Patents by Inventor Robert S. Larmouth

Robert S. Larmouth has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 6350387
    Abstract: A multilayer rigid flex printed circuit board wherein the board laminate comprises a basestock composite containing a flexible core, formed by laminating a first conductive layer to a flexible insulator layer, a second insulator layer affixed to the basestock, said second insulator layer having a cutout region proximate to the flexible core of the basestock composite to expose a portion of said first conducting layer on said flexible core, a second conductive layer attached to said second insulator layer said second conductive layer having a cutout region proximate to the flexible core of the basestock composite, and a photo-imageable soldermask applied to the exposed portion said first conducting layer, and to the second conductive layer, wherein said photoimageable soldermask allows for photo definition of openings on the conductive layers to which it is applied.
    Type: Grant
    Filed: March 1, 1999
    Date of Patent: February 26, 2002
    Assignee: Teledyne Industries, Inc.
    Inventors: A. Roland Caron, Sandra L. Jean, James E. Keating, Robert S. Larmouth, Lee J. Millette
  • Publication number: 20010010303
    Abstract: A multilayer rigid flex printed circuit board wherein the board laminate comprises a basestock composite containing a flexible core, formed by laminating a first conductive layer to a flexible insulator layer, a second insulator layer affixed to the basestock, said second insulator layer having a cutout region proximate to the flexible core of the basestock composite to expose a portion of said first conducting layer on said flexible core, a second conductive layer attached to said second insulator layer said second conductive layer having a cutout region proximate to the flexible core of the basestock composite, and a photo-imageable soldermask applied to the exposed portion said first conducting layer, and to the second conductive layer, wherein said photoimageable soldermask allows for photo definition of openings on the conductive layers to which it is applied.
    Type: Application
    Filed: March 1, 1999
    Publication date: August 2, 2001
    Inventors: A. ROLAND CARON, SANDRA L. JEAN, JAMES E. KEATING, ROBERT S. LARMOUTH, LEE J. MILLETTE
  • Patent number: 5997983
    Abstract: A rigid flex printed circuit board wherein the flex section of said board comprises a basestock composite with edges formed by laminating a conductive layer to a flexible insulator layer, the conductor layer containing at least one conductive pathway and the flexible insulator layer comprises fibers dispersed in a matrix polymer. The fibers are oriented with respect to the conductive pathway so that the conductive pathway is substantially non-aligned with said fibers, substantially along an entirety of the conductive pathway in the flex section so as to be flexible.
    Type: Grant
    Filed: May 30, 1997
    Date of Patent: December 7, 1999
    Assignee: TeledyneIndustries, Inc.
    Inventors: A. Roland Caron, Sandra L. Jean, James E. Keating, Robert S. Larmouth, Lee J. Millette