Patents by Inventor Rochelle Ginsburg

Rochelle Ginsburg has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Low temperature controlled collapse chip attach process
    Patent number: 5075965
    Abstract: A controlled collapse chip connect method of joining an IC chip to a microelectronic circuit card. According to the method an inhomogeneous, anisotropic column of solder is deposited from a Pb/Sn alloy onto solder wettable I/O terminals of the I/C chip, without subsequent homogenizing reflow. The solder core has a Pb rich core and an Sn rich cap. The matching footprint of the solder wettable I/O terminals on the microelectronic circuit card is substantially free of deposited solder and presents a protected Cu surface to the solder columns, or, at most a surface of Cu and anti-oxidant. The chip is aligned with the corresponding footprints on the microelectronic circuit card, and the solder is reflowed to bond the chip to the microelectronic circuit card.
    Type: Grant
    Filed: November 5, 1990
    Date of Patent: December 31, 1991
    Assignee: International Business Machines
    Inventors: Charles F. Carey, Kenneth M. Fallon, Rochelle Ginsburg, Charles G. Woychik