Abstract: In one example in accordance with the present disclosure, a particle detection system is described. The particle detection system includes a microfluidic channel through which fluid is to flow. The fluid includes particles. The particle detection system also includes a sensing circuit to output a resonant frequency. The sensing circuit includes a pair of electrodes disposed within the microfluidic channel. Contents of a volume between the pair of electrodes changes a capacitance between the pair of electrodes. A change in the capacitance changes the resonant frequency output by the sensing circuit. The particle detection system also includes a controller to determine the contents of the volume based on the resonant frequency.

Abstract: In one example in accordance with the present disclosure, a particle dispensing system is described. The particle dispensing system includes a port to receive a number of fluid cartridges. Each fluid cartridge is to hold an amount of fluid to be ejected. The particle dispensing system also includes an optical verification system to determine, following ejection, a count of a number of particles ejected during an ejection event. The particle dispensing system also includes a controller to selectively activate a number of fluid ejectors to eject the amount of fluid.

Abstract: In one example in accordance with the present disclosure, am ejection system is described. The ejection system includes a fluid feed slot to supply fluid to a number of fluid ejection channels where each fluid ejection channel is a recirculating channel. Each fluid ejection channel includes a sensor to detect, in the fluid, a target particle to be ejected and a fluid ejector to eject the target particle from the fluid ejection channel. The ejection system also includes a controller to selectively activate the fluid ejector when the target particle presence is detected. Non-target particles are returned to the fluid feed slot past the fluid ejector.

Abstract: A method of detecting passage of a particle into a target location includes receiving a sample on a die including a microfluidic chamber, the microfluidic chamber including a microfluidic path coupling a reservoir to a foyer, and moving the sample from the reservoir to the foyer by firing a nozzle fluidically coupled to the foyer. The method further includes detecting passage of a particle of the sample from the reservoir to the foyer via a first sensor disposed within the microfluidic path, and detecting passage of the particle into the target location via a second sensor disposed between the first sensor and the nozzle. The method includes recording in a dispense map, an indication of whether the target location includes a single particle or multiple particles based on signals measured by the first sensor and the second sensor.

Abstract: An alignment system, in an example, may include a substrate comprising at least one nanowell, at least one fluid ejection device comprising at least one die, the at least one die comprising as least one nozzle, and an alignment device to align the at least one nozzle to the at least one nanowell.

Abstract: Active phospholipidic membrane (200) comprising: —a double phospholipidic layer; —at least a support (201) for supporting the double phospholipidic layer thus improving the resistance of the active phospholipidic membrane (200); —a plurality of monoclonal antibodies (202) bonded to the support (201); —a plurality of predetermined molecules (203) bound to the monoclonal antibodies (202) at a transmembrane level. Said supports (201) comprises a first substrate comprising the monoclonal antibodies (202) and a second substrate comprising the double phospholipidic layer.

Abstract: Aspects of the present disclosure relate to evaporation compensation in fluidic devices. An example apparatus for evaporation compensation includes an assessment circuit to determine an amount of evaporation of a volume dispensed in a microwell of a fluidic device. The amount of evaporation may be determined based on the volume in the microwell, and an amount of time after dispensing the volume in the microwell. A compensation circuit may determine, based on the amount of evaporation, a compensation factor for the microwell including an amount of a normalizing fluid to compensate for the amount of evaporation. The compensation circuit may also create a normalization profile for the fluidic device, including an association between the fluidic device and the compensation factor. A dispensing circuit may dispense the normalizing fluid in the microwell according to the normalization profile.

Abstract: In one example in accordance with the present disclosure, a fluid ejection system is described. The fluid ejection system includes a frame to retain a number of fluid ejection devices. Each fluid ejection device includes a reservoir disposed on a first side of the frame and a fluid ejection die disposed on an opposite side of the frame. Each fluid ejection die includes 1) a fluid feed slot formed in a substrate to receive fluid from the reservoir, 2) an array of nozzles formed in the substrate to eject fluid, and 3) an ejection adjustment system to selectively adjust an amount of fluid ejected from the fluid ejection devices.

Abstract: A microfluidic dispenser can include a processor to receive a user input via a user interface related to limiting dilution (or a limiting dilution assay) to be performed, and calculate a dispense volume of a fluid for the limiting dilution based on the user input. The microfluidic dispenser can also include a dispense cassette including a fluid reservoir, and a microfluidic dispense head to dispense the fluid via a nozzle in accordance with the calculated dispense volume.

Abstract: An alignment system, in an example, may include a substrate comprising at least one nanowell, at least one fluid ejection device comprising at least one die, the at least one die comprising as least one nozzle, and an alignment device to align the at least one nozzle to the at least one nanowell.

Abstract: An amorphous thin metal film can comprise a combination of three metals or metalloids including: 5 at % to 90 at % of a metalloid selected from the group of carbon, silicon, and boron; 5 at % to 90 at % of a first metal selected from the group of titanium, vanadium, chromium, iron, cobalt, nickel, zirconium, niobium, molybdenum, ruthenium, rhodium, palladium, hafnium, tantalum, tungsten, osmium, iridium, and platinum; and 1 at % to 90 at % of cerium. The three elements may account for at least 50 at % of the amorphous thin metal film.

Abstract: An alignment system, in an example, may include a substrate comprising at least one nanowell, at least one fluid ejection device comprising at least one die, the at least one die comprising as least one nozzle, and an alignment device to align the at least one nozzle to the at least one nanowell.

Abstract: In one example in accordance with the present disclosure, a fluidic die is described. The fluidic die includes a plurality of ejection subassemblies. Each ejection subassembly includes an ejection chamber to hold a volume of fluid and an opening through which the volume of fluid is ejected via a fluid actuator. A pitch of the ejection subassemblies aligns with a spatial arrangement of nanowells in an array of nanowells on a substrate.

Abstract: An alignment system, in an example, may include a substrate comprising at least one nanowell, at least one fluid ejection device comprising at least one die, the at least one die comprising as least one nozzle, and an alignment device to align the at least one nozzle to the at least one nanowell.

Abstract: A method may include measuring at least one physical parameter of at least one component of a plurality of components of a first fluid ejection die; and calculating an operating energy value to be used to operate the first fluid ejection die based on the at least one physical parameter of the at least one component.

Abstract: An amorphous thin metal film can comprise a combination of three metals or metalloids including: 5 at % to 90 at % of a metalloid selected from the group of carbon, silicon, and boron; 5 at % to 90 at % of a first metal selected from the group of titanium, vanadium, chromium, iron, cobalt, nickel, zirconium, niobium, molybdenum, ruthenium, rhodium, palladium, hafnium, tantalum, tungsten, osmium, iridium, and platinum; and 1 at % to 90 at % of cerium. The three elements may account for at least 50 at % of the amorphous thin metal film.

Abstract: A wear resistant coating may comprise an amorphous metal comprising at least one refractory metal, at least two elements selected from periods 4, 5, 6, 9, and 10, and a metalloid. An amorphous metal may comprise at least one refractory metal, at least two elements selected from periods 4, 5, 6, 9, and 10, and a metalloid. A coating may comprise at least one refractory metal, at least two elements selected from periods 4, 5, 6, 9, and 10, and silicon. In some examples, the amorphous metal is TaWSi. In one example, the refractory metals may comprise Niobium, Molybdenum, Tantalum, Tungsten, Rhenium, or combinations thereof.

Abstract: ATP-dependent generator/accumulator (based on active membranes) ATP-dependent Generator/Accumulator technology springs from the idea of utilizing differences in potential coming from work going on at the molecular level (generated by proteins of the cell membrane) for the production of electric energy. Cyclic polarization/depolarization is used, coming from a series of membranes, (besides the support of ulterior membranes which have been genetically engineered to carry out functions different from those carried out by the principal membrane). An extremely versatile system is therefore set up which can function both as an accumulator and a generator. It can function as an accumulator because it stores a determined quantity of energy in the form of ATP, and as a generator because it transforms potential energy (the bond energy of the ATP molecule) into electric energy.

Abstract: In one example, a printhead structure includes an ejector element, a multi-layer insulator covering the ejector element, and an amorphous metal on the insulator.

Abstract: An amorphous thin metal film can include a combination of metals or metalloids including: 5 at % to 74 at % of a metalloid selected from the group of carbon, silicon, and boron; 5 at % to 74 at % of a first metal; 5 at % to 74 at % of a second metal; and 5 at % to 70 at % of a dopant. The first and second metals can be independently selected from the group of titanium, vanadium, chromium, iron, cobalt, nickel, zirconium, niobium, molybdenum, ruthenium, rhodium, palladium, hafnium, tantalum, tungsten, osmium, iridium, or platinum, wherein the first metal and the second metal can be different metals. The dopant can be selected from the group of oxygen, nitrogen, or combinations thereof. The metalloid, first metal, second metal, and dopant can account for at least 70 at % of the amorphous thin metal film.