Abstract: Technologies are provided for supporting multi-actuator storage device access using logical addresses. Separate sets of storage locations on a storage medium of a storage device can be associated with different actuators of the storage device. For example, a first set of storage locations can be assigned to a first actuator of the storage device and a second set of storage locations can be assigned to a second actuator of the storage device. The storage locations of the storage medium can be associated with logical addresses. The storage device can receive a data access request containing a logical address and can identify a storage location associated with the logical address. The storage device can identify a storage location set to which the storage location belongs and can use an actuator associated with the storage location set to access the storage location associated with the logical address.

Abstract: Technology is described for a system that includes a power source, a first computing device, a second computing device and a host controller. The power source may provide a direct current (DC) voltage. The first computing device may perform a computing function in a computing environment. The second computing devices may be connected in series to the power source via the first computing device. The first computing device may be directly coupled to the power source and may receive the DC voltage from the power source, and the second computing device may receive a remaining amount of the DC voltage. The host controller may manage computing operations of the first computing device and the second computing device to control load impedance between first computing device and the second computing device.

Abstract: Technologies are provided for supporting multi-actuator storage device access using logical addresses. Separate sets of logical addresses (such as logical block addresses) can be associated with different actuators of a storage device. For example, a first set of logical addresses can be assigned to storage locations on one or more storage media that is/are accessible using a first actuator of the storage device and a second set of logical addresses can be assigned to storage locations on one or more storage media that is/are accessible using a second actuator of the storage device. The storage device can receive a data access request containing a logical address and can identify a logical address set to which the logical address belongs. The storage device can use an actuator associated with the logical address set to access a storage location assigned to the logical address.

Abstract: A device includes an interposer card that includes a processor, such as a system on a chip (SoC), and memory devices. The interposer card mounts to a mass storage device and has a shape that corresponds to a size of an end of the mass storage device to which the interposer card is mounted. The SoC of the interposer card is configured to implement an individual server for the mass storage device to which the interposer card is mounted. In some embodiments, a data storage system includes multiple mass storage devices mounted in a chassis and coupled to one or more backplanes, wherein interposer cards are connected between the mass storage devices and the one or more backplanes.

Abstract: Systems and techniques for tracking and providing real-time visualizations of maintenance time for datacenter components. The systems include sensors to detect when datacenter components are opened for maintenance, such as hot switching of hard drive disks, to initialize a countdown timer. Status indicator lights of components within the datacenter component are used to display visual representations of the countdown timer. The visualizations present a remaining or elapsed maintenance time remaining to ensure components of the datacenter component are not damaged by overheating during maintenance.

Abstract: A device includes an interposer card that includes a processor, such as a system on a chip (SoC), and memory devices. The interposer card mounts to a mass storage device and has a shape that corresponds to a size of an end of the mass storage device to which the interposer card is mounted. The SoC of the interposer card is configured to implement an individual server for the mass storage device to which the interposer card is mounted. In some embodiments, a data storage system includes multiple mass storage devices mounted in a chassis and coupled to one or more backplanes, wherein interposer cards are connected between the mass storage devices and the one or more backplanes.

Abstract: A system includes a rack and one or more server systems mounted in the rack. A server system includes a chassis with one or more arrays of devices in the chassis. Each array includes mass storage devices and a server device mounted in the array within the chassis of the server system. The server device occupies no more than an equivalent volume of space in the chassis as one of the mass storage devices. A set of mass storage devices of an array and the server device of the array form a logical node, and a server system may include multiple logical nodes in the same chassis. Each array of devices may be located in a sled that can move into and out of the chassis of the server system.

Abstract: Technologies are provided for accessing a physical location of a storage medium reader of a storage device. A computing device can transmit a request for the storage medium reader's physical location. The storage device can determine the physical location of the storage medium reader and transmit the location to the computing device. The computing device can use the physical location of the storage medium reader to determine an expected latency for retrieving one or more stored data items. The computing device can transmit a command to change the physical location of the storage medium reader, for example by changing a location of the storage medium reader with respect to a given storage medium and/or changing a storage medium that is accessed by the storage medium reader. The computing device can control the placement of the storage medium reader in order to optimize retrieval of data items from the storage device.

Abstract: A rules-based mechanism is described for powering down racks in an ordered and autonomous way in a data center. Power shelf controllers (PSCs), on different racks or on the same rack, communicate together through a network, called the PSC network, separate from the data network. The PSCs are aware of the other PSCs that share the same input power domain. When the racks are configured for use, each PSC is assigned a priority value, based upon the management provisioning layer assignment. Each PSC creates a table of all the other PSCs and tracks each assigned priority value. When a power event occurs, the PSC can power down components within the rack in accordance with the priority table. Recovery can also be carried out in conformance with the priority table.

Abstract: A rack computer system can provide data indicating electrical power consumption by separate sets of the mass storage devices, including separate individual mass storage devices, of the rack computer system. A power sensor can be electrically coupled to a power transmission line for each mass storage device. The power sensor can be coupled to the power transmission line externally to the mass storage device. The power sensor can be an internal power sensor of the mass storage device, where a mass storage device microcontroller transmits internally-generated data to an external power monitoring system. A microcontroller can transmit the data to a baseboard management controller via a side-band connection between the mass storage device and the controller. The data can be transmitted via an in-band connection between a baseboard management controller and an instance of firmware which accesses internally-generated data from mass storage device microcontrollers.

Abstract: Power systems and methods for supplying direct current power to a server rack via a power shelf assembly that includes multiple power supply units (PSUs) and a power shelf controller (PSC) that ensures a correct configuration of PSUs, backup battery units (BBUs), and connection components using a power shelf configuration record. Upon a boot cycle of the PSC, the configuration identified in the power shelf controller is compared to an actual configuration of the components being connected between a server rack and the power shelf assembly to avoid providing power too soon and causing an overload of components for the server rack.

Abstract: A system can include a midplane board and multiple sleds. Each sled can include a processor and an interconnect part. The interconnect part can be positioned at a lateral edge of the sled. Both sides of the midplane board can include interconnect portions that engage the interconnect parts from the sleds. The interconnect portions of the midplane board can be connected to enable inter-processor communication among processors on the sleds. For example, the midplane board may connect processors from first and second sleds received on one side of the midplane board with processors from third and fourth sleds received on an opposite side of the midplane board. The sleds may connect to power at rear, for example, being translated in a longitudinal direction to engage power and translated toward the midplane board and non-parallel to the longitudinal direction to engage the interconnect parts and portions.

Abstract: A rack computer system can provide data indicating electrical power consumption by separate sets of the mass storage devices, including separate individual mass storage devices, of the rack computer system. A power sensor can be electrically coupled to a power transmission line for each mass storage device. The power sensor can be coupled to the power transmission line externally to the mass storage device. The power sensor can be an internal power sensor of the mass storage device, where a mass storage device microcontroller transmits internally-generated data to an external power monitoring system. A microcontroller can transmit the data to a baseboard management controller via a side-band connection between the mass storage device and the controller. The data can be transmitted via an in-band connection between a baseboard management controller and an instance of firmware which accesses internally-generated data from mass storage device microcontrollers.

Abstract: A server system includes a server chassis with one or more composite walls that provide structural stiffness for the server chassis. The one or more composite walls also include one or more air passages that permit air to flow through the composite walls. Each composite wall comprises at least two plates and one or more spacing devices that separate the at least two plates. Air passages are included in the composite wall between the at least two plates separated by the spacing devices and one or more openings permit air flowing through the air passages of the composite wall to flow out of the composite wall and across server devices mounted in the server chassis that includes the composite wall.

Abstract: A system includes a rack and one or more server systems mounted in the rack. A server system includes a chassis with one or more arrays of devices in the chassis. Each array includes mass storage devices and a server device mounted in the array within the chassis of the server system. The server device occupies no more than an equivalent volume of space in the chassis as one of the mass storage devices. A set of mass storage devices of an array and the server device of the array form a logical node, and a server system may include multiple logical nodes in the same chassis. Each array of devices may be located in a sled that can move into and out of the chassis of the server system.

Abstract: A system includes a rack and one or more server systems mounted in the rack. A server system includes at least one sever node and each server node includes an array of devices including mass storage devices and at least one server device. Segments of the array of devices of a particular server node are mounted in sub-node chassis that include intra node connectors. Multiple sub-node chassis that each include devices such as mass storage devices or server devices of the sever node couple together via the intra node connectors when installed in a server system chassis to form a server node. Each server node of a server system may be a separate logical node. Also, the sub-node chassis of a server node may be configured for vertical airflow through the sub-node chassis in addition to cross airflow.

Abstract: A rack computer system can provide data indicating electrical power consumption by separate sets of the mass storage devices, including separate individual mass storage devices, of the rack computer system. A power sensor can be electrically coupled to a power transmission line for each mass storage device. The power sensor can be coupled to the power transmission line externally to the mass storage device. The power sensor can be an internal power sensor of the mass storage device, where a mass storage device microcontroller transmits internally-generated data to an external power monitoring system. A microcontroller can transmit the data to a baseboard management controller via a side-band connection between the mass storage device and the controller. The data can be transmitted via an in-band connection between a baseboard management controller and an instance of firmware which accesses internally-generated data from mass storage device microcontrollers.

Abstract: A system includes a rack and one or more server systems mounted in the rack. A server system includes a chassis with one or more arrays of devices in the chassis. Each array includes mass storage devices and a server device mounted in the array within the chassis of the server system. The server device occupies no more than an equivalent volume of space in the chassis as one of the mass storage devices. A set of mass storage devices of an array and the server device of the array form a logical node, and a server system may include multiple logical nodes in the same chassis. Each array of devices may be located in a sled that can move into and out of the chassis of the server system.

Abstract: A system includes a rack and one or more server systems mounted in the rack. A server system includes at least one sever node and each server node includes an array of devices including mass storage devices and at least one server device. Segments of the array of devices of a particular server node are mounted in sub-node chassis that include intra node connectors. Multiple sub-node chassis that each include devices such as mass storage devices or server devices of the sever node couple together via the intra node connectors when installed in a server system chassis to form a server node. Each server node of a server system may be a separate logical node. Also, the sub-node chassis of a server node may be configured for vertical airflow through the sub-node chassis in addition to cross airflow.

Abstract: A system includes a rack and one or more server systems mounted in the rack. A server system includes at least one sever node and each server node includes an array of devices including mass storage devices and at least one server device. Segments of the array of devices of a particular server node are mounted in sub-node chassis that include intra node connectors. Multiple sub-node chassis that each include devices such as mass storage devices or server devices of the sever node couple together via the intra node connectors when installed in a server system chassis to form a server node. Each server node of a server system may be a separate logical node. Also, the sub-node chassis of a server node may be configured for vertical airflow through the sub-node chassis in addition to cross airflow.