Abstract: In a first aspect, a multilayer film includes a first outer layer including a first thermoplastic polyimide, a core layer including a polyimide, and a second outer layer including a second thermoplastic polyimide. The polyimide of the core layer includes a first aromatic dianhydride including 3,3?,4,4?-biphenyl tetracarboxylic dianhydride and a first aromatic diamine including p-phenylenediamine. The multilayer film has a total thickness in a range of from 5 to 150 ?m. A thickness of the core layer is in a range of from 35 to 73% of the total thickness of the multilayer film. A minimum peel strength for at least one of the first and second outer layers, when adhered to copper foil and tested following ASTM method IPC-TM-650, method No. 2.4.9B, is greater than 0.9 kgf/cm (0.88 N/mm). In a second aspect, a metal-clad laminate includes the multilayer film of the first aspect and a first metal layer adhered to an outer surface of the first outer layer of the multilayer film.

Abstract: A thermal substrate includes a multilayer film, a first conductive layer adhered to the first outer layer of the multilayer film and a second conductive layer adhered to the second outer layer of the multilayer film. The multilayer film includes a first outer layer including a first thermoplastic polyimide, a core layer including a polyimide and a second outer layer including a second thermoplastic polyimide. The multilayer film has a total thickness in a range of from 5 to 150 ?m, and the first outer layer, the core layer and the second outer layer each include a thermally conductive filler. The first conductive layer and the second conductive layer each have a thickness in a range of from 250 to 3000 ?m.

Abstract: In a first aspect, a multilayer film includes a first outer layer including a first thermoplastic polyimide, a core layer including a polyimide, and a second outer layer including a second thermoplastic polyimide. The polyimide of the core layer includes a first aromatic dianhydride including 3,3?,4,4?-biphenyl tetracarboxylic dianhydride and a first aromatic diamine including p-phenylenediamine. The multilayer film has a total thickness in a range of from 5 to 150 ?m. A thickness of the core layer is in a range of from 35 to 73% of the total thickness of the multilayer film. A minimum peel strength for at least one of the first and second outer layers, when adhered to copper foil and tested following ASTM method IPC-TM-650, method No. 2.4.9B, is greater than 0.9 kgf/cm (0.88 N/mm). In a second aspect, a metal-clad laminate includes the multilayer film of the first aspect and a first metal layer adhered to an outer surface of the first outer layer of the multilayer film.

Abstract: The present disclosure relates to a multilayer film for electronic circuitry applications, having advantageous barrier properties against unwanted electron and electromagnetic wave interference, and also protection against dirt or other similar-type unwanted foreign matter interference. The multilayer films of the present disclosure have at least three layers. The first outer layer contains a base polymer, a carbon black filler or pigment and a dielectric filler. The core layer is a polymer with less than 5 weight percent filler. The second outer is similar to the first outer layer and contains a base polymer, a low conductivity carbon black filler or pigment and a dielectric filler. The two outer layers can be the same or different. Optionally, additional layers can also be used between the two outer layers.

Abstract: The present disclosure relates to a multilayer film for electronic circuitry applications, having advantageous barrier properties against unwanted electron and electromagnetic wave interference, and also protection against dirt or other similar-type unwanted foreign matter interference. The multilayer films of the present disclosure have at least three layers. The first outer layer contains a polyimide base polymer, a carbon black filler and a dielectric filler. The core layer is a polyimide with less than 5 weight percent filler. The second outer is similar to the first outer layer and contains a polyimide base polymer, a low conductivity carbon black filler and a dielectric filler. The two outer layers can be the same or different. Optionally, additional layers can also be used between the two outer layers.