible electrical connector (16) provides a circuit interface between the bent leads (12) of an integrated circuit package (10) and the respective circuit pads (14) of a printed circuit board (15). The integrated circuit package (10) is mounted on the surface of the printed circuit board (15), and the circuit interface has a substantially zero insertion force therebetween. The flexible electrical connector (16) has closely-spaced circuit traces (17) carried by an elastomeric core (18). The traces (17) accommodate the fine pitch of the leads (12) on the integrated circuit package (10); and the elastomeric core (18) provides a resilient "cushion" which compensates for irregularities or tolerance accumulations in the bent leads (12) as well as the different lead-bending specifications of the respective integrated circuit manufacturers.

Abstract: A computer docking system (10, 10') has a computer (11, 11') provided with a guide housing (12, 12') within which a device (13, 13') is slidably inserted. In one embodiment, the device (13) carries a pair of manually-releasable spring-loaded latches (24, 25) pivotally mounted thereon about respective axes which are substantially perpendicular to the direction which the device (13) is slidably inserted into the guide housing (12) for engagement with respective hooks (36) on the computer (11). In another embodiment, the latches (51, 52) are pivotably mounted on the guide housing (12') about respective axes which are substantially parallel to the direction in which the device (13') is slidably inserted into the guide housing (12'). The guide housing (12') includes a fixed bottom portion (44) on which the latches (51, 52) are pivotably mounted, and further includes a spring-loaded movable top portion (45) receiving the device (13') and ultimately nested telescopically within the fixed bottom portion (44).

Abstract: The invention is directed to an electronic assembly, such as a backplane assembly of the type including a mother board, a connector housing mounted on the mother board, and a daughter board slidably insertable into the connector housing for electrical interconnection to the mother board. The assembly comprises an elongated connector housing having a pair of parallelly disposed spaced apart housing members defining at least one slot therebetween for receiving the daughter board. A force generating member is disposed within the slot, where the force generating members comprises a pair of resilient, essentially L-shaped members. One leg of each of the L-shaped members is fixedly disposed between the mother board and the housing members, while the others of the legs upstand within the slot in a spaced apart relationship to receive the daughter board therebetween, the upstanding legs including at least one pair of opposing elastomeric members to apply a compressive pressure to said daughter board.

Abstract: A pair of printed circuit boards (11, 12) angularly converge towards each other about a pivot axis (13). Each of the boards (11, 12) carries a connector housing (16). The connector housings (16) are identical, but are inverted end-to-end with respect to each other, such that a plurality of hermaphroditic guide fingers (19) on one of the connector housings (16) will mesh with a complementary plurality of guide fingers (19) on the other connector housing (16). The meshing engagement of the guide fingers (19) provides a guide means and a stop means between the connector housings (16) and hence between the printed circuit boards (11, 12). Each of the identical connector housings (16) further has a flexible electrical connector (17), and the flexible electrical connectors (17) engage each other when the printed circuit boards (11, 12) are fully converged.

Abstract: A combination heat sink (18, 41, 43) and circuit interface comprises a metallic wafer (15) disposed between an integrated circuit (11) and a printed circuit board (14) in a land grid array package (10). A frame (13) for the integrated circuit (11) is nested within the heat sink (18, 41, 43) and a latch (30) is pivotably mounted on the frame (13) for retaining the overall package (10). The circuit interface comprises a plurality of flexible electrical connectors (19) mounted on the wafer (15).

Abstract: A pluggable connector system (10) has a male housing (11, 11', 11", 11"') snapped together with a female housing (12, 12', 12", 12"') thereby providing a quick-disconnect feature. One of the housings, or both, carries a flexible etched circuit (16). The flexible etched circuit (16) may engage another flexible etched circuit (16) or, via a suitable interface, may engage a printed circuit board (17) having at least one circuit pad (19) thereon. One embodiment of a suitable interface is a flexible electrical connector (21) having a plurality of circuit traces on an elastomeric core. In another embodiment, the flexible etched circuit (16) is backed up by resilient means (33, 35) and engages the circuit pad (19) directly. The means for releasably retaining the housings (11, 11', 11", 11"' and 12, 12', 12", 12"') comprises a pair of spring-loaded manually-releasable latches (24, 24', 25) or a pair of bifurcated latching ears (43, 44).

Abstract: The invention hereof relates to electronic apparatus, such as a computer docking connector. More particularly, the invention relates to a docking connector for edge mounting to a "mother" board, where a "daughter" board, memory card, or similar device is inserted into said connector to electrically interconnect the mother board to the inserted device. The apparatus comprises a pair of spring biased, hermaphroditic, resilient housing members, which when assembled define an elongated slot planarly aligned with an edge of the mother board. Opposed camming surfaces are provided with the slot to operatively spread the housing members upon insertion of the electronic device int the slot. Finally a flexible film member containing electrical circuitry thereon is mounted within the housing members for electrically interconnecting corresponding circuitry on the mother board and the electronic device.

Abstract: A compressible electrical connector (10) includes a rigid molded body (11) having elastomeric caps (19, 20) at the top (12) and bottom (13) thereof. A thin flexible film (21), provided with respective connector elements (22), is wrapped around the rigid molded body (11) and its caps (19, 20) and is retained by a film retaining plate (23). The film retaining plate (23) has a plurality of latching lances (24) received in corresponding mounting holes (30) formed transversely in the rigid molded body (11). A hot melt layer (36) is placed over the film retaining plate (23), and a plurality of compressible electrical connectors (10) are stacked side-by-side to form an array (35). The array (35) is disposed between a pair of PC boards or other electronic assemblies (39, 40) having respective circuit elements (37, 38). The height of the rigid molded body may be changed conveniently to readily accommodate different product applications.

Abstract: A burn-in socket for integrated circuit chips has a clamping means actuated by a thermally-reactive resilient means, operative during the burn-in cycle itself, such that the chip frames are retained and good electrical contact with the chip leads is maintained during burn-in.