Patents by Inventor Roland Enzmann
Roland Enzmann has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
-
Patent number: 11892651Abstract: An optoelectronic component includes an optoelectronic semiconductor chip configured to emit electromagnetic radiation; an optically effective element arranged such that electromagnetic radiation emitted by the optoelectronic semiconductor chip passes through the optically effective element; and a housing, wherein the optoelectronic semiconductor chip is arranged in a cavity of the housing, the optically effective element includes a carrier, a first optically effective structure arranged on a top side of the carrier, and a cover arranged above the first optically effective structure.Type: GrantFiled: April 1, 2021Date of Patent: February 6, 2024Assignee: OSRAM OLED GmbHInventors: Roland Enzmann, Hubert Halbritter, Markus Arzberger, Andreas Ploessl, Roland Schulz, Georg Rossbach, Bernd Boehm, Frank Singer, Matthias Sabathil
-
Patent number: 11355897Abstract: In an embodiment a light-emitting component includes a housing and an edge emitting semiconductor laser arranged in the housing, wherein the semiconductor laser is configured to emit light at a side face in an angle range, wherein the housing includes an emission opening for emitting the light, wherein the semiconductor laser is arranged in a first layer having a first material, wherein a second layer is arranged on the first layer, the second layer having a second material, wherein the first layer and the second layer are transmissive to the light, wherein the second layer is arranged between the first layer and the emission opening, wherein the emission opening lies at least partly outside the angle range of the semiconductor laser, and wherein a part of the light is directed directly onto an interface between the first and second layers.Type: GrantFiled: April 12, 2017Date of Patent: June 7, 2022Assignee: OSRAM OLED GMBHInventors: Hubert Halbritter, Roland Enzmann, Andreas Wojcik
-
Publication number: 20210223559Abstract: An optoelectronic component includes an optoelectronic semiconductor chip configured to emit electromagnetic radiation; an optically effective element arranged such that electromagnetic radiation emitted by the optoelectronic semiconductor chip passes through the optically effective element; and a housing, wherein the optoelectronic semiconductor chip is arranged in a cavity of the housing, the optically effective element includes a carrier, a first optically effective structure arranged on a top side of the carrier, and a cover arranged above the first optically effective structure.Type: ApplicationFiled: April 1, 2021Publication date: July 22, 2021Inventors: Roland Enzmann, Hubert Halbritter, Markus Arzberger, Andreas Ploessl, Roland Schulz, Georg Rossbach, Bernd Boehm, Frank Singer, Matthias Sabathil
-
Patent number: 11061174Abstract: A diffractive optical element includes a carrier and a plurality of nano- or micro-scale rods arranged above a top side of the carrier, wherein the rods are arranged parallel to one another in a regular grid arrangement. A method of producing a diffractive optical element includes providing a carrier and epitaxially growing a plurality of mutually parallel nano- or micro-scale rods in a regular gird arrangement above a top side of the carrier.Type: GrantFiled: March 16, 2017Date of Patent: July 13, 2021Assignee: OSRAM OLED GmbHInventors: Roland Enzmann, Hubert Halbritter, Adrian Stefan Avramescu, Thomas Hager, Georg Roßbach
-
Patent number: 10996482Abstract: An optically effective element includes a carrier, a first optically effective structure arranged on a top side of the carrier, and a cover arranged above the first optically effective structure. A method of producing an optically effective element includes providing a carrier, forming a first optically effective structure on a top side of the carrier, and arranging a cover above the top side of the carrier and the first optically effective structure.Type: GrantFiled: September 1, 2017Date of Patent: May 4, 2021Assignee: OSRAM OLED GmbHInventors: Roland Enzmann, Hubert Halbritter, Markus Arzberger, Andreas Ploessl, Roland Schulz, Georg Rossbach, Bernd Boehm, Frank Singer, Matthias Sabathil
-
Patent number: 10991853Abstract: A carrier for an optoelectronic component includes a main body, wherein the main body includes a first electrically conductive heating layer arrangement, a first solder layer for soldering an optoelectronic component to the main body is arranged on a first side of the main body, the first electrically conductive heating layer arrangement is electrically insulated from the first solder layer and thermally connected to the first solder layer, and the first heating layer arrangement has an exposed portion on which molten solder of the first solder layer can flow to reduce an electrical resistance of the first heating layer arrangement.Type: GrantFiled: December 14, 2016Date of Patent: April 27, 2021Assignee: OSRAM OLED GmbHInventors: Christoph Walter, Roland Enzmann, Markus Horn, Jan Seidenfaden
-
Publication number: 20200201055Abstract: A diffractive optical element includes a carrier and a plurality of nano- or micro-scale rods arranged above a top side of the carrier, wherein the rods are arranged parallel to one another in a regular grid arrangement. A method of producing a diffractive optical element includes providing a carrier and epitaxially growing a plurality of mutually parallel nano- or micro-scale rods in a regular gird arrangement above a top side of the carrier.Type: ApplicationFiled: March 16, 2017Publication date: June 25, 2020Inventors: Roland Enzmann, Hubert Halbritter, Adrian Stefan Avramescu, Thomas Hager, Georg Rossbach
-
Patent number: 10651623Abstract: An arrangement includes a conversion element, an optoelectronic semiconductor component and a first carrier including a carrier plane, wherein the conversion element is arranged on the carrier plane, the optoelectronic semiconductor component emits a first electromagnetic radiation including a first beam direction and a first wavelength from a first spectral range during operation, the first electromagnetic radiation is directed onto the conversion element, the conversion element at least partly converts the first electromagnetic radiation into a second electromagnetic radiation including a second wavelength from a second spectral range, the first beam direction of the optoelectronic semiconductor component is oriented at an inclination with respect to the carrier plane, a housing including a housing cap is provided, the housing cap is configured in a hollow-body-like fashion, the housing cap and the carrier define an interior, the conversion element and the semi-conductor component are arranged in the interiType: GrantFiled: October 14, 2016Date of Patent: May 12, 2020Assignee: OSRAM OLED GmbHInventors: Karsten Auen, Markus Horn, Roland Enzmann
-
Publication number: 20200119517Abstract: In an embodiment a light-emitting component includes a housing and an edge emitting semiconductor laser arranged in the housing, wherein the semiconductor laser is configured to emit light at a side face in an angle range, wherein the housing includes an emission opening for emitting the light, wherein the semiconductor laser is arranged in a first layer having a first material, wherein a second layer is arranged on the first layer, the second layer having a second material, wherein the first layer and the second layer are transmissive to the light, wherein the second layer is arranged between the first layer and the emission opening, wherein the emission opening lies at least partly outside the angle range of the semiconductor laser, and wherein a part of the light is directed directly onto an interface between the first and second layers.Type: ApplicationFiled: April 12, 2017Publication date: April 16, 2020Inventors: Hubert Halbritter, Roland Enzmann, Andreas Wojcik
-
Patent number: 10454240Abstract: A method of producing an optoelectronic component includes providing a carrier including a top side; creating at the top side of the carrier a region that is recessed with respect to a mounting region of the top side to form a step between the mounting region and the recessed region; arranging at the top side of the carrier a metallization extending over the mounting region and the recessed region; creating a separating track in the metallization, wherein the metallization is completely severed at least in sections in the mounting region and is at least not completely severed in the recessed region; and arranging an optoelectronic semiconductor chip above the mounting region of the top side, wherein the optoelectronic semiconductor chip is aligned at the separating track.Type: GrantFiled: September 15, 2016Date of Patent: October 22, 2019Assignee: OSRAM Opto Semiconductors GmbHInventors: Christoph Walter, Roland Enzmann, Markus Horn, Jan Seidenfaden
-
Patent number: 10431954Abstract: A laser component includes a housing, a laser chip arranged in the housing, and a conversion element for radiation conversion arranged in the housing wherein the conversion element is irradiatable with laser radiation of the laser chip. A method of producing such a laser component includes providing component parts of the laser component including a laser chip, a conversion element for radiation conversion and housing parts, and assembling the component parts of the laser component such that a housing is provided within which the laser chip and the conversion element are arranged, wherein the conversion element is irradiatable with laser radiation of the laser chip.Type: GrantFiled: July 19, 2017Date of Patent: October 1, 2019Assignee: OSRAM Opto Semiconductors GmbHInventors: Jan Seidenfaden, Jan Marfeld, Hubert Schmid, Soenke Tautz, Roland Enzmann
-
Publication number: 20190131766Abstract: A laser module includes a housing with a cavity and a window opening, a side-emitting semiconductor laser diode, arranged in the cavity that emits light radiation in the form of a laser beam, an optical deflection structure that deflects the laser beam, emitted by the semiconductor laser diode, in a direction of the window opening, and an optical output coupling structure arranged in the region of the window opening to output couple the laser beam in a defined direction and/or with a defined emission profile, wherein the optical deflection structure and the optical output coupling structure are configured in one piece in the form of a shared optical component.Type: ApplicationFiled: April 26, 2017Publication date: May 2, 2019Applicant: OSRAM Opto Semiconductors GmbHInventors: Roland Enzmann, Markus Keidler, Josip Maric, Peter Jander
-
Publication number: 20180366616Abstract: A carrier for an optoelectronic component includes a main body, wherein the main body includes a first electrically conductive heating layer arrangement, a first solder layer for soldering an optoelectronic component to the main body is arranged on a first side of the main body, the first electrically conductive heating layer arrangement is electrically insulated from the first solder layer and thermally connected to the first solder layer, and the first heating layer arrangement has an exposed portion on which molten solder of the first solder layer can flow to reduce an electrical resistance of the first heating layer arrangement.Type: ApplicationFiled: December 14, 2016Publication date: December 20, 2018Inventors: Christoph Walter, Roland Enzmann, Markus Horn, Jan Seidenfaden
-
Publication number: 20180351324Abstract: A method of producing an optoelectronic component includes providing a carrier including a top side; creating at the top side of the carrier a region that is recessed with respect to a mounting region of the top side to form a step between the mounting region and the recessed region; arranging at the top side of the carrier a metallization extending over the mounting region and the recessed region; creating a separating track in the metallization, wherein the metallization is completely severed at least in sections in the mounting region and is at least not completely severed in the recessed region; and arranging an optoelectronic semiconductor chip above the mounting region of the top side, wherein the optoelectronic semiconductor chip is aligned at the separating track.Type: ApplicationFiled: September 15, 2016Publication date: December 6, 2018Inventors: Christoph Walter, Roland Enzmann, Markus Horn, Jan Seidenfaden
-
Publication number: 20180309263Abstract: An arrangement includes a conversion element, an optoelectronic semiconductor component and a first carrier including a carrier plane, wherein the conversion element is arranged on the carrier plane, the optoelectronic semiconductor component emits a first electromagnetic radiation including a first beam direction and a first wavelength from a first spectral range during operation, the first electromagnetic radiation is directed onto the conversion element, the conversion element at least partly converts the first electromagnetic radiation into a second electromagnetic radiation including a second wavelength from a second spectral range, the first beam direction of the optoelectronic semiconductor component is oriented at an inclination with respect to the carrier plane, a housing including a housing cap is provided, the housing cap is configured in a hollow-body-like fashion, the housing cap and the carrier define an interior, the conversion element and the semi-conductor component are arranged in the interiType: ApplicationFiled: October 14, 2016Publication date: October 25, 2018Inventors: Karsten Auen, Markus Horn, Roland Enzmann
-
Publication number: 20180212404Abstract: A semiconductor laser, a laser assembly and a method of making a semiconductor laser are disclosed. In an embodiment the surface-emitting semiconductor laser includes a carrier having a carrier main side mechanically carrying a semiconductor laser; a first Bragg mirror and a second Bragg mirror so that the second Bragg mirror is further away from the carrier than the first Bragg mirror; a semiconductor layer sequence between the first and the second Bragg mirrors having at least one active zone for generating laser radiation; a metal mirror arranged directly on a side of the first Bragg mirror facing the carrier for reflecting laser radiation generated during operation of the semiconductor laser; a bonding agent layer located between the carrier and the semiconductor layer sequence; a resonator oriented perpendicular to the carrier main side; and an electrically insulating passivation layer located in the metal mirror.Type: ApplicationFiled: December 18, 2017Publication date: July 26, 2018Inventors: Roland Enzmann, Hubert Halbritter, Martin Rudolf Behringer
-
Patent number: 10033158Abstract: A semiconductor laser, a laser assembly and a method of making a semiconductor laser are disclosed. In an embodiment the surface-emitting semiconductor laser includes a carrier having a carrier main side mechanically carrying a semiconductor laser; a first Bragg mirror and a second Bragg mirror so that the second Bragg mirror is further away from the carrier than the first Bragg mirror; a semiconductor layer sequence between the first and the second Bragg mirrors having at least one active zone for generating laser radiation; a metal mirror arranged directly on a side of the first Bragg mirror facing the carrier for reflecting laser radiation generated during operation of the semiconductor laser; a bonding agent layer located between the carrier and the semiconductor layer sequence; a resonator oriented perpendicular to the carrier main side; and an electrically insulating passivation layer located in the metal mirror.Type: GrantFiled: December 18, 2017Date of Patent: July 24, 2018Assignee: OSRAM Opto Semiconductors GmbHInventors: Roland Enzmann, Hubert Halbritter, Martin Rudolf Behringer
-
Publication number: 20180101016Abstract: An optically effective element includes a carrier, a first optically effective structure arranged on a top side of the carrier, and a cover arranged above the first optically effective structure. A method of producing an optically effective element includes providing a carrier, forming a first optically effective structure on a top side of the carrier, and arranging a cover above the top side of the carrier and the first optically effective structure.Type: ApplicationFiled: September 1, 2017Publication date: April 12, 2018Inventors: Roland Enzmann, Hubert Halbritter, Markus Arzberger, Andreas Ploessl, Roland Schulz, Georg Rossbach, Bernd Boehm, Frank Singer, Matthias Sabathil
-
Publication number: 20180097335Abstract: An optoelectronic lamp device, including a carrier having a planar mounting face, at least one laser diode that emits laser radiation, wherein the laser diode has a fast axis and a slow axis, the laser diode is arranged on the mounting face such that the fast axis is formed extending parallel to the mounting face, a first collimator is provided for collimating laser radiation polarized in the direction of the fast axis, and a second collimator is provided for collimating laser radiation polarized in the direction of the slow axis, wherein, in the beam path of the laser radiation emitted by the laser diode, the first collimator is arranged proximally and the second collimator is arranged distally relative to the laser diode so that the laser radiation polarized in the direction of the fast axis can be collimated first, and only then can the laser radiation polarized in the direction of the slow axis be collimated.Type: ApplicationFiled: April 15, 2016Publication date: April 5, 2018Inventors: Andreas Breidenassel, Roland Enzmann, Sergey Khrushchev
-
Publication number: 20180090908Abstract: An arrangement having a substrate and a semiconductor laser and a method for manufacturing such an arrangement are disclosed. In an embodiment, the arrangement includes a substrate and a semiconductor laser, wherein the substrate has a top, side areas and a bottom, wherein at least one first recess is provided at the top, wherein the semiconductor laser is arranged on the top of the substrate such that a region of the side area of the semiconductor laser via which the electromagnetic radiation is emitted is arranged above the first recess.Type: ApplicationFiled: April 29, 2016Publication date: March 29, 2018Inventors: Roland Enzmann, Markus Arzberger