Patents by Inventor Roman Bruck
Roman Bruck has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20240094483Abstract: Certain embodiments of the present disclosure are directed towards an optical assembly such as a multiplexers/demultiplexers (MDM). One example optical assembly generally includes: a fiber array configured to provide an optical signal with a plurality of wavelengths; optical wavelength filters configured to separate the plurality of wavelengths into respective optical signals; a lens array configured to receive the respective optical signals from the optical wavelength filters and focus the respective optical signals before reaching an optical interface for a photonic chip; and a birefringent crystal disposed between the lens array and the optical interface.Type: ApplicationFiled: May 10, 2023Publication date: March 21, 2024Inventor: Roman BRUCK
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Publication number: 20240077672Abstract: Embodiments include a photonic device with a compensation structure. The photonic device includes a waveguide with a refractive index which changes according to the thermo-optic effect as a temperature of the photonic device fluctuates. The compensation structure is positioned on the photonic device to counteract or otherwise alter the thermo-optic effect on the refractive index of the waveguide in order to prevent malfunctions of the photonic device.Type: ApplicationFiled: November 10, 2023Publication date: March 7, 2024Inventors: Subal SAHNI, Kamal V. KARIMANAL, Gianlorenzo MASINI, Attila MEKIS, Roman BRUCK
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Patent number: 11906781Abstract: A method includes providing a photonic wafer that includes an electrical layer and a layer disposed on a substrate. The layer includes at least one optical waveguide that is disposed between the electrical layer and the substrate. The method also includes removing a portion of the substrate underneath the at least one optical waveguide and forming an end-face coupler. A portion of the end-face coupler is within the removed portion of the substrate. The end-face coupler transmits an optical signal to, or receives an optical signal from, an external optical device.Type: GrantFiled: December 12, 2022Date of Patent: February 20, 2024Assignee: Cisco Technology, Inc.Inventors: Roman Bruck, Gianlorenzo Masini
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Patent number: 11860412Abstract: Embodiments include a photonic device with a compensation structure. The photonic device includes a waveguide with a refractive index which changes according to the thermo-optic effect as a temperature of the photonic device fluctuates. The compensation structure is positioned on the photonic device to counteract or otherwise alter the thermo-optic effect on the refractive index of the waveguide in order to prevent malfunctions of the photonic device.Type: GrantFiled: October 27, 2020Date of Patent: January 2, 2024Assignee: Cisco Technology, Inc.Inventors: Subal Sahni, Kamal V. Karimanal, Gianlorenzo Masini, Attila Mekis, Roman Bruck
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Patent number: 11822136Abstract: The present disclosure provides for two-dimensional mode matching by receiving an optical signal traveling in a first direction; and scattering the optical signal according lto a scattering strength that progressively changes in the first direction. In various embodiments, the scattering strength progressively changes by increasing or decreasing in the first direction. A plurality of scatterers disposed in a path of the optical signal change in widths that progressively increase or decrease along the first direction. In various embodiments, a second optical signal is received in the grating coupler from a second direction; and is scattered into a surface of a photonic chip via a grating coupler. In some embodiments, the second direction is perpendicular to the first direction.Type: GrantFiled: November 22, 2021Date of Patent: November 21, 2023Assignee: Cisco Technology, Inc.Inventors: Roman Bruck, Attila Mekis
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Publication number: 20230266545Abstract: According to an embodiment, an apparatus includes a first grating and a second grating in a stack with the first grating. The first grating includes a first plurality of scatterers in a first two-dimensional (2D) arrangement. The second grating includes a second plurality of scatterers in a second 2D arrangement. The first grating and the second grating are arranged to redirect a first optical signal and a second optical signal traveling through the stack. The first optical signal enters the stack in a first direction, and the second optical signal enters the stack in a second direction different from the first direction. Each of the second plurality of scatterers is offset from a corresponding scatterer of the first plurality of scatterers in a third direction different from the first and second directions. Other embodiments include a method performed by the apparatus.Type: ApplicationFiled: February 24, 2022Publication date: August 24, 2023Inventors: Roman BRUCK, Attila MEKIS
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Publication number: 20230244031Abstract: End-face coupling structures within an electrical backend are provided via photonic integrated circuit (PIC), comprising: a first plurality of spacer layers; a second plurality of etch-stop layers, wherein each etch-stop layer of the second plurality of etch-stop layers is located between two spacer layers of the first plurality of spacer layers; and an optical coupler comprising a plurality of waveguides arranged as a waveguide array configured to receive an optical signal in a direction of travel, wherein each waveguide of the plurality of waveguides is located at a layer interface defined between an etch-stop layer and a spacer layer. Portions of the PIC can be formed by depositing layers of spacer and etch-stop materials in which cavities are formed to define the waveguides when the waveguide material is deposited or interconnects when a metal is deposited therein.Type: ApplicationFiled: April 7, 2023Publication date: August 3, 2023Inventors: Roman BRUCK, Thierry J. PINGUET, Attila MEKIS
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Publication number: 20230236348Abstract: Embodiments herein describe a focal polarization displacer with a birefringent crystal disposed within the focal region of a lens. The birefringent crystal separates optical signals into at least two separate signals based on having different polarization states and an optical axis of the birefringent crystal is set so that focal points of the two separate signals are at an output surface of the polarization displacer where the two separate signals are output from the polarization displacer. This output surface can be a surface of the birefringent crystal or a surface of additional layer coupled to the crystal such as a polarization rotator or dielectric layer.Type: ApplicationFiled: January 21, 2022Publication date: July 27, 2023Inventor: Roman BRUCK
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Patent number: 11675128Abstract: End-face coupling structures within an electrical backend are provided via photonic integrated circuit (PIC), comprising: a first plurality of spacer layers; a second plurality of etch-stop layers, wherein each etch-stop layer of the second plurality of etch-stop layers is located between two spacer layers of the first plurality of spacer layers; and an optical coupler comprising a plurality of waveguides arranged as a waveguide array configured to receive an optical signal in a direction of travel, wherein each waveguide of the plurality of waveguides is located at a layer interface defined between an etch-stop layer and a spacer layer. Portions of the PIC can be formed by depositing layers of spacer and etch-stop materials in which cavities are formed to define the waveguides when the waveguide material is deposited or interconnects when a metal is deposited therein.Type: GrantFiled: February 18, 2021Date of Patent: June 13, 2023Assignee: Cisco Technology, Inc.Inventors: Roman Bruck, Thierry J. Pinguet, Attila Mekis
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Publication number: 20230112848Abstract: A method includes providing a photonic wafer that includes an electrical layer and a layer disposed on a substrate. The layer includes at least one optical waveguide that is disposed between the electrical layer and the substrate. The method also includes removing a portion of the substrate underneath the at least one optical waveguide and forming an end-face coupler. A portion of the end-face coupler is within the removed portion of the substrate. The end-face coupler transmits an optical signal to, or receives an optical signal from, an external optical device.Type: ApplicationFiled: December 12, 2022Publication date: April 13, 2023Inventors: Roman BRUCK, Gianlorenzo MASINI
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Patent number: 11567262Abstract: A method includes providing a photonic wafer that includes an electrical layer and a layer disposed on a substrate. The layer includes at least one optical waveguide that is disposed between the electrical layer and the substrate. The method also includes removing a portion of the substrate underneath the at least one optical waveguide and forming an end-face coupler. A portion of the end-face coupler is within the removed portion of the substrate. The end-face coupler transmits an optical signal to, or receives an optical signal from, an external optical device.Type: GrantFiled: January 29, 2021Date of Patent: January 31, 2023Assignee: Cisco Technology, Inc.Inventors: Roman Bruck, Gianlorenzo Masini
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Publication number: 20220260775Abstract: End-face coupling structures within an electrical backend are provided via photonic integrated circuit (PIC), comprising: a first plurality of spacer layers; a second plurality of etch-stop layers, wherein each etch-stop layer of the second plurality of etch-stop layers is located between two spacer layers of the first plurality of spacer layers; and an optical coupler comprising a plurality of waveguides arranged as a waveguide array configured to receive an optical signal in a direction of travel, wherein each waveguide of the plurality of waveguides is located at a layer interface defined between an etch-stop layer and a spacer layer. Portions of the PIC can be formed by depositing layers of spacer and etch-stop materials in which cavities are formed to define the waveguides when the waveguide material is deposited or interconnects when a metal is deposited therein.Type: ApplicationFiled: February 18, 2021Publication date: August 18, 2022Inventors: Roman BRUCK, Thierry J. PINGUET, Attila MEKIS
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Publication number: 20220244459Abstract: A method includes providing a photonic wafer that includes an electrical layer and a layer disposed on a substrate. The layer includes at least one optical waveguide that is disposed between the electrical layer and the substrate. The method also includes removing a portion of the substrate underneath the at least one optical waveguide and forming an end-face coupler. A portion of the end-face coupler is within the removed portion of the substrate. The end-face coupler transmits an optical signal to, or receives an optical signal from, an external optical device.Type: ApplicationFiled: January 29, 2021Publication date: August 4, 2022Inventors: Roman BRUCK, Gianlorenzo MASINI
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Publication number: 20220128761Abstract: Embodiments include a photonic device with a compensation structure. The photonic device includes a waveguide with a refractive index which changes according to the thermo-optic effect as a temperature of the photonic device fluctuates. The compensation structure is positioned on the photonic device to counteract or otherwise alter the thermo-optic effect on the refractive index of the waveguide in order to prevent malfunctions of the photonic device.Type: ApplicationFiled: October 27, 2020Publication date: April 28, 2022Inventors: Subal SAHNI, Kamal V. KARIMANAL, Gianlorenzo MASINI, Attila MEKIS, Roman BRUCK
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Patent number: 11294119Abstract: Embodiments include a multimode interference (MMI) device with offset facets. The MMI device includes a first set of facets positioned on opposite edges of the MMI device with an optical path between the set of facets. The MMI device also includes a second set of facets positioned on opposite edges of the MMI device, where the second set of facets are offset from the first set of facets, where a second optical path passes through the MMI device between the second set of facets.Type: GrantFiled: November 19, 2020Date of Patent: April 5, 2022Assignee: Cisco Technology, Inc.Inventors: Roman Bruck, Attila Mekis
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Publication number: 20220082767Abstract: The present disclosure provides for two-dimensional mode matching by receiving an optical signal traveling in a first direction; and scattering the optical signal according lto a scattering strength that progressively changes in the first direction. In various embodiments, the scattering strength progressively changes by increasing or decreasing in the first direction. A plurality of scatterers disposed in a path of the optical signal change in widths that progressively increase or decrease along the first direction. In various embodiments, a second optical signal is received in the grating coupler from a second direction; and is scattered into a surface of a photonic chip via a grating coupler. In some embodiments, the second direction is perpendicular to the first direction.Type: ApplicationFiled: November 22, 2021Publication date: March 17, 2022Inventors: Roman Bruck, Attila Mekis
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Patent number: 11215770Abstract: The present disclosure provides for two-dimensional mode matching by receiving an optical signal traveling in a first direction; and scattering the optical signal according to a scattering strength that progressively changes in the first direction. In various embodiments, the scattering strength progressively changes by increasing or decreasing in the first direction. A plurality of scatterers disposed in a path of the optical signal change in widths that progressively increase or decrease along the first direction. In various embodiments, a second optical signal is received in the grating coupler from a second direction; and is scattered into a surface of a photonic chip via a grating coupler. In some embodiments, the second direction is perpendicular to the first direction.Type: GrantFiled: July 13, 2020Date of Patent: January 4, 2022Assignee: Luxtera LLCInventors: Roman Bruck, Attila Mekis
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Patent number: 11073737Abstract: Methods and systems for an all-optical wafer acceptance test may include an optical transceiver on a chip, the optical transceiver comprising first, second, and third grating couplers, an interferometer comprising first and second phase modulators, a splitter, and a plurality of photodiodes. A first input optical signal may be received in the chip via the first grating coupler, where the first input optical signal may be coupled to the interferometer. An output optical signal may be coupled out of the chip via the second grating coupler for a first measurement of the interferometer. A second input optical signal may be coupled to a third grating coupler and a portion of the second input optical signal may be communicated to each of the plurality of photodiodes via the splitter. A voltage may be generated using the photodiodes based on the second input signal that may bias the first phase modulator.Type: GrantFiled: December 30, 2019Date of Patent: July 27, 2021Assignee: Luxtera LLCInventors: Gianlorenzo Masini, Roman Bruck, Kam-Yan Hon, Attila Mekis
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Patent number: 11016245Abstract: Methods and systems for mode converters for grating couplers may include a photonic chip comprising a waveguide, a grating coupler, and a mode converter, with the waveguide being coupled to the grating coupler via the mode converter. The mode converter may include waveguide material and tapers defined by triangular regions, where the triangular regions do not have waveguide material. The photonic chip may receive an optical signal in the mode converter from the waveguide, where the received optical signal has a light profile that may be spatially deflected in the mode converter to configure a desired profile in the grating coupler. A long axis of the tapers may be parallel to a direction of travel of the optical signal. The long axis of the tapers may point towards the input waveguide of the grating couplers, which may be linear.Type: GrantFiled: February 13, 2020Date of Patent: May 25, 2021Assignee: Luxtera LLCInventors: Roman Bruck, Attila Mekis
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Publication number: 20200341216Abstract: The present disclosure provides for two-dimensional mode matching by receiving an optical signal traveling in a first direction; and scattering the optical signal according to a scattering strength that progressively changes in the first direction. In various embodiments, the scattering strength progressively changes by increasing or decreasing in the first direction. A plurality of scatterers disposed in a path of the optical signal change in widths that progressively increase or decrease along the first direction. In various embodiments, a second optical signal is received in the grating coupler from a second direction; and is scattered into a surface of a photonic chip via a grating coupler. In some embodiments, the second direction is perpendicular to the first direction.Type: ApplicationFiled: July 13, 2020Publication date: October 29, 2020Inventors: Roman Bruck, Attila Mekis