Abstract: The present invention provides printed circuit boards, EMI shields, and methods that provide an EMI absorbing material and an EMI reflecting material. In one embodiment, the EMI shield comprises a shield body and an EMI absorbing material coupled to the shield body.

Abstract: The present invention provides shielded printed circuit boards and electronic devices. The printed circuit board may comprise an internal network of grounded conductive elements that are coupleable to an EMI shield that is mounted on the printed circuit board. The network of grounded conductive elements are coupleable to a grounded layer and to the EMI shield and provides improved EMI shielding through the volume of the printed circuit board below an electronic component mounted on the printed circuit board.

Abstract: A shielded cable includes a cable body that is surrounded by a vacuum metallized layer. The metallized layer can be grounded with a metallized thermoform connector. Optionally, an insulating top coating can be disposed over the metallized layer over the cable body.

Abstract: The present invention includes improved RFID antennae and tags and methods of manufacturing the RFID antennas. The RFID tags of the present invention include a substrate that comprises an antenna assembly. A radiofrequency integrated circuit is in electrical communication with a portion of the antenna assembly. The RFID tag may include a structure, such as a lid element, that clamps and/or compresses the radiofrequency integrated circuit into contact with the antenna assembly, without the need for a conductive adhesive. In some embodiments, the antenna assembly is vacuum metallized or otherwise applied onto the substrate through patterned openings in a mask, such as a patterned masking cliché or a patterned polymer layer.

Abstract: An RFID smart label includes a plurality of layers, wherein one of the plurality of layers is an RFID inlay with a depression/recession region for holding the RFID chip/strap so that it does not extend above the surface of the antenna. The depressed/recessed region can have substantially the same depth as the thickness of the RFID chip/strap. High speed printing processes are then used to economically print labels on the RFID inlays having the RFID chip/strap embedded because there are no bumps to impede the printing process.

Abstract: The present invention provides electronic devices, kits, and connector assemblies for coupling an EMI shield to a ground trace. In one embodiment, the present invention provides an electronic device comprising a printed circuit board and an EMI shield that has a flange around at least a portion of a perimeter of the EMI shield. One or more connectors coupled to the flange removably contact the flange to a ground trace of the printed circuit board.

Abstract: The present invention provides printed circuit boards, EMI shields, and methods that provide an EMI absorbing material and an EMI reflecting material. In one embodiment, the EMI shield comprises a shield body and an EMI absorbing material coupled to the shield body.

Abstract: The present invention provides methods and devices for shielding an electronic component package. In one embodiment, an EMI shield is integrally formed within the package adjacent the die and grounded. The EMI shield may be a metallized shaped polymer layer and may be disposed fully within the package or it may extend out of the package.

Abstract: A shielded cable includes a cable body that is surrounded by a vacuum metallized layer. The metallized layer can be grounded with a metallized thermoform connector to prevent the release or impingement of harmful EMI radiation. Optionally, an insulating top coating can be disposed over the metallized layer over the cable body.

Abstract: The present invention provides in-line equipment and methods for manufacturing an EMI/RFI shield that is integrated formed in a formable sheet. The EMI/RFI shield may comprise a shaped thermoform shell that has one or more conductive layers applied to one or more surfaces. The EMI/RFI shield may be integrally formed with the formable sheet via attachment tabs that are positioned along one or more edges of the EMI/RFI shield.

Abstract: Apparatus and methods for coating a substrate. In an exemplary embodiment, the apparatus are used to create a metallized substrate for use as an EMI/RFI shield. The apparatus typically includes a movable processing apparatus that is movable orthogonal to the substrate to treat the substrate. The processing apparatus can include a surface preparation assembly, a heating assembly, a thermoforming assembly, a metallizing assembly, a cutting assembly, or the like.

Abstract: The present invention provides shielded printed circuit boards and electronic devices. The printed circuit board may comprise an internal network of grounded conductive elements that are coupleable to an EMI shield that is mounted on the printed circuit board. The network of grounded conductive elements are coupleable to a grounded layer and to the EMI shield and provides improved EMI shielding through the volume of the printed circuit board below an electronic component mounted on the printed circuit board.

Abstract: The present invention provides methods and devices for shielding an electronic component package. In one embodiment, an EMI shield is integrally formed within the package adjacent the die and grounded. The EMI shield may be a metallized shaped polymer layer and may be disposed fully within the package or it may extend out of the package.

Abstract: Multi-layered molds and methods for manufacturing multi-layered molds. A metallized layer can be deposited on at least one side of a substrate. The substrate can be shaped and then the metal layer can be deposited onto the shaped substrate. Optionally, an injection molded resin can be deposited onto the substrate and/or metal layer.

Abstract: The present invention provides cables having a body that is surrounded by a vacuum metallized layer. The metallized layer can be grounded with a metallized thermoform connector to prevent the release or impingement of harmful EMI radiation. Optionally, an insulating top coating can be disposed over the metallized layer over the cable body.

Abstract: Multi-layered molds and methods for manufacturing multi-layered molds. A metallized layer can be deposited on at least one side of a substrate. The substrate can be shaped and then the metal layer can be deposited onto the shaped substrate. Optionally, an injection molded resin can be deposited onto the substrate and/or metal layer.

Abstract: The present invention provides in-line equipment and methods for manufacturing an EMI/RFI shield that is integrated formed in a formable sheet. The EMI/RFI shield may comprise a shaped thermoform shell that has one or more conductive layers applied to one or more surfaces. The EMI/RFI shield may be integrally formed with the formable sheet via attachment tabs that are positioned along one or more edges of the EMI/RFI shield.

Abstract: The present invention provides methods for shielding a cable that comprises a plurality of conductive leads that are encapsulated by a dielectric substrate. One embodiment of the method comprises applying a metallized layer around the dielectric substrate and coupling a metallized thermoform shield around an end of the metallized dielectric substrate and conductive leads so as to create a conductive connection between the metallized thermoform shield and the metallized layer on the dielectric substrate.

Abstract: The present invention provides electromagnetic interference filters and gaskets. In exemplary embodiments, the filters and gaskets are made from conductively coated reticulated foam having a pore density varying from 10 to 40 pores per inch (PPI). The filters can be used to cover ventilation openings in an electronics enclosure to shield electrical components, equipment and devices from EMI, electrostatic discharge (ESD) and radio frequency interference (RFI) while still providing adequate airflow to enter and cool the system. The filter material may also help prevent dust and dirt from entering the enclosure. The filters of the present invention are also well suited to conductively bridge gaps between mating features of electronic enclosures. The reticulated foam to fabricate the filters allow for excellent compression (generally 20%-50% of the original thickness) under low compressive forces, while easily recovering from the compressive load without noticeable compression set (permanent deflection).

Abstract: Multi-layered molds and methods for manufacturing multi-layered molds. A metallized layer can be deposited on at least one side of a substrate. The substrate can be shaped and then the metal layer can be deposited onto the shaped substrate. Optionally, an injection molded resin can be deposited onto the substrate and/or metal layer.