Patents by Inventor Ryoichi Ohe

Ryoichi Ohe has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 5247456
    Abstract: A method and an apparatus is provided for forming a layout pattern of a semiconductor integrated circuit comprising automatically reforming a layout pattern by only carrying out a routing process, when a required layout pattern is the same as an existing layout pattern at the transistor-constitution level. Further, a method or an apparatus is provided for forming a layout pattern of a semiconductor integrated circuit comprising automatically reforming a layout pattern without analyzing the logical information down to the transistor-constitution level, when a required layout pattern is not the same as an existing layout pattern in the transistor-constitution level. Therefore, processing can be simplified and operation speed can be increased.
    Type: Grant
    Filed: November 8, 1988
    Date of Patent: September 21, 1993
    Assignee: Fujitsu Limited
    Inventors: Ryoichi Ohe, Koichi Yamashita
  • Patent number: 5081059
    Abstract: A method of forming a semiconductor integrated circuit using a master slice approach includes the steps of: forming a plurality of transistor regions with units of a predetermined number in array on a semiconductor chip; forming a plurality of first wirings extending in parallel at a space therebetween with units of a predetermined length in a discontinuous form so that the first wirings pass through regions corresponding to the transistor regions; forming first contact holes at predetermined positions so that gate regions and source/drain regions of the transistor regions are connected to the first wirings; forming a plurality of second wirings having same forms as the plurality of first wirings so that the second wirings constitute a mesh-like arrangement in combination with the first wirings; and forming second contact holes using a pattern mask programmable in accordance with demanded conditions of a given circuit so that the second contact holes connect the second wirings to the first wirings.
    Type: Grant
    Filed: June 15, 1989
    Date of Patent: January 14, 1992
    Assignee: Fujitsu Limited
    Inventor: Ryoichi Ohe