Abstract: The present disclosure relates to genetically modified non-human animals that express a human or chimeric (e.g., humanized) IL10R and/or a human or chimeric (e.g., humanized) IL10, and methods of use thereof.

Abstract: An interlayer connective structure is suitable for being formed in a wiring board, in which the wiring board includes two traces and an insulation part between the traces. The insulation part has a through hole. The interlayer connective structure located in the through hole is connected to the traces. The interlayer connective structure includes a column and a pair of protuberant parts. The protuberant parts are located at two ends of the through hole respectively and connected to the column and the traces. The protuberant parts stick out from the outer surfaces of the traces respectively. Each of the protuberant parts has a convex curved surface, in which the distance between the convex curved surface and the axis of the through hole is less than the radius of the through hole.

Abstract: Embodiments of the present disclosure describe methods, apparatuses, storage media, and systems for accuracy measurements in UE baseband-demodulation-performance tests in new radio (NR) frequency range 2 (FR2) operations. The accuracy measurements includes, but not limited to, reference signal received power (RSRP) accuracy, reference signal received quality (RSRQ), and signal-to-noise and interference (SINR) accuracy. Various embodiments describe how to measure RSRP/RSRQ/SINR accuracies in an over-the-air (OTA) test environment in NR FR2 operations.

Abstract: The present disclosure relates to genetically modified non-human animals that express a human or chimeric (e.g., humanized) CD40, and methods of use thereof.

Abstract: The present disclosure provides an optical fingerprint identification unit, a display panel, a method for manufacturing an optical fingerprint identification unit and a method for identifying a fingerprint. The optical fingerprint identification unit includes a substrate, and a light source, a photoluminescent layer and a light sensor above the substrate. The light source is configured to emit visible light. The photoluminescent layer is configured to receive the visible light reflected by a fingerprint and convert the received visible light into non-visible light. The light sensor is configured to detect the non-visible light.

Abstract: The present disclosure relates to genetically modified non-human animals that express a human or chimeric (e.g., humanized) TNFR2, and methods of use thereof.

Abstract: The present invention provides a mechanical prosthetic limb, which relates to the technical field of medical devices. The mechanical prosthetic limb includes a prosthetic limb shank, a fixed component for connecting the prosthetic limb shank with a human body, a power-driven first drive mechanism that is installed on the prosthetic limb shank, and a prosthetic limb sole that is connected to the bottom of the prosthetic limb shank; the fixed component is rotationally connected with the prosthetic limb shank through the first drive mechanism; and the prosthetic limb shank is rotationally connected with the prosthetic limb sole through the first drive mechanism. It can relieve the burdens of the disabled in the automatic advance way, thereby improving convenience.

Abstract: Embodiments of the present disclosure describe methods, apparatuses, storage media, and systems for cell identification (ID) and beam ID detections in new radio (NR). The detections comprise NR primary synchronization signal (PSS)/secondary synchronization signal (SSS) detection, PBCH DMRS detection, SS reference signal received power (RSRP) measurement, and slot/SS burst boundary timing acquiring. Various embodiments describe how to detect a cell ID and a beam ID in millimeter wave (mmWave) operation. Other embodiments describe further details regarding how to detect NR cell and beam ID during intra-frequency measurements.

Abstract: The present application discloses a semiconductor apparatus, a pixel circuit and a control method thereof. The semiconductor apparatus comprises: an active layer; a first insulating layer; a first gate and a second gate overlapping with a portion of the active layer with the first insulating layer interposed therebetween, respectively; a first electrode, a second electrode and a third electrode, the first electrode and the second electrode are electrically connected with a first portion and a second portion of the active layer, respectively, the third electrode is used to be electrically connected with a photosensitive device, wherein the third electrode is electrically connected with the first gate or the second gate; or the third electrode is electrically connected with a third portion of the active layer.

Abstract: The present disclosure relates to the genetically modified non-human animals that express a human or chimeric TIGIT (e.g., humanized TIGIT), and methods of use thereof.

Abstract: The present disclosure relates to a photodiode, a method for preparing the same, and an electronic device. The photodiode includes: a first electrode layer and a semiconductor structure that are stacked, a surface of the semiconductor structure away from the first electrode layer having a first concave-convex structure; and a second electrode layer arranged on a surface of the semiconductor structure away from the first electrode layer, a surface of the second electrode layer away from the first electrode layer having a second concave-convex structure.

Abstract: The present disclosure relates to genetically modified non-human animals that express a human or chimeric (e.g., humanized) IL2RA, and methods of use thereof.

Abstract: A photoelectric detection substrate, a preparation method thereof and a photoelectric detection apparatus are provided. The photoelectric detection substrate includes a glass substrate, and an electronic apparatus and an optical apparatus disposed on the glass substrate, wherein the optical apparatus is a Schottky photo-diode. The Schottky photo-diode includes a first electrode, an ohmic contact layer disposed on one side of the first electrode away from the glass substrate, an intrinsic layer disposed on one side of the ohmic contact layer away from the glass substrate and a second electrode disposed on one side of the intrinsic layer away from the glass substrate.

Abstract: Provided are a humanized transgenic non-human animal, especially a rodent, in particular a transgenic mouse containing a human interleukin 17A (IL-17A) gene, a human gene 17RA (IL-17RA) and/or a human TNF-alpha gene, and a preparation method therefor and the use thereof.

Abstract: Disclosed is a process system and a process for converting the sulfur-containing flue gas into the sulfuric acid. The process system comprises: a flue gas preheater, which for preheating the sulfur-containing flue gas to 15˜30° C. above its dew point, and the flue gas preheater has a glass tube as a heat exchange tube; a flue gas fan for boosting the pressure of the preheated acid process gas and transporting one part of which to a combustion furnace, and the other part of which to a process gas steam heater; a sulfuric acid steam condenser for condensing SO3 generated by the combined reactor into sulfuric acid. The device of the present invention can resist the fluctuation of SO2 concentration in the feed gas, and can realize considerable economic benefits and rational utilization of energy.

Abstract: Provided are genetically modified non-human animals that express a human or chimeric (e.g., humanized) IL33, and methods of use thereof.

Abstract: An optoelectronic integrated substrate, a preparation method thereof and an optoelectronic integrated circuit. The electronic integrated substrate includes a base substrate and an electronic device and a photo-diode disposed on the base substrate, wherein the photo-diode includes an ohmic contact layer and an intrinsic amorphous silicon layer, and the ohmic contact layer and the intrinsic amorphous silicon layer are sequentially arranged along a direction parallel to the plane of the base substrate and are connected.

Abstract: A circuit board includes a first dielectric material, a second dielectric material, a third dielectric material, a first external circuit layer, a second external circuit layer, multiple conductive structures, and a conductive via structure. Dielectric constants of the first, the second and the third dielectric materials are different. The first and the second external circuit layers are respectively disposed on the first and the third dielectric materials. The conductive via structure at least penetrates the first and the second dielectric materials and is electrically connected to the first and the second external circuit layers to define a signal path. The conductive structures are electrically connected to each other and surround the first, the second and the third dielectric materials. The conductive structures are electrically connected to the first and the second external circuit layers to define a ground path surrounding the signal path.

Abstract: A co-axial structure includes a substrate, a first conductive structure, a second conductive structure, and an insulating layer. The substrate includes a first surface. The first conductive structure includes a first circuit deposited on the first surface and a first via penetrating the substrate. The second conductive structure includes a second circuit deposited on the first surface and a second via penetrating the substrate. The first via and the second via extend along a first direction. The first circuit and the second circuit extend along a second direction, and the second direction is perpendicular to the first direction. The insulating layer is located between the first via and the second via. The first conductive structure and the second conductive structure are electrically insulated. The first circuit and the second circuit are coplanar.

Abstract: A free-cutting and non-quenched and tempered steel, comprising the following chemical elements by mass percentages: C: 0.35-0.45%, Si: 0.45-0.0.65%, Mn: 1.35-1.65%, S: 0.025-0.065%, V: 0.07-0.15%, Ti: 0.01-0.018%, N: 0.012-0.017%, Al: 0.015-0.035%, Ca: 0.0008-0.0025%, with the remaining being iron and other unavoidable impurities, wherein the S and Ca elements satisfy the relationship S/Ca=20-60. A manufacturing method of the free-cutting and non-quenched and tempered steel, comprising the following steps: (1) smelting and refining; (2) casting; (3) rolling; (4) forging; and (5) two-stage cooling.