Patents by Inventor Ryoji Matsushima
Ryoji Matsushima has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11605548Abstract: According to one embodiment, a mold includes a substrate clamping surface, a cavity, a suction part, a vent, an intermediate cavity, and an opening/closing part. The substrate clamping surface contacts a surface of a processing substrate. The cavity is recessed from the substrate clamping surface. The suction part is recessed from the substrate clamping surface. The vent is provided on a path between the cavity and the suction part, communicates with the cavity, is recessed from the substrate clamping surface to a vent depth. The intermediate cavity is provided between the vent and the suction part on the path, communicates with the vent, and is recessed from the substrate clamping surface to an intermediate cavity depth deeper than the vent depth. The opening/closing part opens and closes the path and is provided between the intermediate cavity and the suction part on the path.Type: GrantFiled: August 6, 2021Date of Patent: March 14, 2023Assignee: Kioxia CorporationInventors: Takeori Maeda, Ryoji Matsushima, Makoto Kawaguchi, Masaaki Wakui
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Publication number: 20210366748Abstract: According to one embodiment, a mold includes a substrate clamping surface, a cavity, a suction part, a vent, an intermediate cavity, and an opening/closing part. The substrate clamping surface contacts a surface of a processing substrate. The cavity is recessed from the substrate clamping surface. The suction part is recessed from the substrate clamping surface. The vent is provided on a path between the cavity and the suction part, communicates with the cavity, is recessed from the substrate clamping surface to a vent depth. The intermediate cavity is provided between the vent and the suction part on the path, communicates with the vent, and is recessed from the substrate clamping surface to an intermediate cavity depth deeper than the vent depth. The opening/closing part opens and closes the path and is provided between the intermediate cavity and the suction part on the path.Type: ApplicationFiled: August 6, 2021Publication date: November 25, 2021Applicant: Toshiba Memory CorporationInventors: Takeori MAEDA, Ryoji MATSUSHIMA, Makoto KAWAGUCHI, Masaaki WAKUI
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Patent number: 11114322Abstract: According to one embodiment, a mold includes a substrate clamping surface, a cavity, a suction part, a vent, an intermediate cavity, and an opening/closing part. The substrate clamping surface contacts a surface of a processing substrate. The cavity is recessed from the substrate clamping surface. The suction part is recessed from the substrate clamping surface. The vent is provided on a path between the cavity and the suction part, communicates with the cavity, is recessed from the substrate clamping surface to a vent depth. The intermediate cavity is provided between the vent and the suction part on the path, communicates with the vent, and is recessed from the substrate clamping surface to an intermediate cavity depth deeper than the vent depth. The opening/closing part opens and closes the path and is provided between the intermediate cavity and the suction part on the path.Type: GrantFiled: March 10, 2017Date of Patent: September 7, 2021Assignee: Toshiba Memory CorporationInventors: Takeori Maeda, Ryoji Matsushima, Makoto Kawaguchi, Masaaki Wakui
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Patent number: 10896825Abstract: A mold according to an embodiment includes a first surface to be in contact with a surface of a substrate to be processed. A cavity portion recedes in a first direction being away from the first surface. A vent portion recedes in the first direction and is closer to the first surface than the cavity portion. The vent portion communicates with the cavity portion and serves as a discharge path for gas in the cavity portion. A suction portion recedes in the first direction and is farther from the first surface than the vent portion. The suction portion communicates with the vent portion. A first opening/closing portion is provided between the vent portion and the suction portion, and opens and closes or narrows down the discharge path. A second opening/closing portion is provided between the first opening/closing portion and the suction portion, and opens and closes the discharge path.Type: GrantFiled: September 14, 2017Date of Patent: January 19, 2021Assignee: TOSHIBA MEMORY CORPORATIONInventors: Takeori Maeda, Ryoji Matsushima, Makoto Minaminaka, Naoki Iwamasa
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Patent number: 10262879Abstract: According to one embodiment, a mold device includes a first mold. The first mold includes a substrate clamping surface, a cavity, a suction part, a vent, first and second intermediate cavities and an opening/closing part. The substrate clamping surface contacts a surface of a processing substrate. The cavity is recessed from the substrate clamping surface. The suction part is recessed from the substrate clamping surface. The vent is provided on a path between the cavity and the suction part, and is recessed from the substrate clamping surface to a vent depth. The first intermediate cavity is provided between the vent and the suction part, and is recessed from the substrate clamping surface. The second intermediate cavity is provided between the first intermediate cavity and the suction part, and is recessed from the substrate clamping surface to a second intermediate cavity depth. The opening/closing part opens and closes the path.Type: GrantFiled: January 24, 2017Date of Patent: April 16, 2019Assignee: Toshiba Memory CorporationInventors: Takeori Maeda, Ryoji Matsushima
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Publication number: 20180254198Abstract: A mold according to an embodiment includes a first surface to be in contact with a surface of a substrate to be processed. A cavity portion recedes in a first direction being away from the first surface. A vent portion recedes in the first direction and is closer to the first surface than the cavity portion. The vent portion communicates with the cavity portion and serves as a discharge path for gas in the cavity portion. A suction portion recedes in the first direction and is farther from the first surface than the vent portion. The suction portion communicates with the vent portion. A first opening/closing portion is provided between the vent portion and the suction portion, and opens and closes or narrows down the discharge path. A second opening/closing portion is provided between the first opening/closing portion and the suction portion, and opens and closes the discharge path.Type: ApplicationFiled: September 14, 2017Publication date: September 6, 2018Applicant: TOSHIBA MEMORY CORPORATIONInventors: Takeori MAEDA, Ryoji MATSUSHIMA, Makoto MINAMINAKA, Naoki IWAMASA
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Patent number: 9997484Abstract: A semiconductor device includes a wiring substrate, a first semiconductor element, a second semiconductor element, a bump, a bonding portion, and a resin portion. The second semiconductor element is between the wiring substrate and the first semiconductor element. The bump is between the first and second semiconductor elements and electrically connects the first and second semiconductor elements. The bonding portion is between the first and second semiconductor elements, bonds the first semiconductor element to the second semiconductor element, and has a first elastic modulus. The resin portion has a second elastic modulus higher than the first elastic modulus. The resin portion is between the first and second semiconductor elements. The first semiconductor element is between a second portion of the resin portion and the wiring substrate. A third portion of the resin portion is overlapped with the first and second semiconductor elements.Type: GrantFiled: August 30, 2016Date of Patent: June 12, 2018Assignee: TOSHIBA MEMORY CORPORATIONInventors: Takeori Maeda, Masatoshi Fukuda, Ryoji Matsushima, Hideo Aoki
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Publication number: 20170271186Abstract: According to one embodiment, a mold includes a substrate clamping surface, a cavity, a suction part, a vent, an intermediate cavity, and an opening/closing part. The substrate clamping surface contacts a surface of a processing substrate. The cavity is recessed from the substrate clamping surface. The suction part is recessed from the substrate clamping surface. The vent is provided on a path between the cavity and the suction part, communicates with the cavity, is recessed from the substrate clamping surface to a vent depth. The intermediate cavity is provided between the vent and the suction part on the path, communicates with the vent, and is recessed from the substrate clamping surface to an intermediate cavity depth deeper than the vent depth. The opening/closing part opens and closes the path and is provided between the intermediate cavity and the suction part on the path.Type: ApplicationFiled: March 10, 2017Publication date: September 21, 2017Applicant: KABUSHIKI KAISHA TOSHIBAInventors: TAKEORI MAEDA, RYOJI MATSUSHIMA, MAKOTO KAWAGUCHI, MASAAKI WAKUI
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Publication number: 20170263582Abstract: A semiconductor device includes a wiring substrate, a first semiconductor element, a second semiconductor element, a bump, a bonding portion, and a resin portion. The second semiconductor element is between the wiring substrate and the first semiconductor element. The bump is between the first and second semiconductor elements and electrically connects the first and second semiconductor elements. The bonding portion is between the first and second semiconductor elements, bonds the first semiconductor element to the second semiconductor element, and has a first elastic modulus. The resin portion has a second elastic modulus higher than the first elastic modulus. The resin portion is between the first and second semiconductor elements. The first semiconductor element is between a second portion of the resin portion and the wiring substrate. A third portion of the resin portion is overlapped with the first and second semiconductor elements.Type: ApplicationFiled: August 30, 2016Publication date: September 14, 2017Inventors: Takeori MAEDA, Masatoshi FUKUDA, Ryoji MATSUSHIMA, Hideo AOKI
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Publication number: 20170263476Abstract: According to one embodiment, a mold device includes a first mold. The first mold includes a substrate clamping surface, a cavity, a suction part, a vent, first and second intermediate cavities and an opening/closing part. The substrate clamping surface contacts a surface of a processing substrate. The cavity is recessed from the substrate clamping surface. The suction part is recessed from the substrate clamping surface. The vent is provided on a path between the cavity and the suction part, and is recessed from the substrate clamping surface to a vent depth. The first intermediate cavity is provided between the vent and the suction part, and is recessed from the substrate clamping surface. The second intermediate cavity is provided between the first intermediate cavity and the suction part, and is recessed from the substrate clamping surface to a second intermediate cavity depth. The opening/closing part opens and closes the path.Type: ApplicationFiled: January 24, 2017Publication date: September 14, 2017Applicant: Kabushiki Kaisha ToshibaInventors: Takeori Maeda, Ryoji Matsushima
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Patent number: 8749031Abstract: According to one embodiment, a semiconductor device includes a semiconductor device body and an insulating adhesive layer. The semiconductor device body is formed with a square plate shape and has an element portion provided on a first major surface. The insulating adhesive layer is provided to cover a second major surface of the semiconductor device body and one or two of four side faces of the semiconductor device body.Type: GrantFiled: March 18, 2011Date of Patent: June 10, 2014Assignee: Kabushiki Kaisha ToshibaInventor: Ryoji Matsushima
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Patent number: 8603865Abstract: According to one embodiment, a semiconductor storage device includes an organic board provided with external connection terminals on one surface and formed as an individual piece into a plane shape substantially identical to that of an area where the external connection terminals are provided, a lead frame having a mounting area positioned relative to the organic board, and a semiconductor memory chip bonded to the mounting area.Type: GrantFiled: June 19, 2013Date of Patent: December 10, 2013Assignee: Kabushiki Kaisha ToshibaInventor: Ryoji Matsushima
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Publication number: 20130280862Abstract: According to one embodiment, a semiconductor storage device includes an organic board provided with external connection terminals on one surface and formed as an individual piece into a plane shape substantially identical to that of an area where the external connection terminals are provided, a lead frame having a mounting area positioned relative to the organic board, and a semiconductor memory chip bonded to the mounting area.Type: ApplicationFiled: June 19, 2013Publication date: October 24, 2013Inventor: Ryoji MATSUSHIMA
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Patent number: 8492885Abstract: According to one embodiment, a semiconductor storage device includes an organic board provided with external connection terminals on one surface and formed as an individual piece into a plane shape substantially identical to that of an area where the external connection terminals are provided, a lead frame having a mounting area positioned relative to the organic board, and a semiconductor memory chip bonded to the mounting area.Type: GrantFiled: August 30, 2012Date of Patent: July 23, 2013Assignee: Kabushiki Kaisha ToshibaInventor: Ryoji Matsushima
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Publication number: 20120319257Abstract: According to one embodiment, a semiconductor storage device includes an organic board provided with external connection terminals on one surface and formed as an individual piece into a plane shape substantially identical to that of an area where the external connection terminals are provided, a lead frame having a mounting area positioned relative to the organic board, and a semiconductor memory chip bonded to the mounting area.Type: ApplicationFiled: August 30, 2012Publication date: December 20, 2012Applicant: KABUSHIKI KAISHA TOSHIBAInventor: Ryoji MATSUSHIMA
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Patent number: 8269325Abstract: According to one embodiment, a semiconductor storage device includes an organic board provided with external connection terminals on one surface and formed as an individual piece into a plane shape substantially identical to that of an area where the external connection terminals are provided, a lead frame having a mounting area positioned relative to the organic board, and a semiconductor memory chip bonded to the mounting area.Type: GrantFiled: February 15, 2011Date of Patent: September 18, 2012Assignee: Kabushiki Kaisha ToshibaInventor: Ryoji Matsushima
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Publication number: 20120049331Abstract: According to one embodiment, a semiconductor device includes a semiconductor device body and an insulating adhesive layer. The semiconductor device body is formed with a square plate shape and has an element portion provided on a first major surface. The insulating adhesive layer is provided to cover a second major surface of the semiconductor device body and one or two of four side faces of the semiconductor device body.Type: ApplicationFiled: March 18, 2011Publication date: March 1, 2012Applicant: KABUSHIKI KAISHA TOSHIBAInventor: Ryoji MATSUSHIMA
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Publication number: 20110198740Abstract: According to one embodiment, a semiconductor storage device includes an organic board provided with external connection terminals on one surface and formed as an individual piece into a plane shape substantially identical to that of an area where the external connection terminals are provided, a lead frame having a mounting area positioned relative to the organic board, and a semiconductor memory chip bonded to the mounting area.Type: ApplicationFiled: February 15, 2011Publication date: August 18, 2011Applicant: KABUSHIKI KAISHA TOSHIBAInventor: Ryoji MATSUSHIMA
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Patent number: 7968993Abstract: A stacked semiconductor device includes a first semiconductor element mounted on a wiring board and a second semiconductor element stacked on the first semiconductor element. Electrode pads of the first and second semiconductor elements are electrically connected to connection pads of the wiring board via first and second metal wires. The second metal wire is wired so that a part thereof is in contact with an insulating protective film covering a surface of the first semiconductor element.Type: GrantFiled: July 9, 2008Date of Patent: June 28, 2011Assignee: Kabushiki Kaisha ToshibaInventors: Katsuhiro Ishida, Ryoji Matsushima
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Patent number: 7911045Abstract: A semiconductor element is provided with electrode pads which are arranged on a front surface of an element main body, an insulating protection film which covers the front surface of the element main body excepting its outer peripheral area while exposing the electrode pads, and an insulating adhesive layer which is formed to cover a back surface, a sidewall surface and a corner between the front surface and the sidewall surface of the element main body. A plurality of semiconductor elements are stacked on a circuit substrate. The semiconductor elements are adhered via the insulating adhesive layer.Type: GrantFiled: August 14, 2008Date of Patent: March 22, 2011Assignee: Kabushiki Kaisha ToshibaInventors: Ryoji Matsushima, Naohisa Okumura