Abstract: Generally discussed herein are systems and apparatuses that can include a releasable core panel. The disclosure also includes techniques of making and using the systems and apparatuses. According to an example a technique of making a releasable core panel can include (1) arranging a mask on a center portion of the panel, the panel including a center stiffener with a first foil attached to a first side of the center stiffener by a first adhesive layer and a second foil attached to a second side of the center stiffener by a second adhesive layer, the first side of the center stiffener opposite the second side of the center stiffener, (2) removing portions of exposed edges of the panel, and (3) removing the mask.

Abstract: Apparatus, systems, and methods are provided to generate markings on the side of a substrate. The markings represent information. In an embodiment, the information provided in the markings may be used to collect information during an assembly process.

Abstract: Generally discussed herein are systems and apparatuses that can include a releasable core panel. The disclosure also includes techniques of making and using the systems and apparatuses. According to an example a technique of making a releasable core panel can include (1) arranging a mask on a center portion of the panel, the panel including a center stiffener with a first foil attached to a first side of the center stiffener by a first adhesive layer and a second foil attached to a second side of the center stiffener by a second adhesive layer, the first side of the center stiffener opposite the second side of the center stiffener, (2) removing portions of exposed edges of the panel, and (3) removing the mask.

Abstract: Apparatus, systems, and methods are provided to generate markings on the side of a substrate. The markings represent information. In an embodiment, the information provided in the markings may be used to collect information during an assembly process.

Abstract: Apparatus, systems, and methods are provided to generate markings on the side of a substrate. The markings represent information. In an embodiment, the information provided in the markings may be used to collect information during an assembly process.

Abstract: Singulating a wafer into individual die using a pre-scribing technique. Embodiments of the invention relate to scribing a wafer prior to the fabrication process in order to help preserve the integrity of the fabricated devices during singulation.

Abstract: An apparatus and method of dicing a microelectronic device wafer by laser ablating at least an interconnect layer portion of the microelectronic device wafer in the presence of an anion plasma, wherein the anion plasma reacts with debris from the laser ablation to form a reaction gas.

Abstract: An apparatus and method of dicing a microelectronic device wafer by laser ablating at least an interconnect layer portion of the microelectronic device wafer in the presence of an anion plasma, wherein the anion plasma reacts with debris from the laser ablation to form a reaction gas.

Abstract: Singulating a wafer into individual die using a pre-scribing technique. Embodiments of the invention relate to scribing a wafer prior to the fabrication process in order to help preserve the integrity of the fabricated devices during singulation.

Abstract: A method of dicing a microelectronic device wafer comprising forming at least one trench in at least one dicing street on the microelectronic device wafer, wherein the trench prevents cracking and/or delamination problems in the interconnect layer of the microelectronic device wafers caused by a subsequent dicing by a wafer saw.

Abstract: A method of dicing a microelectronic device wafer comprising forming at least one trench in at least one dicing street on the microelectronic device wafer, wherein the trench prevents cracking and/or delamination problems in the interconnect layer of the microelectronic device wafers caused by a subsequent dicing by a wafer saw.