Patents by Inventor Roger Laurentius Balyon

Roger Laurentius Balyon has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Offset building integrable photovoltaic structures and assemblies having multi-conductor return lines
    Patent number: 9634606
    Abstract: Provided are novel building integrable photovoltaic (BIPV) structures having multiple photovoltaic portions offset with respect to each other along their lengths. An offset direction can correspond to the length of a row of installed BIPV structures. In some embodiments, a BIPV structure may include three offset photovoltaic portions and three corresponding flap portions for extending under photovoltaic portions of adjacent structures and sealing interfaces between installed structures. The novel BIPV structures can facilitate installation, while providing the flexibility to avoid obstacles. Provided also are novel BIPV assemblies having multi-conductor return lines extending through the assemblies. A BIPV assembly having a multi-conductor return line may include a return line for the assembly itself, and one or more return lines for other assemblies.
    Type: Grant
    Filed: November 30, 2011
    Date of Patent: April 25, 2017
    Assignee: Beijing Apollo Ding Rong Solar Technology Co., Ltd.
    Inventor: Roger Laurentius Balyon
  • OFFSET BUILDING INTEGRABLE PHOTOVOLTAIC STRUCTURES AND ASSEMBLIES HAVING MULTI-CONDUCTOR RETURN LINES
    Publication number: 20130133721
    Abstract: Provided are novel building integrable photovoltaic (BIPV) structures having multiple photovoltaic portions offset with respect to each other along their lengths. An offset direction can correspond to the length of a row of installed BIPV structures. In some embodiments, a BIPV structure may include three offset photovoltaic portions and three corresponding flap portions for extending under photovoltaic portions of adjacent structures and sealing interfaces between installed structures. The novel BIPV structures can facilitate installation, while providing the flexibility to avoid obstacles. Provided also are novel BIM/assemblies having multi-conductor return lines extending through the assemblies. A BIPV assembly having a multi-conductor return line may include a return line for the assembly itself, and one or more return lines for other assemblies.
    Type: Application
    Filed: November 30, 2011
    Publication date: May 30, 2013
    Applicant: MIASOLE
    Inventor: Roger Laurentius Balyon