Patents by Inventor Roman Buch

Roman Buch has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11927885
    Abstract: An imprint lithography stamp includes a stamp body having a patterned surface and formed from a fluorinated ethylene propylene copolymer. The imprint lithography stamp further includes a backing plate with a plurality of through-holes with portions of the stamp body extending into the through-holes to adhere the stamp body to the backing plate. The patterned surface of the stamp body has a plurality of protrusions extending from the stamp body, which are used to form high aspect ratio features at high processing temperatures. A mold design for forming the imprint lithography stamp and an injection molding process for forming the imprint lithography stamp are also provided.
    Type: Grant
    Filed: August 8, 2022
    Date of Patent: March 12, 2024
    Assignee: Applied Materials, Inc.
    Inventors: Roman Gouk, Jean Delmas, Steven Verhaverbeke, Chintan Buch
  • Patent number: 5622477
    Abstract: An improved switch for bilge and sump pumps which allows a manual override switch to be connected in the positive side of the power supply and which uses a reed switch actuated Darlington type circuit both of which are protected from reversed polarity connection by a current limiting resistor which is buffered with the protective resistor.
    Type: Grant
    Filed: August 15, 1995
    Date of Patent: April 22, 1997
    Assignee: Johnson Pumps Of America, Inc.
    Inventors: Stephen R. Orth, Burton L. Siegal, Roman Buch
  • Patent number: D286271
    Type: Grant
    Filed: February 21, 1984
    Date of Patent: October 21, 1986
    Inventor: Roman Buch