Patents by Inventor Robin Wade Lovell

Robin Wade Lovell has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10131084
    Abstract: Disclosed herein, amongst other things, is a method of transferring a molded article from a moveable mold half of a mold into a receptacle of a post-mold tool. The method includes positioning the moveable mold half relative to the post-mold tool to position the molded article thereon closer to the receptacle and retracting the moveable mold half while simultaneously extending a stripping device to eject the molded article from the moveable mold half and to transfer it into the receptacle.
    Type: Grant
    Filed: May 7, 2013
    Date of Patent: November 20, 2018
    Assignee: HUSKY INJECTION MOLDING SYSTEMS LTD.
    Inventors: John Robert Galt, Bruno Giuseppe Sodaro, Alex Teng, Robin Wade Lovell, Ralf Schmitz
  • Publication number: 20150130113
    Abstract: Disclosed herein, amongst other things, is a method of transferring a molded article from a moveable mold half of a mold into a receptacle of a post-mold tool. The method includes positioning the moveable mold half relative to the post-mold tool to position the molded article thereon closer to the receptacle and retracting the moveable mold half while simultaneously extending a stripping device to eject the molded article from the moveable mold half and to transfer it into the receptacle.
    Type: Application
    Filed: May 7, 2013
    Publication date: May 14, 2015
    Inventors: John Robert Galt, Bruno Giuseppe Sodaro, Alex Teng, Robin Wade Lovell, Ralf Schmitz
  • Publication number: 20070267783
    Abstract: Disclosed, amongst other things, is: (i) a mold-cooling device; (ii) a molding system having a mold-cooling device; (iii) a mold assembly having a mold-cooling device; (iv) a molded article made by a molding system in cooperation with a mold assembly and with a mold-cooling device; and (v) a method of a mold-cooling device.
    Type: Application
    Filed: May 18, 2006
    Publication date: November 22, 2007
    Inventors: Joachim Johannes Niewels, Robin Wade Lovell