Abstract: Method and system for making a partially coated product (5) having at least one coated area (6) and at least one non-coated area (7). Means (1) are provided for providing a digital representation of the product, including a cover layer (8) for each intended non-coated area which covers the intended non-coated area (7) and an isolation layer between them (9) which is isolated from the product's outside surface. A production device (2) is provided which is arranged to produce the product, including its respective cover and isolation layers under control of the digital representation. Means (3) for coating (10) the product are provided, including its respective cover layers. Finally, removing means (4) are provided which are arranged for removing the respective cover and, when applicable, isolation layers, including their coating, from the respective intended non-coated areas.

Abstract: The invention provides a method for preparing a pattern for an electric circuit comprising the steps of: (a) providing a substrate; (b) providing a pattern of an inhibiting material for an electrical circuit onto said substrate by i) applying a layer of the inhibiting material onto said substrate and mechanically removing locally the layer of the inhibiting material to obtain said pattern; or ii) applying a layer of the inhibiting material onto said substrate, wherein said layer has pre-determined pattern which incompletely covers said substrate; (c) establishing a distribution of particles of a first metal or alloy thereof on the layer of the inhibiting material and the pattern as obtained in step.

Abstract: A method for partially metallizing a product comprising a first surface, a first polymer material, and a second surface, a second polymer material, wherein the method comprises the sequential steps of exposing the first and second surfaces to conditions which render the first surface hydrophilic, and the second surface hydrophobic; contacting the first and second surfaces with water or aqueous solution; contacting the first and second surfaces with a solution of a film former in a water-immiscible solvent; evaporating the solvent to allow formation of a film by the film former on the second surface; adherence of a film by the film former on the first surface is prevented by the presence of the water or aqueous solution thereupon; performing a conventional metallization process to deposit a metal layer on the first and second surface; and removing the metallized film from the second surface to render the first surface metallized.

Abstract: The invention is directed to a method for preparing a substrate with an electrically conductive pattern for an electric circuit, to the substrate with the electrically conductive pattern, and to a device comprising the substrate with the electrically conductive pattern.

Abstract: The invention is directed to a method for preparing a moulded body comprising an integrated electric circuit, to a body comprising an integrated electric circuit, and to a device comprising the body. The method of the invention comprises—placing one or more electrical components in a mould and fixing the one or more electrical components; —at least partially moulding said body using a moulding material; —providing a conductive pattern onto said at least partially moulded body; —providing one or more conductive interconnections onto said at least partially moulded body; and—optionally further moulding said body, wherein the at least partially moulding of said body, the provision of the conductive pattern, and the provision of the one or more conductive interconnections are carried out within said mould.

Abstract: The invention is directed to a method of providing a plastic substrate with a metallic pattern and to a plastic substrate with a metallic pattern obtainable by said method. The method of the invention comprises i) replicating a pattern of recesses and protrusions on a plastic substrate by pressing a stamp having recesses and protrusions against the substrate, thereby providing said plastic substrate with recesses and protrusions; ii) removing said stamp from said substrate; iii)—applying a layer of seed material capable of initiating an electroless or electrochemical metal deposition process onto said plastic substrate in a selective pattern at least in the recesses of said plastic substrate to yield a substrate wherein said seed material remains selectively in the recesses of said substrate; and thereafter iv) using said seed material to initiate a metal deposition process.

Abstract: The invention provides a method for preparing a pattern for an electric circuit comprising the steps of: (a) providing a substrate; (b) providing a pattern of an inhibiting material for an electrical circuit onto said substrate by i) applying a layer of the inhibiting material onto said substrate and mechanically removing locally the layer of the inhibiting material to obtain said pattern; or ii) applying a layer of the inhibiting material onto said substrate, wherein said layer has pre-determined pattern which incompletely covers said substrate; (c) establishing a distribution of particles of a first metal or alloy thereof on the layer of the inhibiting material and the pattern as obtained in step.

Abstract: The invention provides a process for preparing a moulded product on which or in which a layer of a metal or alloy thereof is applied, in which process use is made of a mould, which process comprises a moulding step and a metallising step, wherein the moulding and metallising step are both carried out in the mould, wherein said metallising step comprises can electroless process. The invention further relates to a device comprising the moulded product obtained by said process.

Abstract: The invention provides an electroless process for depositing a metal on an essentially catalyst-free substrate, which process comprises the steps of: (a)providing an essentially catalyst-free substrate; and (b) exposing said essentially catalyst-free substrate to an electroless solution to deposit the metal on the substrate, which solution comprises metal ions and a reducing agent for reducing the metal ions into the metal, whereby at least the surface of the substrate has a temperature or is heated to a temperature (T1) which is higher than the temperature (T2) of the solution.

Abstract: Method for metallizing a product (11) comprising a first component (12) and a second component (13). The product is exposed to a first environment (14) causing the surface of the first component to be hydrophilic and the surface of the second component to be hydrophobic. The product is exposed to a watery solution (15a). Next, the product is exposed to a solution (17a) of a film former and subsequently to a second environment (17b), wherein the solvent evaporates and a film (18) is formed covering the whole product, while maintaining the water film under the film. The product then is rinsed out (17c), causing that the film is removed at the locations of the hydrophilic surface of the first component. Next, the product is nucleated, thus forming a nuclei layer (20) and subsequently the film is removed (19b) only leaving the nuclei layer at the hydrophilic surface of the first component.

Abstract: The invention provides a method for preparing a conductive strain sensor on the surface of a device to measure strain at the surface of the device, which method comprises the steps of (a) providing a device; (b) optionally applying an isolating layer on a surface of the device; (c) establishing a distribution of particles of a first metal on the isolating layer obtained in step (b); and (d) depositing a layer of a second metal on at least part of the distribution of the particles of the first metal as obtained in step (c) by means of an electroless plating process or electro-deposition process.

Abstract: Method and system for making a partially coated product (5) having at least one coated area (6) and at least one non-coated area (7). Means (1) are provided for providing a digital representation of the product, including a cover layer (8) for each intended non-coated area which covers the intended non-coated area (7) and an isolation layer between them (9) which is isolated from the product's outside surface. A production device (2) is provided which is arranged to produce the product, including its respective cover and isolation layers under control of the digital representation. Means (3) for coating (10) the product are provided, including its respective cover layers. Finally, removing means (4) are provided which are arranged for removing the respective cover and, when applicable, isolation layers, including their coating, from the respective intended non-coated areas.

Abstract: Manufacturing a wire beam (1), comprising a support member (2) and a number of conductors (3). In order to incorporate the conductors on or in the support member the wire beam is manufactured by means of a so-called moulded interconnect device (MID) manufacture process. At least part of the conductors may be shaped, during the MID manufacturing process, as conductors which are conductively interconnected at their ends. The interconnected conductors then may be used as a common electrode during an electrodeposition process in which the conductors are galvanized electrically to provide them with an additional conductive layer. The interconnected ends are removed after completion of the electrodeposition process.

Abstract: A method for manufacturing a substrate for use in a stamper manufacturing process and a substrate which is used in stamper manufacturing process to be used in producing optical discs, includes exposing, developing and heating of a photosensitive film that has been coated onto a substrate.

Abstract: The present invention relates to a method for manufacturing a substrate for use in a stamper manufacturing process. The present invention furthermore relates to a substrate which is used in a stamper manufacturing process and to a method for manufacturing a stamper to be used in producing optical discs, comprising the exposing, developing and heating of a photosensitive film that has been coated onto a substrate.

Abstract: A method of manufacturing a stamper for producing optical discs involves the application of a photoresist film to a substrate and subsequently structuring the photoresist film by exposing and developing the photoresist film. The method is characterized in that an electrically conducting substrate is used. The substrate having the structured photoresist film thereon is subjected to passivation treatment, and is further subject to galvanic treatment for the purpose of forming a nickel layer thereon. After the nickel layer is formed, the nickel layer is separated from the substrate so as to obtain a stamper. The stamper can be used to prepare optical discs.