Abstract: An automotive window visor and variations are disclosed. The visor is pivotably mounted or mountable to the interior of an automobile. In an extended or an open position, the visor provides shade at a side window of the automobile. First and second embodiments include an extendable section that folds or slides out from a base section to an extended position. The extendable section fold or slides back to the base section to a compact position. More shade is provided with the extendable section in the extended position than in the compact position. The third embodiment includes a shade member and a hinge. The shade member pivots downward to an open position to provide shade over a portion of a front side window. The shade member pivots upward to a closed position. The shade member may further pivot rearwardly at the hinge to provide shade at a rear side window.

Abstract: A test method for debugging failures of an IC device with use of an event based semiconductor test system is capable of distinguishing a timing related failure from other failures. The test method includes the steps of: applying a test signal to a DUT and evaluating a response output of the DUT, detecting a failure in the response output, identifying a reference clock signal related to the failure, identifying a portion of the reference clock signal that is directly related to the failure, and incrementally changing a timing of events for the identified portion of the reference clock signal to detect change in the response output from the DUT.

Abstract: A manufacturing process for LSIs uses an event tester simulator and an event tester to avoid prototype hold. In the LSI manufacturing method an LSI is designed under an EDA (electronic design automation) environment to produce design data of a designed LSI, and logic simulation is performed on a device model of the LSI design in the EDA environment with use of a testbench and producing a test vector file of an event format as a result of the logic simulation. Then, simulation data files are verified with use of the design data and the testbench by operating an event tester simulator, and a prototype LSI is produced through a fabrication provider by using the design data. The prototype LSI is tested by an event tester by using the test vector file and the simulation data files and test results is feedbacked to the EDA environment or the fabrication provider.

Abstract: An event based test system for testing an IC device under test (DUT) designed under an automatic electronic design (EDA) environment. The event based test system includes an event memory for storing event data derived directly from simulation of design data for an intended IC in the EDA environment where the event data to denote each event is formed with time index indicating a time length from a predetermined point and an event type indicating a type of change at an event, an event generation unit for generating test vectors based on the event data where waveform of each vector is determined by the event type and a timing of the waveform is determined by accumulating the time index of previous events, and means for supplying test vectors to the DUT and evaluating response outputs of the DUT at predetermined timings.

Abstract: A method for design validation of complex IC with use of a combination of electronic design automation (EDA) tools and a design test station at high speed and low cost. The EDA tools and device simulator are linked to the event based test system to execute the original design simulation vectors and testbench and make modifications in the testbench and event based test vectors until satisfactory results are obtained. The event based test vectors are test vectors in an event format in which an event is any change in a signal which is described by its timing and the event based test system is a test system for testing an IC by utilizing the event based test vectors. Because EDA tools are linked with the event based test system, these modifications are captured to generate a final testbench that provides satisfactory results.

Abstract: A method of debugging an individual core in core based system-on-a-chip (SOC) ICs with high accuracy and observability, and a structure of SOC incorporating the method. The method includes the steps of building two or more metal layers of a pad frame for each core in an SoC while connecting I/O (input and output) pads on a lower metal layer to a top metal layer, thereby exposing all I/O pads and power pads on a surface of the top metal layer of the pad frame of each core, and applying test vector to each core through the I/O pads on the top metal layer of the core and evaluating response outputs of the core received through the I/O pads on the top metal layer.

Abstract: A method of evaluating a core based SoC detects and localizes faults in the cores or interconnects between the cores with high accuracy and observability. The method includes the steps of building two or more metal layers to create core I/O pads having all I/O pads and power pads on a surface of the top metal layer of the pad frame of each core, testing the SoC as a whole by applying test vectors to the SoC through chip I/O pads and evaluating response outputs of the SoC, testing each core in the SoC by applying core specific test vectors to the core through the core I/O pads on the top metal layer of the core and evaluating response outputs of the core, and finding a location of a fault when the fault is detected when testing the SoC chip as a whole or when testing each of the cores.

Abstract: A method for applying test vectors to a device under test (DUT) at a speed of the DUT is disclosed. A pattern memory is re-organized into m modules, where m is a DUT/pattern memory speed ratio. Delay circuits in address lines of each module are programmed such that an address signal for a qth module is delayed by (q?1) delay units, where each delay unit is equivalent to one DUT clock cycle. Patterns for each test are stored in these modules according to [n mod m]; where n is a number of patterns in a test. Identical addresses are simultaneously applied to the delay circuits of the m modules according to a fixed address sequence at a rate f equal to or slower than the operating frequency of the pattern memory, such that a period of f is equal to or greater than (m?1) delay units.

Abstract: A test method for debugging failures of an IC device with use of an event based semiconductor test system is capable of distinguishing a timing related failure from other failures. The test method includes the steps of: applying a test signal to a DUT and evaluating a response output of the DUT, detecting a failure in the response output, identifying a reference signal related to the failure, identifying a portion of the reference signal, and incrementally changing a timing of events in the portion of the reference signal to detect change in the response output from the DUT.

Abstract: An ATE calibration method and system that does not require external test equipment to calibrate individual functional pins and provides balanced timing skews among the functional pins and pincards is disclosed. A functional pin in the test system is selected as a reference or “golden” pin and another is selected as a precision measurement unit (PMU). External test equipment and the reference PMU are used to measure the AC and DC characteristics of the reference pin, and any deviation represents a measurement error in the reference PMU. All functional pins in the test system can be measured against the reference pin using the reference PMU, taking into account the measurement error, without the need for external test equipment. To ensure that skews are balanced among all pins, the location of the reference pin is selected to be as close as possible to the midpoint of the functional pin range.

Abstract: An ATE calibration method and system that does not require external test equipment to calibrate individual functional pins and provides balanced timing skews among the functional pins and pincards is disclosed. A functional pin in the test system is selected as a reference or “golden” pin and another is selected as a precision measurement unit (PMU). External test equipment and the reference PMU are used to measure the AC and DC characteristics of the reference pin, and any deviation represents a measurement error in the reference PMU. All functional pins in the test system can be measured against the reference pin using the reference PMU, taking into account the measurement error, without the need for external test equipment. To ensure that skews are balanced among all pins, the location of the reference pin is selected to be as close as possible to the midpoint of the functional pin range.

Abstract: A semiconductor test system is disclosed which accepts pincards from multiple vendors, each pincard including a local non-volatile memory in which specific calibration data can be stored. Each pincard in the test system may be capable of performing different types of tests on the DUT. Non-volatile memory on the pincard is used to store pincard calibration data, and loadboard and socket related calibration data may also be stored locally in the non-volatile memory of each pincard for use in compensating for signal degradation. Calibration data related to pincard slots (i.e. slot-to-slot skew) may be stored in nonvolatile memory on a test system backplane and used to calibrate slot-to-slot skew of the pincard. Local non-volatile memory may also be used to store commands, data, and error information being generated in or transferred between modules, site controllers and the system controller, so that this information does not need to be regenerated if a system error should occur.

Abstract: A high speed semiconductor test system is so designed that pin cards in a test head are arranged in radial directions where the DUT is placed over the center of the test head. Since each of the pin cards is arranged radially, the side which faces the center is close to the DUT, and time critical components in the pin card are formed in an area close to the side of that faces the center, thereby minimizing the round-trip-delay (RTD).Moreover, each pin card is distanced equally from the DUT. Thus, the variation in the length of path connecting between the pin card and the DUT is minimized, and accordingly, the variation in RTD is also minimized.

Abstract: The present invention is directed to a locking apparatus and loadboard assembly of a semiconductor testing device apparatus. The loadboard assembly includes a printed circuit board containing a device under test and an interface board secured to the bottom of the printed circuit board. The interface board has two members with a space between them. Spacers connect the members to form apertures for contact pins on a test head. The loadboard assembly is placed on top of a locking apparatus which is mounted on the top surface of the test head. The placement of the loadboard on the locking apparatus is done according to two pins of different cross-sections that extend through two holes in the interface board and printed circuit board of the loadboard assembly. When the loadboard assembly is placed on the locking mechanism, rollers mounted on the interface board are received in cam slots of a cam member of the locking apparatus. These rollers follow the cam slots as the cam member is moved.

Abstract: A method for applying test vectors to a device under test (DUT) at a speed of the DUT is disclosed. A pattern memory is re-organized into m modules, where m is a DUT/pattern memory speed ratio. Delay circuits in address lines of each module are programmed such that an address signal for a qth module is delayed by (q−1) delay units, where each delay unit is equivalent to one DUT clock cycle. Patterns for each test are stored in these modules according to [n mod m]; where n is a number of patterns in a test. Identical addresses are simultaneously applied to the delay circuits of the m modules according to a fixed address sequence at a rate f equal to or slower than the operating frequency of the pattern memory, such that a period of f is equal to or greater than (m−1) delay units.

Abstract: The present invention is directed to a locking apparatus and loadboard assembly of a semiconductor testing device apparatus. The loadboard assembly includes a printed circuit board containing a device under test and an interface board secured to the bottom of the printed circuit board. The interface board has two members with a space between them. Spacers connect the members to form apertures for contact pins on a test head. The loadboard assembly is placed on top of a locking apparatus which is mounted on the top surface of the test head. The placement of the loadboard on the locking apparatus is done according to two pins of different cross-sections that extend through two holes in the interface board and printed circuit board of the loadboard assembly. When the loadboard assembly is placed on the locking mechanism, rollers mounted on the interface board are received in cam slots of a cam member of the locking apparatus. These rollers follow the cam slots as the cam member is moved.

Abstract: A high speed semiconductor test system is so designed that pin cards in a test head are arranged in radial directions where the DUT is placed over the center of the test head. Since each of the pin cards is arranged radially, the side which faces the center is close to the DUT, thereby minimizing the round-trip-delay (RTD). Moreover, each pin card is distanced equally from the DUT. Thus, the variation in the length of path connecting between the pin card and the DUT is minimized, and accordingly, the variation in RTD is also minimized.

Abstract: An intangible property management method and system to enumerate and account intangible property is described. The intangible property management system utilizes a computer system which uses various domains of the intangible property to enumerate and account intangible property based on relationships with various business parameters. The system is configured by a computer system for executing a program and processing data describing the intangible assets interrelated with business parameters, and a multi-dimensional chart having multiple domains which are assigned with types of intangible property and business parameters.

Abstract: A method and apparatus for validating SoC (system-on-a-chip) design with high accuracy and speed and low cost. The [apparatus allows to use a] method [which] includes the steps of verifying individual cores to be integrated in an SoC by evaluating a silicon IC having a function and structure identical to that of each core constituting the SoC with use of test patterns generated based on simulation testbenches produced through a design stage of the cores; verifying interfaces between the individual cores, on-chip buses of the cores and glue logic by using the silicon ICs and simulation testbenches [developed by an SoC designer] and FPGA/emulation of the glue logic; verifying core-to-core timings and SoC level timing critical paths; and performing an overall design validation by using the silicon ICs and simulation testbenches of [an] the overall SoC [and application runs].

Abstract: A universal IC test system is designed to function both an event tester and a cyclized tester. The universal test system is comprised of an event tester for testing DUT by test vectors produced based on event data derived directly from simulation of design data of DUT produced in an EDA environment a cyclized tester for testing DUT by test vectors produced based on test data formulated in a cyclized format in which each test vector is defined by a waveform, a test rate, and a timing with respect to the test rate, a pin-electronics for applying the test vector to DUT and comparing a response output of DUT, and means for changing a tester mode between an event tester mode and a cyclized tester mode thereby testing DUT either by the event tester or the cyclized tester, or by both testers.