Abstract: A force sensing compliant enclosure for an electronic device may include at least one deformable housing wall. At least one strain concentration portion may be located on the deformable housing wall where strain caused by application of a force that deforms the deformable housing wall is greater than at other portions of the deformable housing wall. The strain concentrating portion may have a second thickness that is thinner than other portions of the deformable housing wall. One or more sensors may be positioned in the strain concentration portion and may sense strain caused by the application of the force that deforms the deformable housing wall.

Abstract: An electronic device has a force sensor that determines a measure of applied force from a user contacting a cover glass of the device. In one embodiment, a frame at least partially encloses an interior of the electronic device and has an open end. A cover glass covers the open end of the frame and is movably connected to the frame to allow movement of the cover glass in response to one or more forces applied to an external surface of the cover glass. A plurality of strain probes is positioned under the cover glass, between the cover glass and the frame, and is arranged to output a plurality of strain signals responsive to the one or more forces applied to the cover glass. A force processing module is configured to at least calculate an amount of force applied to the cover glass based on the plurality of stain signals.

Abstract: A force sensing compliant enclosure for an electronic device may include at least one deformable housing wall. At least one strain concentration portion may be located on the deformable housing wall where strain caused by application of a force that deforms the deformable housing wall is greater than at other portions of the deformable housing wall. The strain concentrating portion may have a second thickness that is thinner than other portions of the deformable housing wall. One or more sensors may be positioned in the strain concentration portion and may sense strain caused by the application of the force that deforms the deformable housing wall.

Abstract: Detecting force and touch using FTIR and capacitive location. FTIR determines applied force by the user's finger within infrared transmit lines on a touch device. A pattern of such lines determine optical coupling with the touch device. Capacitive sensing can determine (A) where the finger actually touches, so the touch device more accurately infers applied force; (B) whether finger touches shadow each other; (C) as a baseline for applied force; or (D) whether attenuated reflection is due to a current optical coupling, or is due to an earlier optical coupling, such as a smudge on the cover glass. If there is attenuated reflection without actual touching, the touch device can reset a baseline for applied force for the area in which that smudge remains. Infrared transmitters and receivers are positioned where they are not visible to a user, such as below a frame or mask for the cover glass.

Abstract: An electronic device may include a mechanical structure that mechanically supports the electronic device. One or more traces may be formed on one or more surfaces of the mechanical structure. Other electrical components may also be mounted on the surface of the mechanical structure and may or may not be connected to one or more of the traces. Additionally, one or more passivation layers may be formed on one or more of the surfaces, traces, and/or other electrical components and one or more traces and/or other electrical components may be intermixed with such passivation layers. In this way, the mechanical structure may be operable to function as an electrical component of the electronic device.

Abstract: An electronic device may be provided with a display mounted in a display frame assembly that includes a plastic structure overmolded over a display frame. A housing midplate may be used to provide the electronic device with mechanical rigidity and strength, and may also be used as a sensor plane. For sensor plane applications, accurate placement and assembly of the midplate in the housing can be critical. The housing midplate may be accurately assembled to the display frame using connections formed using welded tabs, welded and screwed nuts, overmolded plastic heat stake structures, or overmolded plastic structures and adhesive. Rework and repair operations may be performed by disconnecting connections such as welds using cutting equipment, by using solvent to dissolve adhesive, by unscrewing welded nuts, or by removing heat stake structures. Following rework or repair, a fresh midplate and associated components may be attached to the display frame.

Abstract: A method of calibrating a force sensor that includes an input surface and an array of sensing elements. The input has a number of test locations and is deformable under applied force. The force sensor is mounted in a predetermined test orientation. For each test location of the plurality of test locations on the input surface of the force sensor a predetermined test force to the test location. An element calibration value is measured for each sensing element of the array of sensing elements of the force sensor. An (x, y) deformation map of the input surface of the force sensor corresponding to the application of the predetermined test force to the test location is determined based on the measured element calibration values.

Abstract: An electronic device can include a substrate and a conductive layer. The conductive layer can be disposed over at least a portion of the substrate and a patterned conductive material can be disposed over at least a portion of the conductive layer. Alternatively, the patterned conductive layer can be disposed over at least a portion of a surface of the substrate and the conductive layer can be disposed over a portion of the surface of the substrate and in between the patterned conductive material. The conductive layer can be disposed over at least a portion of the patterned conductive material. The patterned conductive material can have a resistivity that is lower than a resistivity of the conductive layer.

Abstract: An electronic device may include a mechanical structure that mechanically supports the electronic device. One or more traces may be formed on one or more surfaces of the mechanical structure. Other electrical components may also be mounted on the surface of the mechanical structure and may or may not be connected to one or more of the traces. Additionally, one or more passivation layers may be formed on one or more of the surfaces, traces, and/or other electrical components and one or more traces and/or other electrical components may be intermixed with such passivation layers. In this way, the mechanical structure may be operable to function as an electrical component of the electronic device.

Abstract: A force sensing compliant enclosure for an electronic device may include at least one deformable housing wall. At least one strain concentration portion may be located on the deformable housing wall where strain caused by application of a force that deforms the deformable housing wall is greater than at other portions of the deformable housing wall. The strain concentrating portion may have a second thickness that is thinner than other portions of the deformable housing wall. One or more sensors may be positioned in the strain concentration portion and may sense strain caused by the application of the force that deforms the deformable housing wall.

Abstract: Conductive contacts can be disposed on multiple substrates or on different surfaces of a single substrate. Conductive material is disposed over at least a portion of the two conductive contacts to electrically connect the contacts. The conductive material may be disposed over at least one surface between the conductive contacts. One or more conductive borders can be formed on a surface of a conductive layer. The conductive border or borders can improve signal transmission across the surface of the conductive layer.

Abstract: A force-sensitive device for electronic device. The force inputs may be detected by measuring changes in capacitance, as measured by surface flex of a device having a flexible touchable surface, causing flex at a compressible gap within the device. A capacitive sensor responsive to changes in distance across the compressible gap. The sensor can be positioned above or below, or within, a display element, and above or below, or within, a backlight unit. The device can respond to bending, twisting, or other deformation, to adjust those zero force measurements. The device can use measure of surface flux that appear at positions on the surface not directly the subject of applied force, such as when the user presses on a part of the frame or a surface without capacitive sensors.

Abstract: A force-sensitive device for electronic device. The force inputs may be detected by measuring changes in capacitance, as measured by surface flex of a device having a flexible touchable surface, causing flex at a compressible gap within the device. A capacitive sensor responsive to changes in distance across the compressible gap. The sensor can be positioned above or below, or within, a display element, and above or below, or within, a backlight unit. The device can respond to bending, twisting, or other deformation, to adjust those zero force measurements. The device can use measure of surface flux that appear at positions on the surface not directly the subject of applied force, such as when the user presses on a part of the frame or a surface without capacitive sensors.

Abstract: An electronic device having a force sensor that determines a measure of applied force from a user contacting a cover glass element through the use of strain probes.

Abstract: A force sensing device for electronic device. The force inputs may be detected by measuring changes in capacitance, as measured by surface flex of a device having a flexible touchable surface, causing flex at a compressible gap within the device. A capacitive sensor responsive to changes in distance across the compressible gap. The sensor can be positioned above or below, or within, a display element, and above or below, or within, a backlight unit. The device can respond to bending, twisting, or other deformation, to adjust those zero force measurements. The device can use measure of surface flux that appear at positions on the surface not directly the subject of applied force, such as when the user presses on a part of the frame or a surface without capacitive sensors.

Abstract: An electronic device may be provided with environmental sensors. Environmental sensors may include one or more environmental sensor components and one or more acoustic components. Acoustic components may include a speaker or a microphone. Environmental sensor components may include a temperature sensor, a pressure sensor, a humidity sensor, or other sensors or combinations of sensors for sensing attributes of the environment surrounding the device. The environmental sensor may have an enclosure with an opening. The enclosure may be formed from a rigid support structure and a portion of a printed circuit. The opening may be formed in the rigid support structure or the printed circuit. The opening in the enclosure for the environmental sensor may be aligned with an opening in an outer structural member for the device. The outer structural member may be a housing structure or a cover layer for a device display.

Abstract: An electronic device may be provided with a display mounted in a display frame assembly that includes a plastic structure overmolded over a display frame. A housing midplate may be used to provide the electronic device with mechanical rigidity and strength, and may also be used as a sensor plane. For sensor plane applications, accurate placement and assembly of the midplate in the housing can be critical. The housing midplate may be accurately assembled to the display frame using connections formed using welded tabs, welded and screwed nuts, overmolded plastic heat stake structures, or overmolded plastic structures and adhesive. Rework and repair operations may be performed by disconnecting connections such as welds using cutting equipment, by using solvent to dissolve adhesive, by unscrewing welded nuts, or by removing heat stake structures. Following rework or repair, a fresh midplate and associated components may be attached to the display frame.

Abstract: An electronic device can include a substrate and a conductive layer. The conductive layer can be disposed over at least a portion of the substrate and a patterned conductive material can be disposed over at least a portion of the conductive layer. Alternatively, the patterned conductive layer can be disposed over at least a portion of a surface of the substrate and the conductive layer can be disposed over a portion of the surface of the substrate and in between the patterned conductive material. The conductive layer can be disposed over at least a portion of the patterned conductive material. The patterned conductive material can have a resistivity that is lower than a resistivity of the conductive layer.

Abstract: An electronic device may be provided with environmental sensors. Environmental sensors may include one or more environmental sensor components and one or more acoustic components. Acoustic components may include a speaker or a microphone. Environmental sensor components may include a temperature sensor, a pressure sensor, a humidity sensor, or other sensors or combinations of sensors for sensing attributes of the environment surrounding the device. The environmental sensor may have an enclosure with an opening. The enclosure may be formed from a rigid support structure and a portion of a printed circuit. The opening may be formed in the rigid support structure or the printed circuit. The opening in the enclosure for the environmental sensor may be aligned with an opening in an outer structural member for the device. The outer structural member may be a housing structure or a cover layer for a device display.

Abstract: Detecting force and touch using FTIR and capacitive location. FTIR determines applied force by the user's finger within infrared transmit lines on a touch device. A pattern of such lines determine optical coupling with the touch device. Capacitive sensing can determine (A) where the finger actually touches, so the touch device more accurately infers applied force; (B) whether finger touches shadow each other; (C) as a baseline for applied force; or (D) whether attenuated reflection is due to a current optical coupling, or is due to an earlier optical coupling, such as a smudge on the cover glass. If there is attenuated reflection without actual touching, the touch device can reset a baseline for applied force for the area in which that smudge remains. Infrared transmitters and receivers are positioned where they are not visible to a user, such as below a frame or mask for the cover glass.