Abstract: A compact multi-chip module is provided. The multi-chip module may be built from a lead frame that does not have a die attach pad. Instead, the leads of the lead frame may define a central opening. A first semiconductor device extends across the central opening and is connected to the plurality of leads, with the leads being on a first side of the first semiconductor device. A second semiconductor is stacked on the first side of the first semiconductor device. A third semiconductor device is stacked on the second semiconductor device. A fourth semiconductor device is stacked on the third semiconductor device. The stack of semiconductor devices passes through the central opening formed by the plurality of leads. The stack of semiconductor devices is encapsulated with a thermoset plastic. The resulting final assembly may occupy no more volume than a typical single chip component.