Patents by Inventor Ryo Matsuno

Ryo Matsuno has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240130396
    Abstract: A chunk meat-like meat alternative and a method of producing the same, the method including: mixing a fiber bundle-shaped textured protein and a binder to obtain a mixture; and stretching the mixture to obtain a stretched mixture having a degree of orientation of a fiber direction of the fiber bundle-shaped textured protein in a cross section along a direction of the stretching of 1.1 or more.
    Type: Application
    Filed: December 11, 2023
    Publication date: April 25, 2024
    Inventors: Naoki TSUKAMOTO, Ryo MATSUNO
  • Publication number: 20240114917
    Abstract: Provided is a fat simulating composition containing an aqueous phase and an oil phase dispersed in the aqueous phase, in which a melting point or a crystallization temperature of the oil phase is in a range of from ?20° C. to 60° C., and an absolute value of a difference between a d-line refractive index of the aqueous phase and a d-line refractive index of the oil phase satisfies a relationship of 0.01?|oil phase refractive index?aqueous phase refractive index|?0.115.
    Type: Application
    Filed: December 13, 2023
    Publication date: April 11, 2024
    Inventors: Ryo MATSUNO, Hiroyuki SUGIYAMA
  • Publication number: 20240108024
    Abstract: There are provided a fat lump composition containing a granular body that contains an oil and/or fat having a melting point of 0.1° C. or higher and containing an edible and ionically crosslinkable polymer that is crosslinked with a cation, in which an average particle diameter of the granular bodies is 50 ?m or more and 500 ?m or less; and a meat substitute.
    Type: Application
    Filed: December 7, 2023
    Publication date: April 4, 2024
    Inventor: Ryo MATSUNO
  • Publication number: 20230292809
    Abstract: Provide is edible oil-encapsulating microcapsules having a core portion containing edible oil or fat having a melting point of 30° C. or less, and a shell portion encapsulating the core portion and containing an edible and ionically cross-linkable polymer that is cross-linked with a polyvalent cation in which a number average particle diameter is 10 ?m or more and 300 ?m or less, and a coefficient of variation of the number average particle diameter is 30% or less, a dispersion liquid of the edible oil-encapsulating microcapsules, a manufacturing method of the edible oil-encapsulating microcapsules, and meat substitute.
    Type: Application
    Filed: May 29, 2023
    Publication date: September 21, 2023
    Inventor: Ryo MATSUNO
  • Publication number: 20230191399
    Abstract: The present disclosure provides a microchannel device including a base having a defining surface that defines a flow channel and containing silicone, in which the defining surface of the base includes a region in which a surfactant is adsorbed, and a ratio of an amount of secondary ions of the surfactant adsorbed on the defining surface of the base to a total amount of ions detected by time of flight secondary ion mass spectrometry is 0.01 or more, and provides a use application thereof.
    Type: Application
    Filed: February 10, 2023
    Publication date: June 22, 2023
    Inventor: Ryo MATSUNO
  • Publication number: 20230183059
    Abstract: The present disclosure provides a microchannel device including a first base having a defining surface that defines a flow channel and containing a polymer that contains a fluorine atom and a second base having a defining surface that defines the flow channel together with the defining surface of the first base, having solvent resistance, and coming into contact with the first base, in which an arithmetic average roughness Ra of a surface of the first base, exposed by peeling the second base from the first base, is 1 ?m or more, and provides a use application thereof.
    Type: Application
    Filed: February 10, 2023
    Publication date: June 15, 2023
    Inventor: Ryo MATSUNO
  • Patent number: 11541455
    Abstract: Provided are gold-coated flat silver particles, a dispersion including the gold-coated flat silver particles and a dispersion medium, a method of the dispersion, a coating film including the gold-coated flat silver particles, and an antireflection optical member. The gold-coated flat silver particles include flat silver particles and a gold coating layer, in which an average thickness of the gold coating layer on principal planes of the particles is 0.1 nm to 2 nm, and a ratio of the average thickness of the gold coating layer on the principal planes of the particles to an average thickness of the gold coating layer on edge surfaces of the particles is 0.02 or higher.
    Type: Grant
    Filed: August 15, 2019
    Date of Patent: January 3, 2023
    Assignee: FUJIFILM CORPORATION
    Inventor: Ryo Matsuno
  • Publication number: 20210207120
    Abstract: The producing method includes causing a cell suspension to flow into a tubular flow path; injecting a gel precursor into the flow path to cover the circumference of the cell suspension with the gel precursor; injecting a gas into the flow path to form, in the flow path, an alternating flow obtained from the gas and the cell suspension covered with the gel precursor; and injecting a gelating agent into the flow path and causing the gelating agent to join the alternating flow to the gel precursor.
    Type: Application
    Filed: March 18, 2021
    Publication date: July 8, 2021
    Applicant: FUJIFILM Corporation
    Inventors: Tomoaki KURAKAZU, Ryo MATSUNO, Kazunori TAKAHASHI
  • Patent number: 10866348
    Abstract: Provided are a heat ray-shielding material having a frame body including a plurality of frames having a cell structure and a plurality of films attached to some or all of the plurality of frames in the frame body, in which at least some of the plurality of films shield near-infrared light, and cell sizes in the plurality of frames are larger than visible light optical wavelengths, whereby the heat ray-shielding material is lightweight, capable of selectively shielding heat rays, that is, near-infrared rays, can be applied to a variety of uses, and can be independently used as movable members, easily removable members, and members having a collapsible structure, an architectural member, a cage member, and a side surface wall.
    Type: Grant
    Filed: November 7, 2017
    Date of Patent: December 15, 2020
    Assignee: FUJIFILM Corporation
    Inventors: Shinya Hakuta, Shogo Yamazoe, Tadashi Kasamatsu, Masayuki Naya, Hideki Yasuda, Ryo Matsuno
  • Publication number: 20190375005
    Abstract: Provided are gold-coated flat silver particles, a dispersion including the gold-coated flat silver particles and a dispersion medium, a method of the dispersion, a coating film including the gold-coated flat silver particles, and an antireflection optical member. The gold-coated flat silver particles include flat silver particles and a gold coating layer, in which an average thickness of the gold coating layer on principal planes of the particles is 0.1 nm to 2 nm, and a ratio of the average thickness of the gold coating layer on the principal planes of the particles to an average thickness of the gold coating layer on edge surfaces of the particles is 0.02 or higher.
    Type: Application
    Filed: August 15, 2019
    Publication date: December 12, 2019
    Inventor: Ryo MATSUNO
  • Publication number: 20180095209
    Abstract: Provided are a heat ray-shielding material having a frame body including a plurality of frames having a cell structure and a plurality of films attached to some or all of the plurality of frames in the frame body, in which at least some of the plurality of films shield near-infrared light, and cell sizes in the plurality of frames are larger than visible light optical wavelengths, whereby the heat ray-shielding material is lightweight, capable of selectively shielding heat rays, that is, near-infrared rays, can be applied to a variety of uses, and can be independently used as movable members, easily removable members, and members having a collapsible structure, an architectural member, a cage member, and a side surface wall.
    Type: Application
    Filed: November 7, 2017
    Publication date: April 5, 2018
    Applicant: FUJIFILM Corporation
    Inventors: Shinya Hakuta, Shogo Yamazoe, Tadashi Kasamatsu, Masayuki Naya, Hideki Yasuda, Ryo Matsuno
  • Patent number: 8885258
    Abstract: Provided is a stack-type lens array capable of preventing a lens from peeling off due to stress during dicing or vibration and impact when used. The stack-type lens array is formed by stacking and bonding two lens sheets in which micro lenses are arranged on a flat portion at predetermined intervals. Antireflection films are vapor-deposited on a convex surface and a concave surface of the lens and a light shielding film is vapor-deposited such that a circular opening is formed at the center of the concave surface. The opening serves as a diaphragm aperture of the lens. An exposed surface in which neither the antireflection film nor the light shielding film is vapor-deposited is provided outside the light shielding film between adjacent lenses. A dicing line is set at the center of the exposed surface. An adhesive layer is formed in a predetermined pattern on the exposed surface.
    Type: Grant
    Filed: July 11, 2013
    Date of Patent: November 11, 2014
    Assignee: Fujifilm Corporation
    Inventors: Ryo Matsuno, Satoshi Yoneyama, Takashi Koike, Kazuhide Hasegawa
  • Patent number: 8847078
    Abstract: A printed wiring board includes an outermost interlayer resin insulation layer, n outermost conductive layer formed on the outermost interlayer resin insulation layer and including multiple alignment marks, a connection wiring structure connecting the alignment marks, and a solder-resist layer formed on the outermost interlayer resin insulation layer and the outermost conductive layer. The solder-resist layer has openings exposing the alignment marks, respectively, and each of the alignment marks has an electroless plated film formed on each of the alignment marks.
    Type: Grant
    Filed: September 27, 2013
    Date of Patent: September 30, 2014
    Assignee: Ibiden Co., Ltd.
    Inventors: Ryo Matsuno, Koichi Kondo, Satoru Kose
  • Patent number: 8711483
    Abstract: A lens module capable of preventing a deterioration of optical properties and a method for manufacturing thereof are provided. Optical axes of lens portions of superimposed lens arrays are aligned. Substrate portions of the other lens arrays of the superimposed lens arrays except the lowermost lens array are cut by a first cutting portion. Subsequently, thermosetting resins are supplied from a gap between cut surfaces of the cut substrate portion so as to fill a gap between the substrate portions of the superimposed lens arrays with the thermosetting resins and to cause the thermosetting resins to integrally cover the cut surfaces of the substrate portion and a surface of the substrate portion of the uppermost lens array. Thereafter, the thermosetting resins are cured, and an individual lens module is separated by cutting the substrate portion of the lowermost lens array using a second cutting portion.
    Type: Grant
    Filed: August 29, 2013
    Date of Patent: April 29, 2014
    Assignee: FUJIFILM Corporation
    Inventors: Ryo Matsuno, Satoshi Yoneyama, Takashi Koike, Kazuhide Hasegawa
  • Publication number: 20140083747
    Abstract: A printed wiring board includes an outermost interlayer resin insulation layer, n outermost conductive layer formed on the outermost interlayer resin insulation layer and including multiple alignment marks, a connection wiring structure connecting the alignment marks, and a solder-resist layer formed on the outermost interlayer resin insulation layer and the outermost conductive layer. The solder-resist layer has openings exposing the alignment marks, respectively, and each of the alignment marks has an electroless plated film formed on each of the alignment marks.
    Type: Application
    Filed: September 27, 2013
    Publication date: March 27, 2014
    Applicant: IBIDEN CO., Ltd.
    Inventors: Ryo MATSUNO, Koichi Kondo, Satoru Kose
  • Publication number: 20130342924
    Abstract: A lens module capable of preventing a deterioration of optical properties and a method for manufacturing thereof are provided. Optical axes of lens portions of superimposed lens arrays are aligned. Substrate portions of the other lens arrays of the superimposed lens arrays except the lowermost lens array are cut by a first cutting portion. Subsequently, thermosetting resins are supplied from a gap between cut surfaces of the cut substrate portion so as to fill a gap between the substrate portions of the superimposed lens arrays with the thermosetting resins and to cause the thermosetting resins to integrally cover the cut surfaces of the substrate portion and a surface of the substrate portion of the uppermost lens array. Thereafter, the thermosetting resins are cured, and an individual lens module is separated by cutting the substrate portion of the lowermost lens array using a second cutting portion.
    Type: Application
    Filed: August 29, 2013
    Publication date: December 26, 2013
    Applicant: FUJIFILM CORPORATION
    Inventors: Ryo MATSUNO, Satoshi YONEYAMA, Takashi KOIKE, Kazuhide HASEGAWA
  • Publication number: 20130301140
    Abstract: Provided is a stack-type lens array capable of preventing a lens from peeling off due to stress during dicing or vibration and impact when used. The stack-type lens array is formed by stacking and bonding two lens sheets in which micro lenses are arranged on a flat portion at predetermined intervals. Antireflection films are vapor-deposited on a convex surface and a concave surface of the lens and a light shielding film is vapor-deposited such that a circular opening is formed at the center of the concave surface. The opening serves as a diaphragm aperture of the lens. An exposed surface in which neither the antireflection film nor the light shielding film is vapor-deposited is provided outside the light shielding film between adjacent lenses. A dicing line is set at the center of the exposed surface. An adhesive layer is formed in a predetermined pattern on the exposed surface.
    Type: Application
    Filed: July 11, 2013
    Publication date: November 14, 2013
    Inventors: Ryo MATSUNO, Satoshi YONEYAMA, Takashi KOIKE, Kazuhide HASEGAWA
  • Patent number: 8542309
    Abstract: Disclosed are a wafer-level lens array, a method of manufacturing a wafer-level lens array, a lens module, and an imaging unit that can prevent the influence of, for example, the shrinkage of a forming material, prevent the positional deviation between lenses when the wafer-level lens arrays overlap each other or when the wafer-level lens array overlaps an imaging element array, and be easily designed. A method of manufacturing a wafer-level lens array including a substrate unit and a plurality of lens units that is arranged on the substrate unit includes: forming the substrate unit; and integrally forming the lens units that are made of a resin having substantially the same optical characteristics as a material forming the substrate unit with the substrate unit.
    Type: Grant
    Filed: September 13, 2010
    Date of Patent: September 24, 2013
    Assignee: FUJIFILM Corporation
    Inventors: Daisuke Yamada, Ryo Matsuno
  • Patent number: 8525283
    Abstract: A wafer lens array comprising a plurality of lens sections arranged one-dimensionally or two-dimensionally, a substrate section connecting the lens sections, and gap sections, wherein the lens surfaces in the lens section each have one or more curved surfaces; the gap section is a part projecting from outside than the inner edge of the lens section; and the inner surfaces of the gap sections are spread from a side near the lens section to the other side.
    Type: Grant
    Filed: March 9, 2011
    Date of Patent: September 3, 2013
    Assignee: Fujifilm Corporation
    Inventors: Satoshi Yoneyama, Ryo Matsuno
  • Patent number: 8432612
    Abstract: Provided is a wafer lens unit comprising a plurality of wafer lens arrays, wherein the wafer lens array comprises a plurality of lenses arranged in one dimension or two dimensions and a substrate interconnecting the lenses; and the neighboring wafer lens arrays are bonded through an adhesive layer comprising a spacer only at the substrates thereof.
    Type: Grant
    Filed: March 10, 2011
    Date of Patent: April 30, 2013
    Assignee: FUJIFILM Corporation
    Inventors: Satoshi Yoneyama, Ryo Matsuno