Patents by Inventor Ryoji Matsushima

Ryoji Matsushima has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20210366748
    Abstract: According to one embodiment, a mold includes a substrate clamping surface, a cavity, a suction part, a vent, an intermediate cavity, and an opening/closing part. The substrate clamping surface contacts a surface of a processing substrate. The cavity is recessed from the substrate clamping surface. The suction part is recessed from the substrate clamping surface. The vent is provided on a path between the cavity and the suction part, communicates with the cavity, is recessed from the substrate clamping surface to a vent depth. The intermediate cavity is provided between the vent and the suction part on the path, communicates with the vent, and is recessed from the substrate clamping surface to an intermediate cavity depth deeper than the vent depth. The opening/closing part opens and closes the path and is provided between the intermediate cavity and the suction part on the path.
    Type: Application
    Filed: August 6, 2021
    Publication date: November 25, 2021
    Applicant: Toshiba Memory Corporation
    Inventors: Takeori MAEDA, Ryoji MATSUSHIMA, Makoto KAWAGUCHI, Masaaki WAKUI
  • Patent number: 11114322
    Abstract: According to one embodiment, a mold includes a substrate clamping surface, a cavity, a suction part, a vent, an intermediate cavity, and an opening/closing part. The substrate clamping surface contacts a surface of a processing substrate. The cavity is recessed from the substrate clamping surface. The suction part is recessed from the substrate clamping surface. The vent is provided on a path between the cavity and the suction part, communicates with the cavity, is recessed from the substrate clamping surface to a vent depth. The intermediate cavity is provided between the vent and the suction part on the path, communicates with the vent, and is recessed from the substrate clamping surface to an intermediate cavity depth deeper than the vent depth. The opening/closing part opens and closes the path and is provided between the intermediate cavity and the suction part on the path.
    Type: Grant
    Filed: March 10, 2017
    Date of Patent: September 7, 2021
    Assignee: Toshiba Memory Corporation
    Inventors: Takeori Maeda, Ryoji Matsushima, Makoto Kawaguchi, Masaaki Wakui
  • Patent number: 10896825
    Abstract: A mold according to an embodiment includes a first surface to be in contact with a surface of a substrate to be processed. A cavity portion recedes in a first direction being away from the first surface. A vent portion recedes in the first direction and is closer to the first surface than the cavity portion. The vent portion communicates with the cavity portion and serves as a discharge path for gas in the cavity portion. A suction portion recedes in the first direction and is farther from the first surface than the vent portion. The suction portion communicates with the vent portion. A first opening/closing portion is provided between the vent portion and the suction portion, and opens and closes or narrows down the discharge path. A second opening/closing portion is provided between the first opening/closing portion and the suction portion, and opens and closes the discharge path.
    Type: Grant
    Filed: September 14, 2017
    Date of Patent: January 19, 2021
    Assignee: TOSHIBA MEMORY CORPORATION
    Inventors: Takeori Maeda, Ryoji Matsushima, Makoto Minaminaka, Naoki Iwamasa
  • Patent number: 10262879
    Abstract: According to one embodiment, a mold device includes a first mold. The first mold includes a substrate clamping surface, a cavity, a suction part, a vent, first and second intermediate cavities and an opening/closing part. The substrate clamping surface contacts a surface of a processing substrate. The cavity is recessed from the substrate clamping surface. The suction part is recessed from the substrate clamping surface. The vent is provided on a path between the cavity and the suction part, and is recessed from the substrate clamping surface to a vent depth. The first intermediate cavity is provided between the vent and the suction part, and is recessed from the substrate clamping surface. The second intermediate cavity is provided between the first intermediate cavity and the suction part, and is recessed from the substrate clamping surface to a second intermediate cavity depth. The opening/closing part opens and closes the path.
    Type: Grant
    Filed: January 24, 2017
    Date of Patent: April 16, 2019
    Assignee: Toshiba Memory Corporation
    Inventors: Takeori Maeda, Ryoji Matsushima
  • Publication number: 20180254198
    Abstract: A mold according to an embodiment includes a first surface to be in contact with a surface of a substrate to be processed. A cavity portion recedes in a first direction being away from the first surface. A vent portion recedes in the first direction and is closer to the first surface than the cavity portion. The vent portion communicates with the cavity portion and serves as a discharge path for gas in the cavity portion. A suction portion recedes in the first direction and is farther from the first surface than the vent portion. The suction portion communicates with the vent portion. A first opening/closing portion is provided between the vent portion and the suction portion, and opens and closes or narrows down the discharge path. A second opening/closing portion is provided between the first opening/closing portion and the suction portion, and opens and closes the discharge path.
    Type: Application
    Filed: September 14, 2017
    Publication date: September 6, 2018
    Applicant: TOSHIBA MEMORY CORPORATION
    Inventors: Takeori MAEDA, Ryoji MATSUSHIMA, Makoto MINAMINAKA, Naoki IWAMASA
  • Patent number: 9997484
    Abstract: A semiconductor device includes a wiring substrate, a first semiconductor element, a second semiconductor element, a bump, a bonding portion, and a resin portion. The second semiconductor element is between the wiring substrate and the first semiconductor element. The bump is between the first and second semiconductor elements and electrically connects the first and second semiconductor elements. The bonding portion is between the first and second semiconductor elements, bonds the first semiconductor element to the second semiconductor element, and has a first elastic modulus. The resin portion has a second elastic modulus higher than the first elastic modulus. The resin portion is between the first and second semiconductor elements. The first semiconductor element is between a second portion of the resin portion and the wiring substrate. A third portion of the resin portion is overlapped with the first and second semiconductor elements.
    Type: Grant
    Filed: August 30, 2016
    Date of Patent: June 12, 2018
    Assignee: TOSHIBA MEMORY CORPORATION
    Inventors: Takeori Maeda, Masatoshi Fukuda, Ryoji Matsushima, Hideo Aoki
  • Publication number: 20170271186
    Abstract: According to one embodiment, a mold includes a substrate clamping surface, a cavity, a suction part, a vent, an intermediate cavity, and an opening/closing part. The substrate clamping surface contacts a surface of a processing substrate. The cavity is recessed from the substrate clamping surface. The suction part is recessed from the substrate clamping surface. The vent is provided on a path between the cavity and the suction part, communicates with the cavity, is recessed from the substrate clamping surface to a vent depth. The intermediate cavity is provided between the vent and the suction part on the path, communicates with the vent, and is recessed from the substrate clamping surface to an intermediate cavity depth deeper than the vent depth. The opening/closing part opens and closes the path and is provided between the intermediate cavity and the suction part on the path.
    Type: Application
    Filed: March 10, 2017
    Publication date: September 21, 2017
    Applicant: KABUSHIKI KAISHA TOSHIBA
    Inventors: TAKEORI MAEDA, RYOJI MATSUSHIMA, MAKOTO KAWAGUCHI, MASAAKI WAKUI
  • Publication number: 20170263582
    Abstract: A semiconductor device includes a wiring substrate, a first semiconductor element, a second semiconductor element, a bump, a bonding portion, and a resin portion. The second semiconductor element is between the wiring substrate and the first semiconductor element. The bump is between the first and second semiconductor elements and electrically connects the first and second semiconductor elements. The bonding portion is between the first and second semiconductor elements, bonds the first semiconductor element to the second semiconductor element, and has a first elastic modulus. The resin portion has a second elastic modulus higher than the first elastic modulus. The resin portion is between the first and second semiconductor elements. The first semiconductor element is between a second portion of the resin portion and the wiring substrate. A third portion of the resin portion is overlapped with the first and second semiconductor elements.
    Type: Application
    Filed: August 30, 2016
    Publication date: September 14, 2017
    Inventors: Takeori MAEDA, Masatoshi FUKUDA, Ryoji MATSUSHIMA, Hideo AOKI
  • Publication number: 20170263476
    Abstract: According to one embodiment, a mold device includes a first mold. The first mold includes a substrate clamping surface, a cavity, a suction part, a vent, first and second intermediate cavities and an opening/closing part. The substrate clamping surface contacts a surface of a processing substrate. The cavity is recessed from the substrate clamping surface. The suction part is recessed from the substrate clamping surface. The vent is provided on a path between the cavity and the suction part, and is recessed from the substrate clamping surface to a vent depth. The first intermediate cavity is provided between the vent and the suction part, and is recessed from the substrate clamping surface. The second intermediate cavity is provided between the first intermediate cavity and the suction part, and is recessed from the substrate clamping surface to a second intermediate cavity depth. The opening/closing part opens and closes the path.
    Type: Application
    Filed: January 24, 2017
    Publication date: September 14, 2017
    Applicant: Kabushiki Kaisha Toshiba
    Inventors: Takeori Maeda, Ryoji Matsushima
  • Patent number: 8749031
    Abstract: According to one embodiment, a semiconductor device includes a semiconductor device body and an insulating adhesive layer. The semiconductor device body is formed with a square plate shape and has an element portion provided on a first major surface. The insulating adhesive layer is provided to cover a second major surface of the semiconductor device body and one or two of four side faces of the semiconductor device body.
    Type: Grant
    Filed: March 18, 2011
    Date of Patent: June 10, 2014
    Assignee: Kabushiki Kaisha Toshiba
    Inventor: Ryoji Matsushima
  • Patent number: 8603865
    Abstract: According to one embodiment, a semiconductor storage device includes an organic board provided with external connection terminals on one surface and formed as an individual piece into a plane shape substantially identical to that of an area where the external connection terminals are provided, a lead frame having a mounting area positioned relative to the organic board, and a semiconductor memory chip bonded to the mounting area.
    Type: Grant
    Filed: June 19, 2013
    Date of Patent: December 10, 2013
    Assignee: Kabushiki Kaisha Toshiba
    Inventor: Ryoji Matsushima
  • Publication number: 20130280862
    Abstract: According to one embodiment, a semiconductor storage device includes an organic board provided with external connection terminals on one surface and formed as an individual piece into a plane shape substantially identical to that of an area where the external connection terminals are provided, a lead frame having a mounting area positioned relative to the organic board, and a semiconductor memory chip bonded to the mounting area.
    Type: Application
    Filed: June 19, 2013
    Publication date: October 24, 2013
    Inventor: Ryoji MATSUSHIMA
  • Patent number: 8492885
    Abstract: According to one embodiment, a semiconductor storage device includes an organic board provided with external connection terminals on one surface and formed as an individual piece into a plane shape substantially identical to that of an area where the external connection terminals are provided, a lead frame having a mounting area positioned relative to the organic board, and a semiconductor memory chip bonded to the mounting area.
    Type: Grant
    Filed: August 30, 2012
    Date of Patent: July 23, 2013
    Assignee: Kabushiki Kaisha Toshiba
    Inventor: Ryoji Matsushima
  • Publication number: 20120319257
    Abstract: According to one embodiment, a semiconductor storage device includes an organic board provided with external connection terminals on one surface and formed as an individual piece into a plane shape substantially identical to that of an area where the external connection terminals are provided, a lead frame having a mounting area positioned relative to the organic board, and a semiconductor memory chip bonded to the mounting area.
    Type: Application
    Filed: August 30, 2012
    Publication date: December 20, 2012
    Applicant: KABUSHIKI KAISHA TOSHIBA
    Inventor: Ryoji MATSUSHIMA
  • Patent number: 8269325
    Abstract: According to one embodiment, a semiconductor storage device includes an organic board provided with external connection terminals on one surface and formed as an individual piece into a plane shape substantially identical to that of an area where the external connection terminals are provided, a lead frame having a mounting area positioned relative to the organic board, and a semiconductor memory chip bonded to the mounting area.
    Type: Grant
    Filed: February 15, 2011
    Date of Patent: September 18, 2012
    Assignee: Kabushiki Kaisha Toshiba
    Inventor: Ryoji Matsushima
  • Publication number: 20120049331
    Abstract: According to one embodiment, a semiconductor device includes a semiconductor device body and an insulating adhesive layer. The semiconductor device body is formed with a square plate shape and has an element portion provided on a first major surface. The insulating adhesive layer is provided to cover a second major surface of the semiconductor device body and one or two of four side faces of the semiconductor device body.
    Type: Application
    Filed: March 18, 2011
    Publication date: March 1, 2012
    Applicant: KABUSHIKI KAISHA TOSHIBA
    Inventor: Ryoji MATSUSHIMA
  • Publication number: 20110198740
    Abstract: According to one embodiment, a semiconductor storage device includes an organic board provided with external connection terminals on one surface and formed as an individual piece into a plane shape substantially identical to that of an area where the external connection terminals are provided, a lead frame having a mounting area positioned relative to the organic board, and a semiconductor memory chip bonded to the mounting area.
    Type: Application
    Filed: February 15, 2011
    Publication date: August 18, 2011
    Applicant: KABUSHIKI KAISHA TOSHIBA
    Inventor: Ryoji MATSUSHIMA
  • Patent number: 7968993
    Abstract: A stacked semiconductor device includes a first semiconductor element mounted on a wiring board and a second semiconductor element stacked on the first semiconductor element. Electrode pads of the first and second semiconductor elements are electrically connected to connection pads of the wiring board via first and second metal wires. The second metal wire is wired so that a part thereof is in contact with an insulating protective film covering a surface of the first semiconductor element.
    Type: Grant
    Filed: July 9, 2008
    Date of Patent: June 28, 2011
    Assignee: Kabushiki Kaisha Toshiba
    Inventors: Katsuhiro Ishida, Ryoji Matsushima
  • Patent number: 7911045
    Abstract: A semiconductor element is provided with electrode pads which are arranged on a front surface of an element main body, an insulating protection film which covers the front surface of the element main body excepting its outer peripheral area while exposing the electrode pads, and an insulating adhesive layer which is formed to cover a back surface, a sidewall surface and a corner between the front surface and the sidewall surface of the element main body. A plurality of semiconductor elements are stacked on a circuit substrate. The semiconductor elements are adhered via the insulating adhesive layer.
    Type: Grant
    Filed: August 14, 2008
    Date of Patent: March 22, 2011
    Assignee: Kabushiki Kaisha Toshiba
    Inventors: Ryoji Matsushima, Naohisa Okumura
  • Publication number: 20100255637
    Abstract: A stack-type semiconductor device according to the present invention includes a circuit board with bonding pads; a first semiconductor chip which includes first electrode pads and is mounted on the circuit board; a second semiconductor chip which includes second electrode pads and is mounted on the first semiconductor chip; a plurality of bonding wires sequentially connecting the bonding pads, the first electrodes and the second electrodes as a whole; and a sealing resin for sealing the first semiconductor chip, the second semiconductor chip and the bonding wires.
    Type: Application
    Filed: June 17, 2010
    Publication date: October 7, 2010
    Applicant: KABUSHIKI KAISHA TOSHIBA
    Inventors: Katsuhiro ISHIDA, Ryoji Matsushima