Patents by Inventor Roman Bruck

Roman Bruck has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240094483
    Abstract: Certain embodiments of the present disclosure are directed towards an optical assembly such as a multiplexers/demultiplexers (MDM). One example optical assembly generally includes: a fiber array configured to provide an optical signal with a plurality of wavelengths; optical wavelength filters configured to separate the plurality of wavelengths into respective optical signals; a lens array configured to receive the respective optical signals from the optical wavelength filters and focus the respective optical signals before reaching an optical interface for a photonic chip; and a birefringent crystal disposed between the lens array and the optical interface.
    Type: Application
    Filed: May 10, 2023
    Publication date: March 21, 2024
    Inventor: Roman BRUCK
  • Publication number: 20240077672
    Abstract: Embodiments include a photonic device with a compensation structure. The photonic device includes a waveguide with a refractive index which changes according to the thermo-optic effect as a temperature of the photonic device fluctuates. The compensation structure is positioned on the photonic device to counteract or otherwise alter the thermo-optic effect on the refractive index of the waveguide in order to prevent malfunctions of the photonic device.
    Type: Application
    Filed: November 10, 2023
    Publication date: March 7, 2024
    Inventors: Subal SAHNI, Kamal V. KARIMANAL, Gianlorenzo MASINI, Attila MEKIS, Roman BRUCK
  • Patent number: 11906781
    Abstract: A method includes providing a photonic wafer that includes an electrical layer and a layer disposed on a substrate. The layer includes at least one optical waveguide that is disposed between the electrical layer and the substrate. The method also includes removing a portion of the substrate underneath the at least one optical waveguide and forming an end-face coupler. A portion of the end-face coupler is within the removed portion of the substrate. The end-face coupler transmits an optical signal to, or receives an optical signal from, an external optical device.
    Type: Grant
    Filed: December 12, 2022
    Date of Patent: February 20, 2024
    Assignee: Cisco Technology, Inc.
    Inventors: Roman Bruck, Gianlorenzo Masini
  • Patent number: 11860412
    Abstract: Embodiments include a photonic device with a compensation structure. The photonic device includes a waveguide with a refractive index which changes according to the thermo-optic effect as a temperature of the photonic device fluctuates. The compensation structure is positioned on the photonic device to counteract or otherwise alter the thermo-optic effect on the refractive index of the waveguide in order to prevent malfunctions of the photonic device.
    Type: Grant
    Filed: October 27, 2020
    Date of Patent: January 2, 2024
    Assignee: Cisco Technology, Inc.
    Inventors: Subal Sahni, Kamal V. Karimanal, Gianlorenzo Masini, Attila Mekis, Roman Bruck
  • Patent number: 11822136
    Abstract: The present disclosure provides for two-dimensional mode matching by receiving an optical signal traveling in a first direction; and scattering the optical signal according lto a scattering strength that progressively changes in the first direction. In various embodiments, the scattering strength progressively changes by increasing or decreasing in the first direction. A plurality of scatterers disposed in a path of the optical signal change in widths that progressively increase or decrease along the first direction. In various embodiments, a second optical signal is received in the grating coupler from a second direction; and is scattered into a surface of a photonic chip via a grating coupler. In some embodiments, the second direction is perpendicular to the first direction.
    Type: Grant
    Filed: November 22, 2021
    Date of Patent: November 21, 2023
    Assignee: Cisco Technology, Inc.
    Inventors: Roman Bruck, Attila Mekis
  • Publication number: 20230266545
    Abstract: According to an embodiment, an apparatus includes a first grating and a second grating in a stack with the first grating. The first grating includes a first plurality of scatterers in a first two-dimensional (2D) arrangement. The second grating includes a second plurality of scatterers in a second 2D arrangement. The first grating and the second grating are arranged to redirect a first optical signal and a second optical signal traveling through the stack. The first optical signal enters the stack in a first direction, and the second optical signal enters the stack in a second direction different from the first direction. Each of the second plurality of scatterers is offset from a corresponding scatterer of the first plurality of scatterers in a third direction different from the first and second directions. Other embodiments include a method performed by the apparatus.
    Type: Application
    Filed: February 24, 2022
    Publication date: August 24, 2023
    Inventors: Roman BRUCK, Attila MEKIS
  • Publication number: 20230244031
    Abstract: End-face coupling structures within an electrical backend are provided via photonic integrated circuit (PIC), comprising: a first plurality of spacer layers; a second plurality of etch-stop layers, wherein each etch-stop layer of the second plurality of etch-stop layers is located between two spacer layers of the first plurality of spacer layers; and an optical coupler comprising a plurality of waveguides arranged as a waveguide array configured to receive an optical signal in a direction of travel, wherein each waveguide of the plurality of waveguides is located at a layer interface defined between an etch-stop layer and a spacer layer. Portions of the PIC can be formed by depositing layers of spacer and etch-stop materials in which cavities are formed to define the waveguides when the waveguide material is deposited or interconnects when a metal is deposited therein.
    Type: Application
    Filed: April 7, 2023
    Publication date: August 3, 2023
    Inventors: Roman BRUCK, Thierry J. PINGUET, Attila MEKIS
  • Publication number: 20230236348
    Abstract: Embodiments herein describe a focal polarization displacer with a birefringent crystal disposed within the focal region of a lens. The birefringent crystal separates optical signals into at least two separate signals based on having different polarization states and an optical axis of the birefringent crystal is set so that focal points of the two separate signals are at an output surface of the polarization displacer where the two separate signals are output from the polarization displacer. This output surface can be a surface of the birefringent crystal or a surface of additional layer coupled to the crystal such as a polarization rotator or dielectric layer.
    Type: Application
    Filed: January 21, 2022
    Publication date: July 27, 2023
    Inventor: Roman BRUCK
  • Patent number: 11675128
    Abstract: End-face coupling structures within an electrical backend are provided via photonic integrated circuit (PIC), comprising: a first plurality of spacer layers; a second plurality of etch-stop layers, wherein each etch-stop layer of the second plurality of etch-stop layers is located between two spacer layers of the first plurality of spacer layers; and an optical coupler comprising a plurality of waveguides arranged as a waveguide array configured to receive an optical signal in a direction of travel, wherein each waveguide of the plurality of waveguides is located at a layer interface defined between an etch-stop layer and a spacer layer. Portions of the PIC can be formed by depositing layers of spacer and etch-stop materials in which cavities are formed to define the waveguides when the waveguide material is deposited or interconnects when a metal is deposited therein.
    Type: Grant
    Filed: February 18, 2021
    Date of Patent: June 13, 2023
    Assignee: Cisco Technology, Inc.
    Inventors: Roman Bruck, Thierry J. Pinguet, Attila Mekis
  • Publication number: 20230112848
    Abstract: A method includes providing a photonic wafer that includes an electrical layer and a layer disposed on a substrate. The layer includes at least one optical waveguide that is disposed between the electrical layer and the substrate. The method also includes removing a portion of the substrate underneath the at least one optical waveguide and forming an end-face coupler. A portion of the end-face coupler is within the removed portion of the substrate. The end-face coupler transmits an optical signal to, or receives an optical signal from, an external optical device.
    Type: Application
    Filed: December 12, 2022
    Publication date: April 13, 2023
    Inventors: Roman BRUCK, Gianlorenzo MASINI
  • Patent number: 11567262
    Abstract: A method includes providing a photonic wafer that includes an electrical layer and a layer disposed on a substrate. The layer includes at least one optical waveguide that is disposed between the electrical layer and the substrate. The method also includes removing a portion of the substrate underneath the at least one optical waveguide and forming an end-face coupler. A portion of the end-face coupler is within the removed portion of the substrate. The end-face coupler transmits an optical signal to, or receives an optical signal from, an external optical device.
    Type: Grant
    Filed: January 29, 2021
    Date of Patent: January 31, 2023
    Assignee: Cisco Technology, Inc.
    Inventors: Roman Bruck, Gianlorenzo Masini
  • Publication number: 20220260775
    Abstract: End-face coupling structures within an electrical backend are provided via photonic integrated circuit (PIC), comprising: a first plurality of spacer layers; a second plurality of etch-stop layers, wherein each etch-stop layer of the second plurality of etch-stop layers is located between two spacer layers of the first plurality of spacer layers; and an optical coupler comprising a plurality of waveguides arranged as a waveguide array configured to receive an optical signal in a direction of travel, wherein each waveguide of the plurality of waveguides is located at a layer interface defined between an etch-stop layer and a spacer layer. Portions of the PIC can be formed by depositing layers of spacer and etch-stop materials in which cavities are formed to define the waveguides when the waveguide material is deposited or interconnects when a metal is deposited therein.
    Type: Application
    Filed: February 18, 2021
    Publication date: August 18, 2022
    Inventors: Roman BRUCK, Thierry J. PINGUET, Attila MEKIS
  • Publication number: 20220244459
    Abstract: A method includes providing a photonic wafer that includes an electrical layer and a layer disposed on a substrate. The layer includes at least one optical waveguide that is disposed between the electrical layer and the substrate. The method also includes removing a portion of the substrate underneath the at least one optical waveguide and forming an end-face coupler. A portion of the end-face coupler is within the removed portion of the substrate. The end-face coupler transmits an optical signal to, or receives an optical signal from, an external optical device.
    Type: Application
    Filed: January 29, 2021
    Publication date: August 4, 2022
    Inventors: Roman BRUCK, Gianlorenzo MASINI
  • Publication number: 20220128761
    Abstract: Embodiments include a photonic device with a compensation structure. The photonic device includes a waveguide with a refractive index which changes according to the thermo-optic effect as a temperature of the photonic device fluctuates. The compensation structure is positioned on the photonic device to counteract or otherwise alter the thermo-optic effect on the refractive index of the waveguide in order to prevent malfunctions of the photonic device.
    Type: Application
    Filed: October 27, 2020
    Publication date: April 28, 2022
    Inventors: Subal SAHNI, Kamal V. KARIMANAL, Gianlorenzo MASINI, Attila MEKIS, Roman BRUCK
  • Patent number: 11294119
    Abstract: Embodiments include a multimode interference (MMI) device with offset facets. The MMI device includes a first set of facets positioned on opposite edges of the MMI device with an optical path between the set of facets. The MMI device also includes a second set of facets positioned on opposite edges of the MMI device, where the second set of facets are offset from the first set of facets, where a second optical path passes through the MMI device between the second set of facets.
    Type: Grant
    Filed: November 19, 2020
    Date of Patent: April 5, 2022
    Assignee: Cisco Technology, Inc.
    Inventors: Roman Bruck, Attila Mekis
  • Publication number: 20220082767
    Abstract: The present disclosure provides for two-dimensional mode matching by receiving an optical signal traveling in a first direction; and scattering the optical signal according lto a scattering strength that progressively changes in the first direction. In various embodiments, the scattering strength progressively changes by increasing or decreasing in the first direction. A plurality of scatterers disposed in a path of the optical signal change in widths that progressively increase or decrease along the first direction. In various embodiments, a second optical signal is received in the grating coupler from a second direction; and is scattered into a surface of a photonic chip via a grating coupler. In some embodiments, the second direction is perpendicular to the first direction.
    Type: Application
    Filed: November 22, 2021
    Publication date: March 17, 2022
    Inventors: Roman Bruck, Attila Mekis
  • Patent number: 11215770
    Abstract: The present disclosure provides for two-dimensional mode matching by receiving an optical signal traveling in a first direction; and scattering the optical signal according to a scattering strength that progressively changes in the first direction. In various embodiments, the scattering strength progressively changes by increasing or decreasing in the first direction. A plurality of scatterers disposed in a path of the optical signal change in widths that progressively increase or decrease along the first direction. In various embodiments, a second optical signal is received in the grating coupler from a second direction; and is scattered into a surface of a photonic chip via a grating coupler. In some embodiments, the second direction is perpendicular to the first direction.
    Type: Grant
    Filed: July 13, 2020
    Date of Patent: January 4, 2022
    Assignee: Luxtera LLC
    Inventors: Roman Bruck, Attila Mekis
  • Patent number: 11073737
    Abstract: Methods and systems for an all-optical wafer acceptance test may include an optical transceiver on a chip, the optical transceiver comprising first, second, and third grating couplers, an interferometer comprising first and second phase modulators, a splitter, and a plurality of photodiodes. A first input optical signal may be received in the chip via the first grating coupler, where the first input optical signal may be coupled to the interferometer. An output optical signal may be coupled out of the chip via the second grating coupler for a first measurement of the interferometer. A second input optical signal may be coupled to a third grating coupler and a portion of the second input optical signal may be communicated to each of the plurality of photodiodes via the splitter. A voltage may be generated using the photodiodes based on the second input signal that may bias the first phase modulator.
    Type: Grant
    Filed: December 30, 2019
    Date of Patent: July 27, 2021
    Assignee: Luxtera LLC
    Inventors: Gianlorenzo Masini, Roman Bruck, Kam-Yan Hon, Attila Mekis
  • Patent number: 11016245
    Abstract: Methods and systems for mode converters for grating couplers may include a photonic chip comprising a waveguide, a grating coupler, and a mode converter, with the waveguide being coupled to the grating coupler via the mode converter. The mode converter may include waveguide material and tapers defined by triangular regions, where the triangular regions do not have waveguide material. The photonic chip may receive an optical signal in the mode converter from the waveguide, where the received optical signal has a light profile that may be spatially deflected in the mode converter to configure a desired profile in the grating coupler. A long axis of the tapers may be parallel to a direction of travel of the optical signal. The long axis of the tapers may point towards the input waveguide of the grating couplers, which may be linear.
    Type: Grant
    Filed: February 13, 2020
    Date of Patent: May 25, 2021
    Assignee: Luxtera LLC
    Inventors: Roman Bruck, Attila Mekis
  • Publication number: 20200341216
    Abstract: The present disclosure provides for two-dimensional mode matching by receiving an optical signal traveling in a first direction; and scattering the optical signal according to a scattering strength that progressively changes in the first direction. In various embodiments, the scattering strength progressively changes by increasing or decreasing in the first direction. A plurality of scatterers disposed in a path of the optical signal change in widths that progressively increase or decrease along the first direction. In various embodiments, a second optical signal is received in the grating coupler from a second direction; and is scattered into a surface of a photonic chip via a grating coupler. In some embodiments, the second direction is perpendicular to the first direction.
    Type: Application
    Filed: July 13, 2020
    Publication date: October 29, 2020
    Inventors: Roman Bruck, Attila Mekis