Patents by Inventor Robert T. Hirahara

Robert T. Hirahara has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10347522
    Abstract: A method and apparatus for discharging a residual charge from a substrate support. In one example, a substrate support is provided that includes a body, an electrode disposed in the body, a radiation emitter and a diffuser. The body has one or more holes formed in a workpiece support surface, the workpiece support surface configured to accept a substrate thereon. The electrode is configured to electrostatically hold a substrate to the workpiece support surface. The radiation emitter is disposed in a first hole of the one or more holes formed in the workpiece support surface. The radiation emitter is configured to emit electromagnetic energy out of the first hole. The diffuser is disposed in first hole over the radiation emitter.
    Type: Grant
    Filed: March 14, 2017
    Date of Patent: July 9, 2019
    Assignee: Applied Materials, Inc.
    Inventors: Wendell Glen Boyd, Jr., Tom K. Cho, Robert T. Hirahara
  • Publication number: 20190206712
    Abstract: Methods for chucking and de-chucking a substrate from an electrostatic chucking (ESC) substrate support to reduce scratches of the non-active surface of a substrate include simultaneously increasing a voltage applied to a chucking electrode embedded in the ESC substrate support and a backside gas pressure in a backside volume disposed between the substrate and the substrate support to chuck the substrate and reversing the process to de-chuck the substrate.
    Type: Application
    Filed: March 5, 2019
    Publication date: July 4, 2019
    Inventors: Wendell Glenn BOYD, JR., Jim Zhongyi HE, Ramesh GOPALAN, Robert T. HIRAHARA, Govinda RAJ
  • Patent number: 10177014
    Abstract: An apparatus for a substrate support heater and associated chamber components having reduced energy losses are provided. In one embodiment, a substrate support heater is provided. The substrate support heater includes a heater body having a first surface to receive a substrate and a second surface opposing the first surface, a heating element disposed in the heater body between the first surface and the second surface, and a thermal barrier disposed on the second surface of the heater body, wherein the thermal barrier comprises a first layer and a second layer disposed on the first layer.
    Type: Grant
    Filed: October 9, 2013
    Date of Patent: January 8, 2019
    Assignee: Applied Materials, Inc.
    Inventors: Govinda Raj, Daniel Martin, Robert T. Hirahara, Ashish Bhatnagar, Bopanna Vasanth, Prashanth Rao, Kadthala R. Narendrnath
  • Patent number: 10049908
    Abstract: In one embodiment of the invention, a substrate support assembly comprises an electrostatic chuck having an electrode embedded therein and having an aperture disposed therethrough, a conductive liner disposed on the surface of the electrostatic chuck within the aperture, a conductive tubing extending from a lower surface of the electrostatic chuck and axially aligned with the aperture, and a conductive coating at least partially within the aperture and at least partially within the conductive tubing, wherein the conductive coating provides a conductive path between the conductive liner and the conductive tubing.
    Type: Grant
    Filed: May 24, 2016
    Date of Patent: August 14, 2018
    Assignee: Applied Materials, Inc.
    Inventors: Govinda Raj, Robert T. Hirahara
  • Patent number: 9917001
    Abstract: An aluminum heated substrate support suitable for use in high temperature substrate processing systems and method for fabricating the same are provided. In one embodiment, an aluminum heated substrate support can include an aluminum body, a stem coupled to the body and a heating element disposed in the body. The body has an average grain size less than about 250 ?m. In some embodiments, the stem to body joint is a fully penetrated lap weld that promotes service life of the substrate support.
    Type: Grant
    Filed: January 21, 2008
    Date of Patent: March 13, 2018
    Assignee: APPLIED MATERIALS, INC.
    Inventors: Abhi Desai, Robert T. Hirahara, Calvin Augason
  • Publication number: 20170263487
    Abstract: A method and apparatus for discharging a residual charge from a substrate support. In one example, a substrate support is provided that includes a body, an electrode disposed in the body, a radiation emitter and a diffuser. The body has one or more holes formed in a workpiece support surface, the workpiece support surface configured to accept a substrate thereon. The electrode is configured to electrostatically hold a substrate to the workpiece support surface. The radiation emitter is disposed in a first hole of the one or more holes formed in the workpiece support surface. The radiation emitter is configured to emit electromagnetic energy out of the first hole. The diffuser is disposed in first hole over the radiation emitter.
    Type: Application
    Filed: March 14, 2017
    Publication date: September 14, 2017
    Inventors: Wendell Glen BOYD, JR., Tom K. CHO, Robert T. HIRAHARA
  • Patent number: 9613846
    Abstract: Embodiments are directed to an electrostatic chuck surface having minimum contact area features. More particularly, embodiments of the present invention provide an electrostatic chuck assembly having a pattern of raised, elongated surface features for providing reduced particle generation and reduced wear of substrates and chucking devices.
    Type: Grant
    Filed: November 21, 2014
    Date of Patent: April 4, 2017
    Assignee: APPLIED MATERIALS, INC.
    Inventors: Govinda Raj, Cheng-Hsiung Tsai, Robert T. Hirahara, Kadthala R. Narendrnath, Manjunatha Koppa, Ross Marshall
  • Publication number: 20160329230
    Abstract: In one embodiment of the invention, a substrate support assembly comprises an electrostatic chuck having an electrode embedded therein and having an aperture disposed therethrough, a conductive liner disposed on the surface of the electrostatic chuck within the aperture, a conductive tubing extending from a lower surface of the electrostatic chuck and axially aligned with the aperture, and a conductive coating at least partially within the aperture and at least partially within the conductive tubing, wherein the conductive coating provides a conductive path between the conductive liner and the conductive tubing.
    Type: Application
    Filed: May 24, 2016
    Publication date: November 10, 2016
    Inventors: Govinda RAJ, Robert T. HIRAHARA
  • Publication number: 20160230269
    Abstract: An electrostatic chuck assembly and processing chamber having the same are disclosed herein. In one embodiment, an electrostatic chuck assembly is provided that includes a body having an outer edge connecting a frontside surface and a backside surface. The body has chucking electrodes disposed therein. A wafer spacing mask is formed on the frontside surface of the body. The wafer spacing mask has a plurality of elongated features. The elongated features have long axes that are radial aligned from the center to the outer edge. The wafer spacing mask has a plurality of radially aligned gas passages defined between the elongated features.
    Type: Application
    Filed: February 6, 2015
    Publication date: August 11, 2016
    Inventors: Govinda RAJ, Robert T. HIRAHARA
  • Patent number: 9349630
    Abstract: In one embodiment of the invention, a substrate support assembly comprises an electrostatic chuck having an electrode embedded therein and having an aperture disposed therethrough, a conductive liner disposed on the surface of the electrostatic chuck within the aperture, a conductive tubing extending from a lower surface of the electrostatic chuck and axially aligned with the aperture, and a conductive coating at least partially within the aperture and at least partially within the conductive tubing, wherein the conductive coating provides a conductive path between the conductive liner and the conductive tubing.
    Type: Grant
    Filed: January 23, 2014
    Date of Patent: May 24, 2016
    Assignee: APPLIED MATERIALS, INC.
    Inventors: Govinda Raj, Robert T. Hirahara
  • Publication number: 20150146339
    Abstract: Embodiments are directed to an electrostatic chuck surface having minimum contact area features. More particularly, embodiments of the present invention provide an electrostatic chuck assembly having a pattern of raised, elongated surface features for providing reduced particle generation and reduced wear of substrates and chucking devices.
    Type: Application
    Filed: November 21, 2014
    Publication date: May 28, 2015
    Inventors: Govinda RAJ, Cheng-Hsiung TSAI, Robert T. HIRAHARA, Kadthala R. NARENDRNATH, Manjunatha KOPPA, Ross MARSHALL
  • Publication number: 20140268478
    Abstract: In one embodiment of the invention, a substrate support assembly comprises an electrostatic chuck having an electrode embedded therein and having an aperture disposed therethrough, a conductive liner disposed on the surface of the electrostatic chuck within the aperture, a conductive tubing extending from a lower surface of the electrostatic chuck and axially aligned with the aperture, and a conductive coating at least partially within the aperture and at least partially within the conductive tubing, wherein the conductive coating provides a conductive path between the conductive liner and the conductive tubing.
    Type: Application
    Filed: January 23, 2014
    Publication date: September 18, 2014
    Inventors: Govinda RAJ, Robert T. HIRAHARA
  • Publication number: 20140165915
    Abstract: An apparatus for a substrate support heater and associated chamber components having reduced energy losses are provided. In one embodiment, a substrate support heater is provided. The substrate support heater includes a heater body having a first surface to receive a substrate and a second surface opposing the first surface, a heating element disposed in the heater body between the first surface and the second surface, and a thermal barrier disposed on the second surface of the heater body, wherein the thermal barrier comprises a first layer and a second layer disposed on the first layer.
    Type: Application
    Filed: October 9, 2013
    Publication date: June 19, 2014
    Inventors: Govinda RAJ, Daniel MARTIN, Robert T. HIRAHARA, Ashish BHATNAGAR, Bopanna VASANTH, Prashanth RAO, Kadthala R. NARENDRNATH
  • Patent number: 8464594
    Abstract: A gas nozzle measurement apparatus comprises a controllable gas source to provide across a gas plate having gas nozzles, a flow of gas at a constant pressure or constant flow rate, and a sensor plate sized to cover an area comprising at least a portion of the front face of the gas plate. The sensor plate comprises gas flow sensors arranged in locations that correspond to positions of individual gas nozzles of the gas nozzles of the gas plate such that each gas flow sensor can measure a pressure, flow rate, density, or velocity of a gas stream passing through the individual gas nozzle that faces the gas flow sensor, and generate a signal indicative of, or display, the pressure, flow rate, density, or velocity of the gas stream passing through the individual gas nozzle.
    Type: Grant
    Filed: March 4, 2011
    Date of Patent: June 18, 2013
    Assignee: Applied Materials, Inc.
    Inventors: Kadthala R. Narendrnath, Ashish Bhatnagar, Daniel L. Martin, Robert T. Hirahara, Gangadhar Sheelavant
  • Patent number: 8320099
    Abstract: The present invention includes methods and apparatus for repairing an electrical connection between bipolar electrodes contained within an electrostatic chuck and a conductive mask disposed atop the electrostatic chuck, known as a balancing circuit. Embodiments of the invention are particularly useful after removal of an electrostatic chuck for refurbishment.
    Type: Grant
    Filed: November 15, 2011
    Date of Patent: November 27, 2012
    Assignee: Applied Materials, Inc.
    Inventors: Robert T. Hirahara, Vijay D. Parkhe
  • Publication number: 20120124819
    Abstract: The present invention includes methods and apparatus for repairing an electrical connection between bipolar electrodes contained within an electrostatic chuck and a conductive mask disposed atop the electrostatic chuck, known as a balancing circuit. Embodiments of the invention are particularly useful after removal of an electrostatic chuck for refurbishment.
    Type: Application
    Filed: November 15, 2011
    Publication date: May 24, 2012
    Inventors: ROBERT T. HIRAHARA, VIJAY D. PARKHE
  • Patent number: 8064185
    Abstract: The present invention includes methods and apparatus for repairing an electrical connection between bipolar electrodes contained within an electrostatic chuck and a conductive mask disposed atop the electrostatic chuck, known as a balancing circuit. Embodiments of the invention are particularly useful after removal of an electrostatic chuck for refurbishment.
    Type: Grant
    Filed: September 5, 2008
    Date of Patent: November 22, 2011
    Assignee: Applied Materials, Inc.
    Inventors: Robert T. Hirahara, Vijay D. Parkhe
  • Publication number: 20110217208
    Abstract: A gas nozzle measurement apparatus comprises a controllable gas source to provide across a gas plate having gas nozzles, a flow of gas at a constant pressure or constant flow rate, and a sensor plate sized to cover an area comprising at least a portion of the front face of the gas plate. The sensor plate comprises gas flow sensors arranged in locations that correspond to positions of individual gas nozzles of the gas nozzles of the gas plate such that each gas flow sensor can measure a pressure, flow rate, density, or velocity of a gas stream passing through the individual gas nozzle that faces the gas flow sensor, and generate a signal indicative of, or display, the pressure, flow rate, density, or velocity of the gas stream passing through the individual gas nozzle.
    Type: Application
    Filed: March 4, 2011
    Publication date: September 8, 2011
    Applicant: APPLIED MATERIALS, INC.
    Inventors: Kadthala R. NARENDRNATH, Ashish BHATNAGAR, Daniel L. MARTIN, Robert T. HIRAHARA, Gangadhar SHEELAVANT
  • Publication number: 20100061032
    Abstract: The present invention includes methods and apparatus for repairing an electrical connection between bipolar electrodes contained within an electrostatic chuck and a conductive mask disposed atop the electrostatic chuck, known as a balancing circuit. Embodiments of the invention are particularly useful after removal of an electrostatic chuck for refurbishment.
    Type: Application
    Filed: September 5, 2008
    Publication date: March 11, 2010
    Inventors: Robert T. Hirahara, Vijay D. Parkhe
  • Publication number: 20090184093
    Abstract: An aluminum heated substrate support suitable for use in high temperature substrate processing systems and method for fabricating the same are provided. In one embodiment, an aluminum heated substrate support can include an aluminum body, a stem coupled to the body and a heating element disposed in the body. The body has an average grain size less than about 250 ?m. In some embodiments, the stem to body joint is a fully penetrated lap weld that promotes service life of the substrate support.
    Type: Application
    Filed: January 21, 2008
    Publication date: July 23, 2009
    Inventors: ABHI DESAI, Robert T. Hirahara, Calvin Augason