Patents by Inventor Ronald P. Boisvert

Ronald P. Boisvert has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Hydrosilsesquioxane resin compositions having improved thin film properties
    Patent number: 6737117
    Abstract: Herein is disclosed a resin solution, comprising (a) about 0.1 solids wt % to about 50 solids wt % of an organosiloxane resin comprising the formula (RSiO3/2)x(R′SiO3/2)y, wherein R is selected from the group consisting of C4-C24 alkyl, C4-C24 alkenyl, C4-C24 alkoxy, C8-C24 alkenoxy, and C4-C24 substituted hydrocarbon; R′ is selected from the group consisting of —H, C1-C4 unsubstituted hydrocarbon, and C1-C4 substituted hydrocarbon; x is from about 5 mole % to about 75 mole %; y is from about 10 mole % to about 95 mole %; and x+y is at least about 40 mole %; and (b) about 50 solids wt % to about 99.9 solids wt % of a resin comprising at least about 90 mole % of the formula HSiO3/2.
    Type: Grant
    Filed: April 5, 2002
    Date of Patent: May 18, 2004
    Assignee: Dow Corning Corporation
    Inventors: Ronald P. Boisvert, Duane R. Bujalski, Brian R. Harkness, Zhongtao Li, Kai Su, Bianxiao Zhong
  • Hydrosilsesquioxane resin compositions having improved thin film properties
    Publication number: 20030191267
    Abstract: Herein is disclosed a resin solution, comprising (a) about 0.1 solids wt % to about 50 solids wt % of an organosiloxane resin comprising the formula (RSiO3/2)x(R′SiO3/2)y, wherein R is selected from the group consisting of C4-C24 alkyl, C4-C24 alkenyl, C4-C24 alkoxy, C8-C24 alkenoxy, and C4-C24 substituted hydrocarbon; R′ is selected from the group consisting of —H, C1-C4 unsubstituted hydrocarbon, and C1-C4 substituted hydrocarbon; x is from about 5 mole % to about 75 mole %; y is from about 10 mole % to about 95 mole %; and x+y is at least about 40 mole %; and (b) about 50 solids wt % to about 99.9 solids wt % of a resin comprising at least about 90 mole % of the formula HSiO3/2.
    Type: Application
    Filed: April 5, 2002
    Publication date: October 9, 2003
    Inventors: Ronald P. Boisvert, Duane R. Bujalski, Brian R. Harkness, Zhongtao Li, Kai Su, Bianxiao Zhong