Patents by Inventor Ryohei Urata

Ryohei Urata has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240213215
    Abstract: The technology relates to an integrated circuit (IC) package. The IC package may include a substrate. An IC die may be mounted to the substrate. One or more photonic modules may be attached to the substrate and one or more serializer/deserializer (SerDes) interfaces may connect the IC die to the one or more photonic modules. The IC die may be an application specific integrated circuit (ASIC) die and the one or more photonic modules may include a photonic integrated circuit (PIC) and fiber array. The one or more photonic modules may be mounted to one or more additional substrates which may be attached to the substrate via one or more sockets.
    Type: Application
    Filed: March 5, 2024
    Publication date: June 27, 2024
    Inventors: Woon-Seong Kwon, Nam Hoon Kim, Teckgyu Kang, Ryohei Urata
  • Patent number: 11978721
    Abstract: The technology relates to an integrated circuit (IC) package. The IC package may include a substrate. An IC die may be mounted to the substrate. One or more photonic modules may be attached to the substrate and one or more serializer/deserializer (SerDes) interfaces may connect the IC die to the one or more photonic modules. The IC die may be an application specific integrated circuit (ASIC) die and the one or more photonic modules may include a photonic integrated circuit (PIC) and fiber array. The one or more photonic modules may be mounted to one or more additional substrates which may be attached to the substrate via one or more sockets.
    Type: Grant
    Filed: January 19, 2022
    Date of Patent: May 7, 2024
    Assignee: Google LLC
    Inventors: Woon-Seong Kwon, Namhoon Kim, Teckgyu Kang, Ryohei Urata
  • Publication number: 20240137674
    Abstract: An optical links diagnostic system (LDS) and its operation within an optical circuit switch (OCS) for measurement and diagnosis of fiber-optic network fiber performance and quality is disclosed. The LDS can contain two photodetectors, a laser source, and be coupled to an OCS. Optical circulators can further be linked to the OCS. The LDS can be used both as an optical time domain reflectometer (OTDR) or as an optical return loss (ORL) meter and can automate the diagnosis of the fiber optical network fiber insertion loss and return loss.
    Type: Application
    Filed: December 12, 2023
    Publication date: April 25, 2024
    Inventors: Jill Berger, Kevin Yasumura, Xiang Zhou, Pedram Z. Dashti, Ryohei Urata
  • Patent number: 11910134
    Abstract: An optical links diagnostic system (LDS) and its operation within an optical circuit switch (OCS) for measurement and diagnosis of fiber-optic network fiber performance and quality is disclosed. The LDS can contain two photodetectors, a laser source, and be coupled to an OCS. Optical circulators can further be linked to the OCS. The LDS can be used both as an optical time domain reflectometer (OTDR) or as an optical return loss (ORL) meter and can automate the diagnosis of the fiber optical network fiber insertion loss and return loss.
    Type: Grant
    Filed: June 30, 2021
    Date of Patent: February 20, 2024
    Assignee: Google LLC
    Inventors: Jill Berger, Kevin Yasumura, Xiang Zhou, Pedram Z. Dashti, Ryohei Urata
  • Publication number: 20230335928
    Abstract: An assembly includes a printed circuit board (“PCB”). An aperture extends through the PCB. The assembly also includes an array of pins and a processor package. The array of pins extends around a perimeter of the aperture, and the processor package extends over the aperture. The processor package is pressed against the array of pins by a compressive force couple.
    Type: Application
    Filed: April 18, 2022
    Publication date: October 19, 2023
    Inventors: William F. Edwards, JR., Xu Zuo, Ryohei Urata, Melanie Beauchemin, Woon-Seong Kwon, Shinnosuke Yamamoto, Houle Gan, Yujeong Shim
  • Publication number: 20230314709
    Abstract: A photonic integrated circuit chip includes a substrate and a wafer on the substrate. The wafer itself includes a photonic grating coupler with a taper portion and grating features. The grating features extend from the taper portion toward the substrate.
    Type: Application
    Filed: May 30, 2023
    Publication date: October 5, 2023
    Inventors: Liming Wang, Ryohei Urata, Jan Petykiewicz, Jill Berger
  • Publication number: 20230305243
    Abstract: A system for passive alignment of fibers to an interface of a photonic integrated circuit (PIC) includes an input frame, an actuator, and an output frame. The actuator arranged to apply force along a force axis to the input frame. The output frame including a tip for picking up a plate and transferring the force thereto, the output frame being connected to the input frame such that the output frame may tilt relative to the input frame and the output frame is elastically biased relative to the input frame into a position wherein the tip is aligned on the force axis.
    Type: Application
    Filed: May 30, 2023
    Publication date: September 28, 2023
    Inventors: Daoyi Wang, Ryohei Urata, Lieven Verslegers, Jan Petykiewicz
  • Publication number: 20230283380
    Abstract: Coherent optical communications technology for recovery of 1D and 2D formatted optical signals. For example, 1D or 2D formatted signals that travel through fiber optic media may be recovered by separating the light into X- and Y-polarization components, rotating one polarization component (e.g., Y-component) into the polarization space of the other component (e.g., Y-component into the X-polarization space), delaying the rotated component enough to avoid destructive interference and combining the delayed component with the undelayed component to form a folded optical signal, which may then be processed as a X-polarized signal.
    Type: Application
    Filed: May 12, 2023
    Publication date: September 7, 2023
    Inventors: Xiang Zhou, Cedric F. Lam, Ryohei Urata, Hong Liu
  • Patent number: 11726260
    Abstract: A photonic integrated circuit chip includes a substrate and a wafer on the substrate. The wafer itself includes a photonic grating coupler with a taper portion and grating features. The grating features extend from the taper portion toward the substrate.
    Type: Grant
    Filed: September 29, 2020
    Date of Patent: August 15, 2023
    Assignee: Google LLC
    Inventors: Liming Wang, Ryohei Urata, Jan Petykiewicz, Jill Berger
  • Publication number: 20230224068
    Abstract: Coherent optical communications technology for recovery of 1D and 2D formatted optical signals. For example, 1D or 2D formatted signals that travel through fiber optic media may be recovered by separating the light into X- and Y-polarization components, rotating one polarization component (e.g., Y-component) into the polarization space of the other component (e.g., Y-component into the X-polarization space), delaying the rotated component enough to avoid destructive interference and combining the delayed component with the undelayed component to form a folded optical signal, which may then be processed as a X-polarized signal.
    Type: Application
    Filed: March 22, 2023
    Publication date: July 13, 2023
    Inventors: Xiang Zhou, Cedric F. Lam, Ryohei Urata, Hong Liu
  • Patent number: 11693197
    Abstract: A system for passive alignment of fibers to an interface of a photonic integrated circuit (PIC) includes an input frame, an actuator, and an output frame. The actuator arranged to apply force along a force axis to the input frame. The output frame including a tip for picking up a plate and transferring the force thereto, the output frame being connected to the input frame such that the output frame may tilt relative to the input frame and the output frame is elastically biased relative to the input frame into a position wherein the tip is aligned on the force axis.
    Type: Grant
    Filed: June 25, 2021
    Date of Patent: July 4, 2023
    Assignee: Google LLC
    Inventors: Daoyi Wang, Ryohei Urata, Lieven Verslegers, Jan Petykiewicz
  • Patent number: 11689292
    Abstract: Coherent optical communications technology for recovery of 1D and 2D formatted optical signals. For example, 1D or 2D formatted signals that travel through fiber optic media may be recovered by separating the light into X- and Y-polarization components, rotating one polarization component (e.g., Y-component) into the polarization space of the other component (e.g., Y-component into the X-polarization space), delaying the rotated component enough to avoid destructive interference and combining the delayed component with the undelayed component to form a folded optical signal, which may then be processed as a X-polarized signal.
    Type: Grant
    Filed: April 12, 2021
    Date of Patent: June 27, 2023
    Assignee: Google LLC
    Inventors: Xiang Zhou, Cedric F. Lam, Ryohei Urata, Hong Liu
  • Patent number: 11641248
    Abstract: Coherent optical communications technology for recovery of 1D and 2D formatted optical signals. For example, 1D or 2D formatted signals that travel through fiber optic media may be recovered by separating the light into X- and Y-polarization components, rotating one polarization component (e.g., Y-component) into the polarization space of the other component (e.g., Y-component into the X-polarization space), delaying the rotated component enough to avoid destructive interference and combining the delayed component with the undelayed component to form a folded optical signal, which may then be processed as a X-polarized signal.
    Type: Grant
    Filed: April 12, 2021
    Date of Patent: May 2, 2023
    Assignee: Google LLC
    Inventors: Xiang Zhou, Cedric F. Lam, Ryohei Urata, Hong Liu
  • Patent number: 11564312
    Abstract: The present disclosure provides for an example integrated optics assembly. The integrated optics assembly may include an optics mount, a substrate including a heat sink, and a photonic integrated circuit (“PIC”). The optics mount may be adapted to support a light source on a first end of the optics mount. The first end of the optics mount may be coupled to a region of the substrate including the heat sink. The heat sink may remove or dissipate the heat produced by the light source. A second end of the optics mount may be coupled to the PIC such that the optics mount extends between the substrate and the PIC. This may decrease the amount of space the optics mount takes up on the PIC thereby allowing the overall size of the PIC to be decreased. Decreasing the size of the PIC may allow for more PICS per wafer.
    Type: Grant
    Filed: September 28, 2020
    Date of Patent: January 24, 2023
    Assignee: Google LLC
    Inventors: Lieven Verslegers, Hong Liu, Kevin Yasumura, Jill Berger, Ryohei Urata
  • Publication number: 20220413234
    Abstract: A system for passive alignment of fibers to an interface of a photonic integrated circuit (PIC) includes an input frame, an actuator, and an output frame. The actuator arranged to apply force along a force axis to the input frame. The output frame including a tip for picking up a plate and transferring the force thereto, the output frame being connected to the input frame such that the output frame may tilt relative to the input frame and the output frame is elastically biased relative to the input frame into a position wherein the tip is aligned on the force axis.
    Type: Application
    Filed: June 25, 2021
    Publication date: December 29, 2022
    Inventors: Daoyi Wang, Ryohei Urata, Lieven Verslegers, Jan Petykiewicz
  • Publication number: 20220381975
    Abstract: A photonic integrated circuit (PIC) includes one or more couplers to interface a light source with the PIC, a splitter directly coupled to the one or more couplers at a coupling point of the PIC, a modulator to receive light from the couplers, and a connecting waveguide to connect the splitter to the modulator. The waveguide may be a rib waveguide. The PIC may be integrated with devices such as a CWDM or a PSM device, and may provide improved performance and lower attention for high optical power applications.
    Type: Application
    Filed: May 26, 2021
    Publication date: December 1, 2022
    Inventors: Lieven Verslegers, Ryohei Urata, Mohammad Sotoodeh, Liming Wang
  • Patent number: 11466752
    Abstract: Elements of a transmission belt wound around pulleys of a continuously variable transmission each include a body part, a pair of pillar parts, and a pair of side surfaces. The pair of side surfaces each include a first side surface formed on a corresponding one of the pillar parts; and a second side surface formed so as to continue from the first side surface, and located more on an inner circumference side than the first side surface.
    Type: Grant
    Filed: December 7, 2018
    Date of Patent: October 11, 2022
    Assignees: AISIN CORPORATION, TOYOTA JIDOSHA KABUSHIKI KAISHA
    Inventors: Akira Ochi, Ryohei Urata, Wataru Ishihara, Junichi Tokunaga, Takayuki Miyake, Hideaki Takahara, Keisuke Ninomiya, Yu Inase, Fumiya Kaji, Yuji Nagasawa
  • Publication number: 20220278766
    Abstract: Coherent optical communications technology for recovery of 1D and 2D formatted optical signals. For example, 1D or 2D formatted signals that travel through fiber optic media may be recovered by separating the light into X- and Y-polarization components, rotating one polarization component (e.g., Y-component) into the polarization space of the other component (e.g., Y-component into the X-polarization space), delaying the rotated component enough to avoid destructive interference and combining the delayed component with the undelayed component to form a folded optical signal, which may then be processed as a X-polarized signal.
    Type: Application
    Filed: April 12, 2021
    Publication date: September 1, 2022
    Inventors: Xiang Zhou, Cedric F. Lam, Ryohei Urata, Hong Liu
  • Publication number: 20220278752
    Abstract: Coherent optical communications technology for recovery of 1D and 2D formatted optical signals. For example, 1D or 2D formatted signals that travel through fiber optic media may be recovered by separating the light into X- and Y-polarization components, rotating one polarization component (e.g., Y-component) into the polarization space of the other component (e.g., Y-component into the X-polarization space), delaying the rotated component enough to avoid destructive interference and combining the delayed component with the undelayed component to form a folded optical signal, which may then be processed as a X-polarized signal.
    Type: Application
    Filed: April 12, 2021
    Publication date: September 1, 2022
    Inventors: Xiang Zhou, Cedric F. Lam, Ryohei Urata, Hong Liu
  • Patent number: 11340468
    Abstract: A photonic integrated circulator can be fabricated by including a plurality of polarizing beam splitters and optical polarization rotators such that two copies of the optical signal are output at a receiver in substantially aligned polarization states. The circulator can be used for facilitating bi-directional communications between photonic integrated circuit devices, which are inherently polarization sensitive, while reducing signal loss.
    Type: Grant
    Filed: August 5, 2020
    Date of Patent: May 24, 2022
    Assignee: Google LLC
    Inventors: Ryohei Urata, Lieven Verslegers, Hong Liu, Daoyi Wang