Patents by Inventor Ryohta SASAKI

Ryohta SASAKI has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240247120
    Abstract: Provided is a prepreg including a fiber substrate having a thickness of 40 ?m or more impregnated with a thermosetting resin composition, the prepreg having in the fiber substrate an impregnated region and a non-impregnated region with the thermosetting resin composition, having a surface waviness (Wa) of 5.0 ?m or less. Also provided are a laminate, a metal-clad laminate, a printed wiring board, and a semiconductor package, which are obtained by using the prepreg, a method of producing the prepreg, and a method of producing the metal-clad laminate.
    Type: Application
    Filed: May 30, 2022
    Publication date: July 25, 2024
    Inventors: Shunsuke TONOUCHI, Takayo KITAJIMA, Seiya MAGOTA, Kazuki AOYAMA, Shinji SHIMAOKA, Yuji TOSAKA, Takeshi SAITOH, Ryohta SASAKI, Kota NAKANISHI
  • Patent number: 11497117
    Abstract: Provided are a metal-clad laminate, a printed circuit board, and a semiconductor package, wherein the warps therein are effectively suppressed. Specifically the metal-clad laminate comprises a prepreg, wherein the prepreg has a resin composition attached to a fiber base material and satisfies a following formula (1) as well as a Mowing formula (2), provided that in the formulae, a1 represents an average thickness of the resin composition after being cured which is present on one surface of the fiber base material; a2 represents an average thickness of the resin composition after being cured which is present on other surface of the fiber base material; and B represents an average thickness of the fiber base material. 0.12<{(a1+a2)/2}/B??(1) 0.8?a1/a2?1.
    Type: Grant
    Filed: May 24, 2017
    Date of Patent: November 8, 2022
    Assignee: Showa Denko Materials Co., Ltd.
    Inventors: Yuji Tosaka, Takeshi Saitoh, Yukio Nakamura, Ryohta Sasaki, Hiroshi Shimizu, Ryoichi Uchimura
  • Patent number: 11446845
    Abstract: In the method for adhering a resin film with an aggregate under an atmospheric pressure in which workability is excellent and spouting of the resin from an edge portion of the aggregate can be suppressed, the present invention provides a method for producing an FRP precursor with excellent resin filling property into bulk voids of the aggregate as well as a method for producing an FRP. Specifically, provided is the method for producing the FRP precursor by adhering a thermosetting resin film to one surface of an aggregate that is in a form of a sheet under an atmospheric pressure, wherein the method includes a process in which the thermosetting resin film and the aggregate are press-adhered by heating by means of a pressure roll having a temperature in a range of +5° C. to +35° C. relative to a temperature at which a minimum melt viscosity of the film is exhibited.
    Type: Grant
    Filed: March 28, 2018
    Date of Patent: September 20, 2022
    Assignee: Showa Denko Materials Co., Ltd.
    Inventors: Ryohta Sasaki, Yukio Nakamura, Kazutoshi Danjoubara, Takeshi Saitoh, Shintaro Hashimoto
  • Patent number: 11040517
    Abstract: Provided are a printed circuit board in which warps are effectively suppressed, and a semiconductor package having a semiconductor device mounted on said printed circuit board, even though circuit patterns of different amounts of metal are formed on both sides of one cured product of a prepreg. Specifically, said printed circuit board is a printed circuit board which comprises a cured product of a prepreg comprising a fiber base material and a resin composition, in which circuit patterns of different amounts of metal are formed on both sides of one cured product of the prepreg, in which said prepreg has layers on the front and back of said fiber base material, wherein said layers comprise resin compositions having different heat curing shrinkage rates, in which among these layers, the layer made of the resin composition having a smaller heat curing shrinkage rate is present on the side on which the circuit pattern with a smaller amount of metal is formed.
    Type: Grant
    Filed: November 9, 2017
    Date of Patent: June 22, 2021
    Assignee: Showa Denko Materials Co., Ltd.
    Inventors: Takeshi Saitoh, Yukio Nakamura, Ryohta Sasaki, Junki Somekawa, Yuji Tosaka, Hiroshi Shimizu, Ryoichi Uchimura
  • Publication number: 20200376715
    Abstract: In the method for adhering a resin film with an aggregate under an atmospheric pressure in which workability is excellent and spouting of the resin from an edge portion of the aggregate can be suppressed, the present invention provides a method for producing an FRP precursor with excellent resin filling property into bulk voids of the aggregate as well as a method for producing an FRP. Specifically, provided is the method for producing the FRP precursor by adhering a thermosetting resin film to one. surface of an aggregate that is in a form of a sheet under an atmospheric pressure, wherein the method includes a process in which the thermosetting resin film and the aggregate are press-adhered by heating by means of a pressure roll having a temperature in a range of +5° C. to +35° C. relative to a temperature at which a minimum melt viscosity of the film is exhibited.
    Type: Application
    Filed: March 28, 2018
    Publication date: December 3, 2020
    Inventors: Ryohta SASAKI, Yukio NAKAMURA, Kazutoshi DANJOUBARA, Takeshi SAITOH, Shintaro HASHIMOTO
  • Patent number: 10856423
    Abstract: Provided are a prepreg including two or more fiber substrate layers and one or more resin composition layers, in which at least one of the one or more resin composition layers has a fiber substrate layer on each of both surfaces thereof, a printed circuit board using the prepreg and a method of producing the printed circuit board, and a semiconductor package.
    Type: Grant
    Filed: January 13, 2017
    Date of Patent: December 1, 2020
    Assignee: SHOWA DENKO MATERIALS CO., LTD.
    Inventors: Yuji Tosaka, Takeshi Saitoh, Yukio Nakamura, Ryohta Sasaki, Hiroshi Shimizu
  • Publication number: 20200323078
    Abstract: Provided are a metal-clad laminate, a printed circuit board, and a semiconductor package, wherein the warps therein are effectively suppressed. Specifically the metal-clad laminate comprises a prepreg, wherein the prepreg has a resin composition attached to a fiber base material and satisfies a following formula (1) as well as a Mowing formula (2), provided that in the formulae, a1 represents an average thickness of the resin composition after being cured which is present on one surface of the fiber base material; a2 represents an average thickness of the resin composition after being cured which is present on other surface of the fiber base material; and B represents an average thickness of the fiber base material. 0.12<{(a1+a2)/2}/B??(1) 0.8?a1/a2?1.
    Type: Application
    Filed: May 24, 2017
    Publication date: October 8, 2020
    Inventors: Yuji TOSAKA, Takeshi SAITOH, Yukio NAKAMURA, Ryohta SASAKI, Hiroshi SHIMIZU, Ryoichi UCHIMURA
  • Publication number: 20190315094
    Abstract: Provided are a printed circuit board in which warps are effectively suppressed, and a semiconductor package having a semiconductor device mounted on said printed circuit board, even though circuit patterns of different amounts of metal are formed on both sides of one cured product of a prepreg. Specifically, said printed circuit board is a printed circuit board which comprises a cured product of a prepreg comprising a fiber base material and a resin composition, in which circuit patterns of different amounts of metal are formed on both sides of one cured product of the prepreg, in which said prepreg has layers on the front and back of said fiber base material, wherein said layers comprise resin compositions having different heat curing shrinkage rates, in which among these layers, the layer made of the resin composition having a smaller heat curing shrinkage rate is present on the side on which the circuit pattern with a smaller amount of metal is formed.
    Type: Application
    Filed: November 9, 2017
    Publication date: October 17, 2019
    Inventors: Takeshi SAITOH, Yukio NAKAMURA, Ryohta SASAKI, Junki SOMEKAWA, Yuji TOSAKA, Hiroshi SHIMIZU, Ryoichi UCHIMURA
  • Publication number: 20190037691
    Abstract: Provided are: an FRP precursor capable of providing a metal-clad laminate having small surface waviness and reduced number of a light spot, even if thickness of a metal foil is 40 ?m or less; a laminated plate including the FRP precursor; a metal-clad laminate having a metal foil on the laminated plate; a printed circuit board having a circuit pattern formed on the metal-clad laminate; a semiconductor package including the printed circuit board; and methods for producing them. The FRP precursor has the surface waviness of 12 ?m or less on both surfaces thereof.
    Type: Application
    Filed: January 13, 2017
    Publication date: January 31, 2019
    Inventors: Yuji TOSAKA, Takeshi SAITOH, Yukio NAKAMURA, Ryohta SASAKI, Hiroshi SHIMIZU
  • Publication number: 20190021175
    Abstract: Provided are a prepreg including two or more fiber substrate layers and one or more resin composition layers, in which at least one of the one or more resin composition layers has a fiber substrate layer on each of both surfaces thereof, a printed circuit board using the prepreg and a method of producing the printed circuit board, and a semiconductor package.
    Type: Application
    Filed: January 13, 2017
    Publication date: January 17, 2019
    Inventors: Yuji TOSAKA, Takeshi SAITOH, Yukio NAKAMURA, Ryohta SASAKI, Hiroshi SHIMIZU