Abstract: A high-power light-emitting diode (LED) driving circuit relates to a photoelectric technology field. An anode of D1 is connected to a constant current direct current (DC) power supply, and a cathode of D1 is connected to LED1, LED4, and one end of R1 and R2. LED1, ED2, and LED3 are connected in serial and then are connected to a collector of Q1, and LED4, LED5, and LED6 are connected in serial and then are connected to a collector of Q2. Emitters of the Q1 and Q2 are grounded. DZ1 is connected to LED1, LED2, and LED3 in parallel, and DZ2 is connected to LED4, LED5, and LED6 in parallel. The other end of R1 is respectively connected to a base of Q1 and one end of C2, and the other end of C2 is connected to the collector of Q2. The other end of R2 is respectively connected to a base of Q2 and one end of C1, and the other end of C1 is connected to the collector of Q1.

Abstract: A full angle LED (light-emitting diode) illumination device comprises at least three copper base plates, a plurality of LED chips, and a flexible circuit layer. Each copper base plate is electroplated with a layer of silver thereon and the copper base plates are arranged in a crisscross pattern to form the backbone of a three-dimensional globe. Each LED chip is provided on the external surface of the three-dimensional globe at a site where any two copper base plates are crisscrossed. The flexible circuit layer is provided on the peripheries of the copper base plates and electrically connected with the LED chips for controlling the LED chips. Accordingly, it is able to provide full angle illumination range and to improve the thermal conductivity and heat dissipation capability in order to prolong effectively the lifetime of the LED chips in use.

Abstract: In the field of opto-electronic technology, a three-dimensional (3D) light-emitting diode (LED) light-emitting plate is described. The 3D LED light-emitting plate includes an aluminum substrate. The aluminum substrate is vertically disposed. Notches are formed on an upper side of the aluminum substrate in a thickness direction. LED chips are mounted in the notches. A flexible circuit layer is disposed on a surface of the aluminum substrate. Each LED chip is connected to a circuit of the flexible circuit layer by a gold wire. A fluorescent colloid light-emitting shell is disposed outside each LED chip correspondingly. A cavity is formed between the LED chip and the fluorescent colloid light-emitting shell. A lower portion of the fluorescent colloid light-emitting shell is fixed on the aluminum substrate.

Abstract: A full angle LED (light-emitting diode) illumination device comprises at least three copper base plates, a plurality of LED chips, and a flexible circuit layer. Each copper base plate is electroplated with a layer of silver thereon and the copper base plates are arranged in a crisscross pattern to form the backbone of a three-dimensional globe. Each LED chip is provided on the external surface of the three-dimensional globe at a site where any two copper base plates are crisscrossed. The flexible circuit layer is provided on the peripheries of the copper base plates and electrically connected with the LED chips for controlling the LED chips. Accordingly, it is able to provide full angle illumination range and to improve the thermal conductivity and heat dissipation capability in order to prolong effectively the lifetime of the LED chips in use.

Abstract: A 360-degree angle LED (light-emitting diode) illumination device comprises a copper base plate, a plurality of LED chips, and a flexible PCB circuit layer. The copper base plate is electroplated with a layer of silver thereon. The plurality of LED chips is provided on the peripheries of the copper base plate. The flexible PCB circuit layer is provided on the peripheries of the copper base plate and electrically connected with the LED chips for controlling the LED chips. Accordingly, it is able to provide 360-degree angle illumination range and to improve the thermal conductivity and heat dissipation capability in order to prolong effectively the lifetime of the LED chips in use.

Abstract: A three-layered cold/hot controller comprises a semiconductor plate, a first metal plate, and a second metal plate. The semiconductor plate has a top and a bottom contact surface and connected with a power source. When the semiconductor plate is electrified, the top contact surface of the semiconductor plate forms a contact surface for decreasing temperature while the bottom contact surface of the semiconductor plate forms a contact surface for elevating temperature. The first metal plate is combined to the top contact surface of the semiconductor plate for conducting the heat between the first metal plate and the top contact surface. The second metal plate is combined to the bottom contact surface of the semiconductor plate for conducting the heat between the second metal plate and the bottom contact surface.

Abstract: In the field of opto-electronic technology, a three-dimensional (3D) light-emitting diode (LED) light-emitting plate is described. The 3D LED light-emitting plate includes an aluminum substrate. The aluminum substrate is vertically disposed. Notches are formed on an upper side of the aluminum substrate in a thickness direction. LED chips are mounted in the notches. A flexible circuit layer is disposed on a surface of the aluminum substrate. Each LED chip is connected to a circuit of the flexible circuit layer by a gold wire. A fluorescent colloid light-emitting shell is disposed outside each LED chip correspondingly. A cavity is formed between the LED chip and the fluorescent colloid light-emitting shell. A lower portion of the fluorescent colloid light-emitting shell is fixed on the aluminum substrate.

Abstract: A high-power light-emitting diode (LED) driving circuit relates to a photoelectric technology field. An anode of D1 is connected to a constant current direct current (DC) power supply, and a cathode of D1 is connected to LED1, LED4, and one end of R1 and R2. LED1, ED2, and LED3 are connected in serial and then are connected to a collector of Q1, and LED4, LED5, and LED6 are connected in serial and then are connected to a collector of Q2. Emitters of the Q1 and Q2 are grounded. DZ1 is connected to LED1, LED2, and LED3 in parallel, and DZ2 is connected to LED4, LED5, and LED6 in parallel. The other end of R1 is respectively connected to a base of Q1 and one end of C2, and the other end of C2 is connected to the collector of Q2. The other end of R2 is respectively connected to a base of Q2 and one end of C1, and the other end of C1 is connected to the collector of Q1.