Abstract: A repulsive-force electrostatic actuator includes a first actuator layer including a first substrate, a first electrode pattern, and a second electrode pattern. The actuator includes a second actuator layer spaced apart from the first actuator layer that includes a second substrate, a third electrode pattern, and a fourth electrode pattern. The actuator includes a voltage source connected to the first, second, third, and fourth electrode patterns such that the first electrode pattern is at an opposite voltage relative to the second, the third electrode pattern is at an opposite voltage relative to the fourth, and the first and second actuator layers are arranged to have a repulsive electrostatic force therebetween. The actuator further includes an actuator frame connected to the first and second actuator layers such that at least a portion of at least one of the first and second actuator layers is movable due to an applied voltage to effect motion to an object.

Abstract: A repulsive-attractive-force electrostatic actuator according to some embodiments of the invention includes a first actuator layer including a first substrate, a first electrode pattern, and a second electrode pattern. The actuator further includes a second actuator layer including a second substrate, a third electrode pattern, and a fourth electrode pattern. The actuator further includes a first voltage source connected to the first and second electrode patterns such that the first electrode pattern is at a relative voltage of V1 to the second electrode pattern, and a second voltage source connected to the third and fourth electrode patterns such that the third electrode pattern is at a relative voltage of V2 to the fourth electrode pattern. The applied relative voltages V1 and V2 are selectable to provide one of a selected repulsive force or a selected attractive force between the first and second actuator layers.

Abstract: A repulsive-attractive-force electrostatic actuator according to some embodiments of the invention includes a first actuator layer including a first substrate, a first electrode pattern, and a second electrode pattern. The actuator further includes a second actuator layer including a second substrate, a third electrode pattern, and a fourth electrode pattern. The actuator further includes a first voltage source connected to the first and second electrode patterns such that the first electrode pattern is at a relative voltage of V1 to the second electrode pattern, and a second voltage source connected to the third and fourth electrode patterns such that the third electrode pattern is at a relative voltage of V2 to the fourth electrode pattern. The applied relative voltages V1 and V2 are selectable to provide one of a selected repulsive force or a selected attractive force between the first and second actuator layers.

Abstract: A repulsive-force electrostatic actuator includes a first actuator layer including a first substrate, a first electrode pattern, and a second electrode pattern. The actuator includes a second actuator layer spaced apart from the first actuator layer that includes a second substrate, a third electrode pattern, and a fourth electrode pattern. The actuator includes a voltage source connected to the first, second, third, and fourth electrode patterns such that the first electrode pattern is at an opposite voltage relative to the second, the third electrode pattern is at an opposite voltage relative to the fourth, and the first and second actuator layers are arranged to have a repulsive electrostatic force therebetween. The actuator further includes an actuator frame connected to the first and second actuator layers such that at least a portion of at least one of the first and second actuator layers is movable due to an applied voltage to effect motion to an object.

Abstract: An adhesive material that contains a plurality of setae that include a stalk and spatula extending therefrom is provided. To form the adhesive material, a substantially planar substrate may be initially molded to define the setae. In this initial configuration, the setae are positioned substantially in the plane of the substrate. The substrate is then physically manipulated (e.g., folded, bent, corrugated, rotated, etc.) so that the setae become extended in an outwardly direction from the plane. Among other things, this provides a three-dimensional material having enhanced adhesive properties.

Abstract: An integrated circuit chip has one or more electrically conductive nano-fibers formed on one or more contact pads of the integrated circuit chip. The one or more electrically conductive nano-fibers are configured to provide an adhesive force by intermolecular forces and establish an electrical connection with one or more contact pads disposed on the surface of a chip package.

Abstract: A fabricated nano-structure includes a substrate, a supporting stalk, a node, and at least two spatular plate portions. The supporting stalk has a first end opposite a second end. The first end of the supporting stalk is connected to the substrate. The supporting stalk has a diameter range of about 50 nanometers to about 2 microns. A node is disposed at the second end of the supporting stalk. At least two spatular plate portions are connected to the node. The at least two spatular plate portions have planar geometries and are radially distributed about the node. The at least two spatular plate portions has a ratio of a maximum plate thickness to a maximum plate length of at most about 1:20. The maximum plate length is measured along a line from a boundary of the spatular plate portion to a centroid of the node. The maximum plate length is at least about 100 nanometers.

Abstract: An adhesive material that contains a plurality of setae that include a stalk and spatula extending therefrom is provided. To form the adhesive material, a substantially planar substrate may be initially molded to define the setae. In this initial configuration, the setae are positioned substantially in the plane of the substrate. The substrate is then physically manipulated (e.g., folded, bent, corrugated, rotated, etc.) so that the setae become extended in an outwardly direction from the plane. Among other things, this provides a three-dimensional material having enhanced adhesive properties.

Abstract: Described herein is a microstructure having a substrate and a plurality of nano-fibers attached to the substrate. Each nano-fiber moves between the first and second states without an external mechanical load being applied to the nano-fibers. Each nano-fiber is configured to move between a first state and a second state in response to applied electricity, magnetism, chemical solution, heat, or light. Each nano-fiber is straight in the first state and curved in the second state, and when the nano-fibers are in the second state and in contact with a contact surface, the nano-fibers adhere to the contact surface.

Abstract: A method of forming an adhesive force includes removing a seta from a living specimen, attaching the seta to a substrate, and applying the seta to a surface so as to establish an adhesive force between the substrate and the surface. The seta is applied to the surface with a force perpendicular to the surface. The seta is then pulled with a force parallel to the surface so as to preload the adhesive force of the seta.

Abstract: Described herein are fabricated microstructures to adhere in shear to a contact surface. A fabricated microstructure comprises a substrate and a plurality of nano-fibers attached to the substrate. The nano-fibers have an elasticity modulus E, an interfacial energy per unit length of contact w, a length L, a radius R, and are oriented at an angle ?o relative to the substrate. The length L of the nano-fibers is greater than 0.627?oR2(E/w)1/2 with ?o in radians. Also described herein is a method of forming a fabricated microstructure to adhere in shear to a contact surface and a method of adhering in shear a fabricated microstructure to a contact surface.

Abstract: A fabricated microstructure includes a substrate, a primary fiber, and a plurality of base fibers. The primary fiber has a width less than about 5 microns. Each base fiber of the plurality of base fibers has a first end attached to the primary fiber and a second end attached to the substrate. Each base fiber has a width less than the width of the primary fiber.

Abstract: A fabricated microstructure comprising at least one protrusion capable of providing an adhesive force at a surface of between about 60 and 2,000 nano-Newtons. A stalk supports the protrusion at an oblique angle relative to a supporting surface. The microstructure can adhere to different surfaces.

Abstract: A fabricated microstructure includes a substrate, a primary fiber, and a plurality of base fibers. The primary fiber has a width less than about 5 microns. Each base fiber of the plurality of base fibers has a first end attached to the primary fiber and a second end attached to the substrate. Each base fiber has a width less than the width of the primary fiber.

Abstract: An integrated circuit chip has one or more electrically conductive nano-fibers formed on one or more contact pads of the integrated circuit chip. The one or more electrically conductive nano-fibers are configured to provide an adhesive force by intermolecular forces and establish an electrical connection with one or more contact pads disposed on the surface of a chip package.

Abstract: An integrated circuit chip has one or more electrically conductive nano-fibers formed on one or more contact pads of the integrated circuit chip. The one or more electrically conductive nano-fibers are configured to provide an adhesive force by intermolecular forces and establish an electrical connection with one or more contact pads disposed on the surface of a chip package.

Abstract: An integrated circuit chip has one or more electrically conductive nano-fibers formed on one or more contact pads of the integrated circuit chip. The one or more electrically conductive nano-fibers are configured to provide an adhesive force by intermolecular forces and establish an electrical connection with one or more contact pads disposed on the surface of a chip package.

Abstract: A high performance piezoelectric actuator. The actuator includes a piezoelectric material exhibiting a selectively tapered width sufficient to enhance actuator fracture load capabilities. A passive material is disposed on or integrated with the piezoelectric material. A drive system is connected to the piezoelectric material. The drive system is capable of selectively applying an electric field to the piezoelectric material. In specific embodiment, the piezoelectric material includes a curved piezoelectric layer exhibits a default state of compression along a surface of the piezoelectric layer.

Abstract: A method of forming an adhesive force includes removing a seta from a living specimen, attaching the seta to a substrate, and applying the seta to a surface so as to establish an adhesive force between the substrate and the surface. The seta is applied to the surface with a force perpendicular to the surface. The seta is then pulled with a force parallel to the surface so as to preload the adhesive force of the seta.

Abstract: A curved surfaces for adhering to contact surfaces is provided. The structure includes a curved surface with a plurality of nano-fibers disposed thereon. When the curved surface is in a first position, at least one of the plurality of nano-fibers contacts the contact surface and provides an adhesive force at the contact surface. When the curved surface rotates to a second position from the first position, the at least one of the plurality of nano-fibers is leveraged way from the contact surface.