Abstract: This light-receiving element includes: a substrate; a photoelectric conversion layer that is provided on the substrate and includes a first compound semiconductor, and absorbs a wavelength in an infrared region to generate electric charges; a semiconductor layer that is provided on the photoelectric conversion layer and includes a second compound semiconductor, and has an opening in a selective region; and an electrode that buries the opening of the semiconductor layer and is electrically coupled to the photoelectric conversion layer.

Abstract: An engaging member, a female member and a tool changer that can be downsized are provided, and the engaging member is an engaging member including: an engaging surface that allows a cam provided in a male member to engage therewith; and a dispersing surface that transmits a force provided from the cam via the engaging surface, to a female member body, wherein the dispersing surface includes a first dispersing surface and a second dispersing surface perpendicular to each other, and a cross-sectional shape perpendicular to a longitudinal direction is formed in a substantially triangular shape by the dispersing surface and the engaging surface.

Abstract: To realize miniaturization of a pixel, reduction in noise, and high quantum efficiency, and to improve short-wavelength sensitivity while suppressing inter-pixel interference and variations for each pixel. According to the present disclosure, there is provided an imaging device including: a first semiconductor layer formed in a semiconductor substrate; a second semiconductor layer of a conductivity type opposite to a conductivity type of the first semiconductor layer formed on the first semiconductor layer; a pixel separation unit which defines a pixel region including the first semiconductor layer and the second semiconductor layer; a first electrode which is connected to the first semiconductor layer from one surface side of the semiconductor substrate; and a second electrode which is connected to the second semiconductor layer from a light irradiation surface side that is the other surface of the semiconductor substrate, and is formed to correspond to a position of the pixel separation unit.

Abstract: A male member and tool changer for downsizing and preventing damage to proximity sensors; a male member includes a cam adapted to pivot between an engagement position at which the cam engages with a lock pin of a female member and a disengagement position at which the cam moves out of the engagement, and a cylinder unit adapted to pivot the cam between the engagement position and the disengagement position. A first proximity sensor and the second proximity sensor are assembled onto a cylinder sidewall of the cylinder unit and first and second detection surfaces of the proximity sensors are revealed in a cylinder chamber. The first detection surface is placed at a position facing on a piston when the cam is located at the disengagement position and the second detection surface is placed at a position facing on the piston when the cam is located at the engagement position.

Abstract: Provided are a tool exchange device and a tool exchange system that enable management of a coupling state according to a tool to be fixed. A tool exchange device including a male member to be detachably attached to an apparatus side and a female member to be detachably attached to a tool side includes: a proximity sensor provided in the male member; and a target provided in the female member, the target corresponding to the proximity sensor, and the target is provided in the female member in such a manner that a distance between the target and the proximity sensor in a state in which the male member and the female member are coupled together is adjustable.

Abstract: The present disclosure relates to a solid state image sensor, a fabrication method, and an electronic apparatus, which enable to efficiently provide trench structures, which surrounds respective pixel sections of the solid state image sensor, and through-electrodes side by side. A solid state image sensor according to a first aspect of the present disclosure includes photoelectric conversion sections formed in respective pixel sections of a semiconductor substrate, trench structures defined by walls of insulating films formed in a depth direction of the semiconductor substrate and surrounding the respective pixel sections, and through-electrodes formed through the semiconductor substrate at positions overlapping the respective trench structures. The present disclosure can be applied, for example, to back-side illumination CMOS image sensors.

Abstract: A photoelectric conversion element includes: a first compound semiconductor layer 31 made of a first compound semiconductor material having a first conductivity type; a photoelectric conversion layer 34 formed on the first compound semiconductor layer 31; a second compound semiconductor layer 32 covering the photoelectric conversion layer 34 and made of a second compound semiconductor material having the first conductivity type; a second conductivity type region 35 formed at least in a part of the second compound semiconductor layer 32, having a second conductivity type different from the first conductivity type, and reaching the photoelectric conversion layer; an element isolation layer 34 surrounding a lateral surface of the photoelectric conversion layer; a first electrode 51 formed on the second conductivity type region; and a second electrode 52 electrically connected to the first compound semiconductor layer 31.

Abstract: The present disclosure relates to a solid-state image sensor and an electronic device enabling prevention of entrance of incident light from adjacent pixels and suppression of color mixture, decrease in resolution, and decrease in sensitivity. In a solid-state image sensor according to one aspect of the present disclosure, each pixel includes: these different photoelectric conversion parts configured to perform photoelectric conversion of light of a first wavelength of light of a second wavelength and a third wavelength respectively. An electrode wiring provided at a boundary of adjacent pixels, horizontally connects an electrode of at least one of the photoelectric conversion parts in one of the adjacent pixels with an electrode of the corresponding one of the photoelectric conversion parts in another of the adjacent pixels and vertically connects with an electrode of at least one of the photoelectric conversion parts of each of the pixels.

Abstract: This light-receiving element includes: a substrate; a photoelectric conversion layer that is provided on the substrate and includes a first compound semiconductor, and absorbs a wavelength in an infrared region to generate electric charges; a semiconductor layer that is provided on the photoelectric conversion layer and includes a second compound semiconductor, and has an opening in a selective region; and an electrode that buries the opening of the semiconductor layer and is electrically coupled to the photoelectric conversion layer.

Abstract: The present technology relates to a solid-state image sensing device and an electronic device capable of reducing noises. The solid-state image sensing device includes: a photoelectric conversion unit; a charge holding unit for holding charges transferred from the photoelectric conversion unit; a first transfer transistor for transferring charges from the photoelectric conversion unit to the charge holding unit; and a light blocking part including a first light blocking part and a second light blocking part, in which the first light blocking part is arranged between a second surface opposite to a first surface as a light receiving surface of the photoelectric conversion unit and the charge holding unit, and covers the second surface, and is formed with a first opening, and the second light blocking part surrounds the side surface of the photoelectric conversion unit. The present technology is applicable to solid-state image sensing devices of backside irradiation type, for example.

Abstract: An engaging member, a female member and a tool changer that can be downsized are provided, and the engaging member is an engaging member including: an engaging surface that allows a cam provided in a male member to engage therewith; and a dispersing surface that transmits a force provided from the cam via the engaging surface, to a female member body, wherein the dispersing surface includes a first dispersing surface and a second dispersing surface perpendicular to each other, and a cross-sectional shape perpendicular to a longitudinal direction is formed in a substantially triangular shape by the dispersing surface and the engaging surface.

Abstract: The present disclosure relates to a solid-state image sensor and an electronic device enabling prevention of entrance of incident light from adjacent pixels and suppression of color mixture, decrease in resolution, and decrease in sensitivity. In a solid-state image sensor according to one aspect of the present disclosure, each pixel includes: these different photoelectric conversion parts configured to perform photoelectric conversion of light of a first wavelength of light of a second wavelength and a third wavelength respectively. An electrode wiring provided at a boundary of adjacent pixels, horizontally connects an electrode of at least one of the photoelectric conversion parts in one of the adjacent pixels with an electrode of the corresponding one of the photoelectric conversion parts in another of the adjacent pixels and vertically connects with an electrode of at least one of the photoelectric conversion parts of each of the pixels.

Abstract: A connector apparatus which can keep an electrical connection between signal pins in good condition; when a male member and female member are coupled together, first bumps of a first contact portion and second bumps of a second contact portion are brought into contact with each other, electrically connecting the first signal pins and second signal pins with each other. Measures are taken to bring tops and ridge lines of the second bumps into contact with lateral faces of the first bumps. Also, the first signal pins and second signal pins are configured to be pivotable. During connection, contact area is increased by contact between the lateral faces of the first bumps and the tops and ridge lines of the second bumps, causing rubbing between the lateral faces and the tops and ridge lines, and thereby pushing aside and rubbing off sticking spatter, oxide films, contamination, and the like.

Abstract: A connector apparatus which can keep an electrical connection between signal pins in good condition; when a male member and female member are coupled together, first bumps of a first contact portion and second bumps of a second contact portion are brought into contact with each other, electrically connecting the first signal pins wand second signal pins with each other. Measures are taken to bring tops and ridge lines of the second bumps into contact with lateral faces of the first bumps. Also, the first signal pins and second signal pins are configured to be pivotable. During connection, contact area is increased by contact between the lateral faces of the first bumps and the tops and ridge lines of the second bumps, causing rubbing between the lateral faces and the tops and ridge lines, and thereby pushing aside and rubbing off sticking spatter, oxide films, contamination, and the like.

Abstract: A male member and tool changer for downsizing and preventing damage to proximity sensors; a male member includes a cam adapted to pivot between an engagement position at which the cam engages with a lock pin of a female member and a disengagement position at which the cam moves out of the engagement, and a cylinder unit adapted to pivot the cam between the engagement position and the disengagement position. A first proximity sensor and the second proximity sensor are assembled onto a cylinder sidewall of the cylinder unit and first and second detection surfaces of the proximity sensors are revealed in a cylinder chamber. The first detection surface is placed at a position facing on a piston when the cam is located at the disengagement position and the second detection surface is placed at a position facing on the piston when the cam is located at the engagement position.

Abstract: A water replenishing device is disclosed which makes it possible to supply the necessary volume of water in response to a decrease in the processing solution in the processing tank due to evaporation. A water supply guide member is attached to an upper part of a processing solution tank. A discharge opening is formed at one end of the water supply guide member. Water supplied from a water replenishing pipe is fed to the water supply guide member and then it is supplied into the processing solution tank. When the processing solution level in the processing solution tank reaches an overflow opening, the excess water supplied to the water supply guide member is discharged outside the processing solution tank through the discharge opening.