Abstract: Tamper-respondent assemblies, electronic packages and fabrication methods are provided which incorporate a vent structure. The tamper-respondent assembly includes an electronic enclosure to enclose, at least in part, an electronic component(s) to be protected. The electronic enclosure includes an inner surface, and an air vent. A tamper-respondent electronic circuit structure is provided which includes a tamper-respondent sensor disposed to cover, at least part, the inner surface of the electronic enclosure, and define, at least in part, a secure volume about the electronic component(s). The vent structure includes at least one air passage coupling in fluid communication the secure volume and the air vent of the electronic enclosure to allow air pressure within the secure volume to equalize with air pressure external to the tamper-respondent assembly.

Abstract: A quick-connect coupling tool includes a first member and a second member. The second member is slidably affixed to the first member. The quick-connect coupling tool further includes a first pair of prongs and a second pair of prongs, the first pair of prongs is affixed to the first member, oriented in a first direction, and orthogonal to the first member. The second pair of prongs is affixed to the first member, oriented in the first direction, and orthogonal to the second member. The quick-connect coupling tool includes a first urging means for urging the first pair of prongs and the second pair of prongs apart and a second urging means for urging the first pair of prongs and the second pair of prongs together. The first urging means and the second urging means are affixed to the first member and the second member.

Abstract: A quick-connect coupling tool includes a first member and a second member. The second member is slidably affixed to the first member. The quick-connect coupling tool further includes a first pair of prongs and a second pair of prongs, the first pair of prongs is affixed to the first member, oriented in a first direction, and orthogonal to the first member. The second pair of prongs is affixed to the first member, oriented in the first direction, and orthogonal to the second member. The quick-connect coupling tool includes a first urging means for urging the first pair of prongs and the second pair of prongs apart and a second urging means for urging the first pair of prongs and the second pair of prongs together. The first urging means and the second urging means are affixed to the first member and the second member.

Abstract: Assembly apparatuses and processes are provided which include a pressure cure fixture. The pressure cure fixture is sized to reside within a container, such as an electronic enclosure, and facilitate applying pressure to an adhesive disposed over an inner surface of the container. The pressure cure fixture is formed of a material with a higher coefficient of thermal expansion (CTE) than the container, and is sized to correspond, at least in part, to an inner space of the container while allowing for the adhesive and a surface-mount element to be disposed between the pressure cure fixture and the inner surface of the container. When heated, the pressure cure fixture expands greater than the container and imparts the pressure to the surface-mount element and the adhesive to facilitate securing the surface-mount element to the inner surface of the container.

Abstract: A multilayer structure comprising a crystal matching layer deposited on a substrate. The crystal matching layer is capable of being used as an ohmic contact, thermal heat sink, and reflective layer. The unique properties of the crystal matching layer allows for the reduction of size of semiconductor devices, a reduction in the fabrication time of semiconductor devices, high current capabilities, high voltage standoff capabilities, and other advantages.

Abstract: A multilayer semiconductor structure including at least in part a substrate and an III-N film layer. The substrate's constant of thermal expansion being substantially matched to the III-N film's constant of thermal expansion. The multilayer semiconductor structure may also include a crystal matching layer that has a lattice constant that substantially matches the lattice of constant of the III-N film. By not relying on the substrate for lattice matching the III-N film, the multilayer structure allows greater flexibility in the selection of an applicable substrate.

Abstract: In one or more embodiments, the present invention provides a novel approach to the addition of plasticizers for softening TPUs, i.e., lowering the durometer and the melt viscosity. This approach involves incorporating bonded sulfonate groups with quaternary ammonium counterions into the TPU. In one or more embodiments of the present invention, the softening of TPU is achieved by incorporating an ionic diol, such as N,N-bis (2-hydoxyethyl)-2-aminoethane-sulfonic acid (BES), coupled with various bulky alkyl ammonium cations, during the chain extension step of the TPU synthesis. It is believed that that steric hindrance of the bulky quaternary ammonium groups weakens the dipole-dipole interactions of the sulfonate groups and/or lowers the crystallinity of the hard block, thereby creating additional free volume that softens the polymer and lowers the melt viscosity.

Abstract: A shape memory composition includes a high temperature ionomer having a glass transition temperature or a melting temperature of 100° C. or greater and a modulus at room temperature of 1×108 Pa or greater, the high temperature ionomer including a polymer with ionic units either within the backbone of the polymer or pendant to the backbone or both. The shape memory composition includes crystalline or glassy domains of a low molecular weight non-polymeric compound dispersed in the high temperature ionomer and interacting the ionic units of the high temperature ionomer to form a secondary network characterized by being a reversible network in that it is compromised by the heating of the low molecular weight non-polymeric compound to change out of its crystalline or glassy phase.

Abstract: A microlithographic projection exposure apparatus includes a correction device configured to correct optical wavefront deformations. The correction device includes first and second optical elements and a drive mechanism configured to move the first and second optical elements between a first arrangement and a second arrangement. In the first arrangement the first optical element is an inner optical element having at least a portion that is arranged in a projection light path, and the second optical element is an outer optical element that is arranged completely outside the projection light path. In the second arrangement the second optical element is the inner optical element, and the first optical element is the outer optical element. The correction device further includes a temperature control device configured to modify a temperature distribution in the outer optical element.

Abstract: An integrated seal for a strut bearing, the strut bearing including an upper housing superimposed onto a lower housing and a bearing assembled between the upper and lower housings. The integrated seal having at least a portion protruding above an upper radial surface of the upper housing arranged to contact and get compressed by a top mount of an associated strut assembly, forming a seal between the strut bearing and the top mount surfaces.

Abstract: A cartridge block for screening a multilayer ceramic with a conductive paste includes a threaded paste cartridge attachment located at a top of the cartridge block, the threaded paste cartridge attachment being configured to receive a paste cartridge containing the conductive paste; a paste routing section, the paste routing section located underneath the threaded paste cartridge attachment, the paste routing section comprising a flared section located at a bottom of the cartridge block, the paste routing section being configured to receive the conductive paste from the threaded paste cartridge attachment and route the paste through the flared section.

Abstract: Improved systems and methods for removing blood from a blood vessel in preparation for endovenous laser ablation are described. The improved methods include one or more of: placing the patient in the Trendelenburg position, applying external compression around the vein, massaging the vein, cooling the vein externally, encouraging spasming of the vein, and removing blood with a suction device.

Abstract: An assembly for screening a multilayer ceramic with a conductive paste includes a paste cartridge containing the conductive paste; a cartridge block, a top of a cartridge block being configured to receive the paste cartridge, the cartridge block comprising a paste routing section, the paste routing section comprising a flared section located at a bottom of the cartridge block; a pneumatic fitting attached to the paste cartridge, the pneumatic fitting configured to pressurize the conductive paste in the paste cartridge such that the conductive paste is extruded from the paste cartridge into the cartridge block through the paste routing section of the cartridge block by the pressure from the pneumatic fitting; and a nozzle connected to the flared section of the cartridge block, the nozzle configured to receive the conductive paste from the flared section, and screen the conductive paste onto the multilayer ceramic through the nozzle.

Abstract: A bearing device, including: a first housing including a first interior surface with a first portion and an exterior surface; a second housing including a second interior surface with a second portion and an exterior surface; a bearing assembly including a first ring connected to the first interior surface, a second ring connected to the second interior surface and a rolling element between the rings; a first space between first and second portions of the first and second interior surfaces, respectively and extending from the first and second exterior surface to the bearing assembly; and at least one first layer of a hydrophobic material adhered to and covering at least a first segment of the first portion; or a second segment of the second portion. The first segment includes less than an entirety of the first portion, and the second segment includes less than an entirety of the second portion.

Abstract: A shape memory composition includes a high temperature ionomer having a glass transition temperature or a melting temperature of 100° C. or greater and a modulus at room temperature of 1×108 Pa or greater, the high temperature ionomer including a polymer with ionic units either within the backbone of the polymer or pendant to the backbone or both.

Abstract: In one embodiment, the gaming system and method disclosed herein provides a plurality of gaming devices that each participate in a group game including a plurality of masked group game components and determines and provides separate awards to each player of the gaming devices based on the amount of modifiers applied to each of the group game components having a modifier applied by the player of that gaming device. In one embodiment, the gaming system enables each player to selectively apply or associate a plurality of modifiers to a single game component or apply the plurality of modifiers across the plurality of game components. For each gaming device, the gaming system displays and provides any awards to the player of that gaming device.

Abstract: The present invention is directed to a covalently crosslinked hydrogel comprising the strain-promoted reaction product of an 8-member cycloalkyne functionalized polyalkylene glycol and a multi-arm glycerol exytholate triazide and methods for making them. Because the precursor materials can be manipulated without causing crosslinking, provided the strain threshold is not reached, these hydrogels permit mechanical control over when (and where) cross linking occurs and are easier to use than prior strain-activated or temperature-activated systems. These novel hydrogels do not require a catalyst to cross link, thus avoiding the biocompatibility problems common to many catalysts. Nor is the crosslinking process affected by the presence of catalysts or other substances, which have interfered with crosslinking in known strain induced hydrogels.

Abstract: A rolling diaphragm seal for a strut bearing, the seal inserted into an annulus formed between an upper and lower housing. The seal having a hollow tubular form, formed into a ring open at one end. The seal rolling along a length thereof during relative rotation of the upper and lower housings. Alternatively, the seal can be a continuous hollow tubular form inserted between the upper and lower housings.

Abstract: The present invention relates generally to methods of preventing or treating toxicities of the skin, hair, and/or nails, which are associated with administration of one or more multikinase inhibitors, with light-emitting diode photomodulation treatment, either alone or in combination with other agents.

Abstract: A method and system of sample aliquot storage for automated immunochemistry or chemistry instruments are provided. The method and system provide a sample aliquot storage unit having a sample storage wheel for storing sample vessels containing sample aliquots in a chilled enclosed environment, which are accessible by both a sample pipettor of a sample aliquoting station and a pick-and-place gripper. The pick-and-place gripper transports the sample vessels containing sample aliquots to multiple independent reagent pipetting stations respectively for sample aspiration of subsequent assay, and thereafter transports the sample vessels containing remaining sample aliquots back to the sample storage wheel to be stored in the chilled environment for reflex testing. When all the tests are completed, the pick-and-place gripper transports the sample vessels to a waste storage area.