Abstract: There are provided an automatic analyzing device and a reagent management method in the automatic analyzing device capable of managing a remaining amount of a consumable reagent with higher accuracy than in the related art.

Abstract: An electronic apparatus includes: a heating element; and a plurality of heat pipes that is thermally connected to the heating element. Each of the heat pipes has a cross section having a rectangular shape, a heat receiving surface thermally connected to the heating element, and a side surface orthogonal to the heat receiving surface. The side surfaces of the heat pipes, which are adjacent to each other, are in surface contact with each other.

Abstract: Provided is an antenna device including an antenna array including a plurality of patch antennas arrayed in a grid, a first switch group including a first switch disposed on a wiring line connecting two adjacent patch antennas, and a second switch group including a second switch disposed on a wiring line between an antenna assembly formed by at least four adjacent patch antennas and a signal source connected to at least one patch antenna constituting the antenna assembly.

Abstract: A robot welding system that performs friction stir welding of a workpiece includes: a multijoint robot; a pivot member provided at a leading end of an arm of the multijoint robot; and a control apparatus that controls an operation of the multijoint robot and an operation of the pivot member. The control apparatus includes: an estimator configuring to use the arm of the multijoint robot to estimate a flexure direction of the multijoint robot in a case the pivot member is pushed against the workpiece; and a setter configuring to set, based on the flexure direction, a rotational direction of the pivot member so that a friction force generated by the pivot member being in contact with the workpiece is generated in an opposite direction of the flexure direction.

Abstract: A heat dissipation structure, for a heat-generating electric component, includes: a heat dissipator disposed along a surface of the electric component; and a porous material held between the electric component and the heat dissipator. The porous material of the heat dissipation structure is impregnated with heat-transfer fluid. The heat-transfer fluid may include liquid metal.

Abstract: The present technology relates to a light receiving device that includes a pixel array unit in which pixels each having a first tap detecting charge photoelectrically converted by a photoelectric conversion unit and a second tap detecting charge photoelectrically converted by the photoelectric conversion unit are two-dimensionally arranged in a matrix. In the pixel array unit, four vertical signal lines for outputting a detection signal detected by any one of the first tap and the second tap to the outside of the pixel array unit are arranged for one pixel column.

Abstract: In a vehicle seat, a side frame of a seat back frame has a front wall that is formed so as to be bent inward continuously from a front edge of a plate-shaped portion and forms a curved region extending vertically from around the rotating shaft and reaching an upper frame, and a rear wall that is formed so as to be bent inward continuously from a rear edge of the plate-shaped portion and forms a curved region extending vertically from around the rotating shaft and reaching the upper frame, and an inner edge of the front wall has a projecting piece that spreads to the inside from a virtual outline corresponding to a shape of the upper frame and is superimposed on the front wall of the upper frame from the rear. This provides a vehicle seat that can contribute to improvement of the work efficiency when assembling a seat back frame.

Abstract: A media processing apparatus includes a slit insertable a sheet bundle of multiple sheets, a sheet-bundle holder, a liquid applier, a press binder, and a controller. The sheet-bundle holder holds the sheet bundle and detects the thickness of the sheet bundle. The liquid applier applies liquid to the sheet bundle. The press binder presses and binds the sheet bundle to perform press-binding process. The controller causes the sheet-bundle holder to hold the sheet bundle and detect the thickness of the sheet bundle, determines whether to cause the liquid applier to apply liquid to the sheet bundle based on the thickness of the sheet bundle, causes the liquid applier to apply the liquid to the sheet bundle when it is determined that the thickness of the sheet bundle is equal or larger than a prescribed thickness, and causes the press binder to press and bind the sheet bundle.

Abstract: A multilayer inductor includes an element body that constitutes a magnetic body by stacking magnetic layers containing iron powder and that has a coil obtained by winding a coil conductor inside the magnetic body, and an outer electrode that is electrically connected to the coil conductor. A resin is provided in voids inside the magnetic body, and the resin is provided in at least a part of pores in the coil conductor at least in a vicinity of a magnetic layer.

Abstract: An electronic apparatus includes: a chassis; a heat generation element provided in the chassis; a heat transfer member in contact with the heat generation element in a heat-transferable manner; and one or a plurality of heat dissipation mechanisms configured to cool the heat transfer member. The heat dissipation mechanism includes a first cooling device configured to cool a first main surface of the heat transfer member, and a second cooling device configured to cool a second main surface of the heat transfer member opposite to the first main surface. The first cooling device includes a first heat dissipation plate in contact with the first main surface in a heat-transferable manner, and a first blower mechanism configured to blow a gas to come into contact with the first heat dissipation plate.

Abstract: A heat radiation structure includes a metal mesh brought into contact with the surface of a die, and a heat receiving plate configured to sandwich the mesh between the surface of the die and the heat receiving plate. The mesh is impregnated with a liquid metal at least at a portion brought into contact with the surface of the die and has a shape in which intersection points of vertical and horizontal element wires are crushed in a thickness direction of the mesh. The mesh has a flat portion formed on the surface side of the element wire at each intersection point.

Abstract: The present technology relates to a light-receiving element and a distance-measuring module for enabling improvement of characteristics. A light-receiving element includes an on-chip lens, a wiring layer, and a semiconductor layer arranged between the on-chip lens and the wiring layer, the semiconductor layer includes a first voltage application portion to which a first voltage is applied, a second voltage application portion to which a second voltage different from the first voltage is applied, a first charge detection portion arranged around the first voltage application portion, and a second charge detection portion arranged around the second voltage application portion, and the wiring layer includes at least one ground line having a wider line width than a power supply line. The present technology can be applied to, for example, a light-receiving element that generates distance information by a ToF method.

Abstract: The present technology relates to a light-receiving element and a distance-measuring module for enabling improvement of characteristics. A light-receiving element includes an on-chip lens, a wiring layer, and a semiconductor layer arranged between the on-chip lens and the wiring layer, the semiconductor layer includes a first voltage application portion to which a first voltage is applied, a second voltage application portion to which a second voltage different from the first voltage is applied, a first charge detection portion arranged near the first voltage application portion, and a second charge detection portion arranged near the second voltage application portion, and each of the first voltage application portion and the second voltage application portion is covered with an insulating film in the semiconductor layer. The present technology can be applied to, for example, a light-receiving element that generates distance information by a ToF method.

Abstract: The present technology relates to a light receiving device and a distance measuring module capable of improving sensitivity. A light receiving device includes a pixel array unit in which pixels each having a first tap detecting charge photoelectrically converted by a photoelectric conversion unit and a second tap detecting charge photoelectrically converted by the photoelectric conversion unit are two-dimensionally arranged in a matrix. The first tap and the second tap each have a voltage application unit that applies a voltage, the pixel array unit has a groove portion formed by digging from a light incident surface side of a substrate to a predetermined depth, and the groove portion is arranged so as to overlap at least a part of the voltage application unit in plan view. The present technology can be applied to a distance measuring sensor or the like of the indirect ToF scheme, for example.

Abstract: The present invention provides a solid-state imaging apparatus in which pixels are arranged in an array. Each the plurality of pixels includes: a pixel separator that defines an outer edge shape of the pixel and is formed between the adjacent pixels; a photoelectric converter that generates an amount of charge corresponding to light incident from the outside; a plurality of transistors, including a transfer transistor formed at one end of the photoelectric converter to transfer the charge generated by the photoelectric converter; a floating diffusion region formed around the photoelectric converter to temporarily store the charges generated and transferred by the photoelectric converter; and a shielding portion formed around the photoelectric converter to block light leaking from the photoelectric converter and directed toward the floating diffusion region.

Abstract: The automatic analyzer includes a first storage device that stores sample information including a measurement result of a reaction solution for each sample and a second storage device that stores the sample information on at least a part of the samples among the sample information stored in the first storage device, in which when the automatic analyzer reaches a predetermined operation state, the control device performs a backup process of backing up the sample information on the samples satisfying a predetermined backup condition from the first storage device to the second storage device, and deleting the sample information on the backed up samples from the first storage device.

Abstract: A heat dissipation structure, of a semiconductor chip that includes a substrate and a die provided on a top surface of the substrate, includes: a heat dissipator provided along a surface of the die; a liquid metal interposed between the die and the heat dissipator; and a thermal putty interposed between the substrate and the heat dissipator in a state of sealing therebetween and surrounding the die.

Abstract: A photodetector of the disclosure includes: first and second light-receiving pixels arranged side by side in a first direction; first and second signal lines extending in a second direction and coupled to the first light-receiving pixel; third and fourth signal lines extending in the second direction and coupled to the second light-receiving pixel; a first control line coupled to the first light-receiving pixel and a second control line coupled to the second light-receiving pixel and extending in the first direction; and a first control circuit. Gates of first and second control transistors in the first and second light-receiving pixels are respectively coupled to the first and second control lines. First and second output circuits in the first light-receiving pixel are respectively coupled to the first and second signal lines. First and second output circuits in the second light-receiving pixel are respectively coupled to the third and fourth signal lines.

Abstract: An electronic apparatus includes a chassis, a heat generating body provided in the chassis, an antenna configured to be provided in the chassis and be capable of receiving radio waves, an electronic part arranged to be aligned with the antenna within the chassis, and a cooling module configured to have a plate-shaped metal part and cool the heat generating body within the chassis. The metal part includes a shield wall interposed between the antenna and the electronic part.

Abstract: A heat radiation structure includes a mesh that abuts on a surface of a die, and a vapor chamber that interposes the mesh between the surface of the die and the vapor chamber. The mesh includes a heat generation element abutting range portion that is provided at a central portion of the mesh, is impregnated with a liquid metal, and abuts on the surface of the die to receive heat, and a pair of heat generation element non-abutting range portions that continuously extends from both sides of the heat generation element abutting range portion and does not abut on the surface of the die. Each of the pair of heat generation element non-abutting range portions is fixed to the vapor chamber via a sheet material. Each of a pair of the heat generation element non-abutting range portions is interposed between a pair of the sheet materials.